Charles Drummond Ellis

King's College London, London, UK 
nuclear physics
"Charles Drummond Ellis"
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Ellis CD, Hamilton MC, Nakamura JR, et al. (2014) Efficient determination of copper electroplating chemistry additives Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1380-1390
Gess J, Bhavnani S, Ramakrishnan B, et al. (2014) Investigation and characterization of a high performance, small form factor, modular liquid immersion cooled server model Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 8-16
Xu P, Pfeiffenberger AH, Ellis CD, et al. (2014) Fabrication and characterization of double helix structures for compliant and reworkable electrical interconnects Journal of Microelectromechanical Systems. 23: 1219-1227
Gess J, Bhavnani S, Ramakrishnan B, et al. (2014) Impact of surface enhancements upon boiling heat transfer in a liquid immersion cooled high performance small form factor server model Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 435-443
Xu P, Hernandez GA, Wang S, et al. (2014) Flip chip based on compliant double helix interconnect for high frequency applications Proceedings - Electronic Components and Technology Conference. 1086-1090
Hernandez GA, Martinez D, Patenaude S, et al. (2013) Through Si vias using liquid metal conductors for re-workable 3D electronics International Conference and Exhibition On Device Packaging 2013. 696-703
England TD, Diestelhorst RM, Kenyon EW, et al. (2012) A new approach to designing electronic systems for operation in extreme environments: Part II-The SiGe remote electronics unit Ieee Aerospace and Electronic Systems Magazine. 27: 29-41
Thiagarajan N, Kapsenberg F, Narayanan V, et al. (2012) Development of a heat sink with periodic asymmetric structures using grayscale lithography and deep reactive ion etching Ieee Electron Device Letters. 33: 1054-1056
Bailey J, Pfeiffenberger A, Ellis C, et al. (2012) Thin-film signal and power redistribution layers based on AL-X and Cu Proceedings - 2012 45th International Symposium On Microelectronics, Imaps 2012. 326-333
Harris D, Dean R, Palkar A, et al. (2012) Low-temperature indium bonding for MEMS devices Imaps International Conference and Exhibition On Device Packaging, Dpc 2012 - in Conjunction With the Global Business Council, Gbc 2012 Spring Conference. 406-411+2543-2566
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