Rajendra K. Bordia

Affiliations: 
University of Washington, Seattle, Seattle, WA 
Area:
Materials Science Engineering, Inorganic Chemistry, Condensed Matter Physics
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"Rajendra Bordia"
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Publications

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Bawane K, Lu K, Li Q, et al. (2020) High temperature oxidation behaviors of SiON coated AISI 441 in Ar + O2, Ar+H2O, and Ar + CO2 atmospheres Corrosion Science. 166: 108429
Gangadhar J, Maheshwari A, Bordia RK, et al. (2020) Role of carbon on the thermal and electrical properties of graphene- enriched silicon oxycarbides Ceramics International
Hong Y, Chen Z, Lei J, et al. (2020) Direct inkjet printing of mullite nano-ribbons from the sol–gel precursor Journal of Sol-Gel Science and Technology. 95: 66-76
Barroso G, Li Q, Bordia RK, et al. (2019) Polymeric and ceramic silicon-based coatings – a review Journal of Materials Chemistry A. 7: 1936-1963
Wang K, Bordia RK, Brush LN. (2019) A semi-empirical power-law model for the dip-coating of a substrate into a particle-containing, non-Newtonian, complex fluid system Ceramics International. 45: 6655-6664
Torresani E, Giuntini D, Zhu C, et al. (2019) Anisotropy of Mass Transfer During Sintering of Powder Materials with Pore–Particle Structure Orientation Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science. 50: 1033-1049
Wang K, Zhang F, Bordia RK. (2018) FEM Modeling of In-Plane Stress Distribution in Thick Brittle Coatings/Films on Ductile Substrates Subjected to Tensile Stress to Determine Interfacial Strength. Materials (Basel, Switzerland). 11
Shang H, Olevsky EA, Bordia RK. (2018) Stress‐induced anisotropy during sintering of hierarchical porosity ceramics Journal of the American Ceramic Society. 102: 768-777
Giuntini D, Bordia RK, Olevsky EA. (2018) Feasibility of in situ de‐agglomeration during powder consolidation Journal of the American Ceramic Society. 102: 628-643
Lichtner A, Roussel D, Röhrens D, et al. (2018) Anisotropic sintering behavior of freeze-cast ceramics by optical dilatometry and discrete-element simulations Acta Materialia. 155: 343-349
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