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Binay K. Singh, Ph.D.

Affiliations: 
2009 Rensselaer Polytechnic Institute, Troy, NY, United States 
Area:
Chemical Engineering, Materials Science Engineering, Electronics and Electrical Engineering
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G Ramanath grad student 2009 RPI
 (Development of barrierless dielectrics and their integration with copper for nanodevice wiring.)

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Publications

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Mehta RJ, Zhang Y, Karthik C, et al. (2012) A new class of doped nanobulk high-figure-of-merit thermoelectrics by scalable bottom-up assembly. Nature Materials. 11: 233-40
Singh B, Garg S, Jain A, et al. (2011) Effects of molecular functionalization sequence on mesoporous silica film properties Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena. 29: 010602
Jain A, Singh B, Garg S, et al. (2011) Atomistic fracture energy partitioning at a metal-ceramic interface using a nanomolecular monolayer Physical Review B - Condensed Matter and Materials Physics. 83
Purkayastha A, Jain A, Hapenciuc C, et al. (2011) Synthesis and thermoelectric properties of thin film assemblies of bismuth telluride nanopolyhedra Chemistry of Materials. 23: 3029-3031
Mehta RJ, Karthik C, Jiang W, et al. (2010) High electrical conductivity antimony selenide nanocrystals and assemblies. Nano Letters. 10: 4417-22
Mehta RJ, Karthik C, Singh B, et al. (2010) Seebeck tuning in chalcogenide nanoplate assemblies by nanoscale heterostructuring. Acs Nano. 4: 5055-60
Singh B, Garg S, Rathore J, et al. (2010) Ring-opening-induced toughening of a low-permittivity polymer-metal interface. Acs Applied Materials & Interfaces. 2: 1275-80
Garg S, Jain A, Karthik C, et al. (2010) Metal-dielectric interface toughening by molecular nanolayer decomposition Journal of Applied Physics. 108
Garg S, Singh B, Teki R, et al. (2010) Hydrophobic fluoroalkylsilane nanolayers for inhibiting copper diffusion into silica Applied Physics Letters. 96
Garg S, Singh B, Liu X, et al. (2010) Metal-dielectric interface toughening by catalyzed ring opening in a monolayer Journal of Physical Chemistry Letters. 1: 336-340
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