William Robert Davis
Affiliations: | 1957- | Physics | North Carolina State University, Raleigh, NC |
Area:
mathematical physicsWebsite:
https://physics.sciences.ncsu.edu/people/wmrdavis/Google:
"William Robert Davis"Bio:
https://www.gf.org/fellows/all-fellows/william-r-davis/
Dissertation Hannover, 1956: "Kritik einheitlicher Feldtheorien: Beiträge zum allgemeinen Formalismus, eine Interpretationsmöglichkeit und einige Quantisierungsprobleme"
Mean distance: 11.21 | S | N | B | C | P |
Parents
Sign in to add mentorGerd Burkhardt | grad student | 1956 | Technical University of Hannover | |
(Kritik einheitlicher Feldtheorien: Beiträge zum allgemeinen Formalismus, eine Interpretationsmöglichkeit und einige Quantisierungsprobleme) | ||||
Cornelius Lanczos | research scientist | 1971 | Dublin Institute for Advanced Studies | |
(William R. Davis went to Dublin to work with and visit Lanczos for about two months while on a John Simon Guggenheim fellowship during the spring of 1971) |
Children
Sign in to add traineeMarvin K. Moss | grad student | 1962 | NCSU |
James Wesley York | grad student | 1966 | NCSU |
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Publications
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Park JB, Davis WR, Franzon PD. (2019) 3-D-DATE: A Circuit-Level Three-Dimensional DRAM Area, Timing, and Energy Model Ieee Transactions On Circuits and Systems I: Regular Papers. 66: 756-768 |
Chen X, Zhu T, Davis WR, et al. (2014) Adaptive and reliable clock distribution design for 3-D integrated circuits Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1862-1870 |
Harris TR, Priyadarshi S, Melamed S, et al. (2012) A transient electrothermal analysis of three-dimensional integrated circuits Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 660-667 |
Priyadarshi S, Saunders CS, Kriplani NM, et al. (2012) Parallel transient simulation of multiphysics circuits using delay-based partitioning Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 31: 1522-1535 |
Melamed S, Thorolfsson T, Harris TR, et al. (2012) Junction-level thermal analysis of 3-d integrated circuits using high definition power blurring Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 31: 676-689 |
Priyadarshi S, Harris TR, Melamed S, et al. (2012) Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels Iet Circuits, Devices and Systems. 6: 35-44 |
Chen X, Zhu T, Davis WR. (2011) Three-dimensional SRAM design with on-chip access time measurement Electronics Letters. 47: 485-486 |
Davis WR, Oh EC, Sule AM, et al. (2009) Application exploration for 3-D integrated circuits: TCAM, FIFO, and FFT case studies Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 17: 496-506 |