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Asli B. Ucok, Ph.D. - Publications

Affiliations: 
2006 University of Michigan, Ann Arbor, Ann Arbor, MI 
Area:
micromachining technologies, micromachined sensors, actuators, and MEMS; analog integrated circuits; implantable biomedical microsystems; micropackaging; and low-power wireless sensing/actuating systems
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2 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2005 Ucok AB, Giachino JM, Najafi K. Modular assembly/packaging of multi-substrate microsystems (WIMS CUBE) using thermo-magnetically actuated cables Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 536-539.  0.48
2003 Ucok AB, Giachino JM, Najafi K. A high-density flexible connector array for multi-substrate packages American Society of Mechanical Engineers, Micro-Electromechanical Systems Division Publication (Mems). 5: 149-155.  0.508
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