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Navdeep S. Dhillon, Ph.D. - Publications

Affiliations: 
2012 Mechanical Engineering University of California, Berkeley, Berkeley, CA, United States 
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6 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2015 Dhillon NS, Buongiorno J, Varanasi KK. Critical heat flux maxima during boiling crisis on textured surfaces. Nature Communications. 6: 8247. PMID 26346098 DOI: 10.1038/Ncomms9247  0.509
2011 Dhillon NS, Cheng JC, Pisano AP. Heat transfer due to microscale thin film evaporation from the steady state meniscus in a coherent porous silicon based micro-columnated wicking structure Asme 2011 International Mechanical Engineering Congress and Exposition, Imece 2011. 10: 667-677.  0.643
2011 Dhillon NS, Cheng JC, Pisano AP. Minimizing the wick thickness in a planar microscale loop heat pipe using efficient thermodynamic design Asme 2011 International Mechanical Engineering Congress and Exposition, Imece 2011. 6: 1121-1129.  0.638
2011 Dhillon NS, Cheng JC, Pisano AP. Device packaging techniques for implementing a novel thermal flux method for fluid degassing and charging of a planar microscale loop heat pipe Asme 2011 International Mechanical Engineering Congress and Exposition, Imece 2011. 11: 963-971.  0.622
2011 Dhillon NS, Hogue C, Chan MW, Cheng JC, Pisano AP. Integrating coherent porous silicon as a wicking structure in the MEMS based fabrication of a vertically wicking micro-columnated loop heat pipe Asme 2011 International Mechanical Engineering Congress and Exposition, Imece 2011. 11: 297-306.  0.565
2009 Dhillon NS, Pisano AP, Hogue C, Hopcroft MA. MLHP - A high heat flux localized cooling technology for electronic substrates Asme International Mechanical Engineering Congress and Exposition, Proceedings. 13: 621-630. DOI: 10.1115/IMECE2008-66993  0.603
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