Year |
Citation |
Score |
2013 |
Myers DR, Chan MW, Vigevani G, Sosnowchik BD, Azevedo RG, Jog AV, Lin L, Pisano AP. Torque measurements of an automotive halfshaft using micro double-ended tuning fork strain gauges Sensors and Actuators, a: Physical. 204: 79-87. DOI: 10.1016/J.Sna.2013.09.024 |
0.696 |
|
2012 |
Sosnowchik BD, Azevedo RG, Myers DR, Chan MW, Pisano AP, Lin L. Rapid silicon-to-steel bonding by induction heating for MEMS strain sensors Journal of Microelectromechanical Systems. 21: 497-506. DOI: 10.1109/Jmems.2011.2179013 |
0.742 |
|
2011 |
Wodin-Schwartz S, Chan MW, Mansukhani KR, Pisano AP, Senesky DG. MEMS sensors for down-hole monitoring of geothermal energy systems Asme 2011 5th International Conference On Energy Sustainability, Es 2011. 965-972. DOI: 10.1115/ES2011-54699 |
0.666 |
|
2011 |
Goericke FT, Chan MW, Vigevani G, Izyumin I, Boser BE, Pisano AP. High temperature compatible aluminum nitride resonating strain sensor 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, Transducers'11. 1994-1997. DOI: 10.1109/TRANSDUCERS.2011.5969198 |
0.714 |
|
2011 |
Chan MW, Myers DR, Sosnowchik BD, Lin L, Pisano AP. Localized strain sensing using high spatial resolution, highly-sensitive MEMS resonant strain gauges for failure prevention 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, Transducers'11. 2859-2862. DOI: 10.1109/TRANSDUCERS.2011.5969185 |
0.541 |
|
2011 |
Dhillon NS, Hogue C, Chan MW, Cheng JC, Pisano AP. Integrating coherent porous silicon as a wicking structure in the MEMS based fabrication of a vertically wicking micro-columnated loop heat pipe Asme 2011 International Mechanical Engineering Congress and Exposition, Imece 2011. 11: 297-306. |
0.709 |
|
2009 |
Chan MW, McCoy CD, Wodin-Schwartz S, Warren CG, Vijayaraghavan A. MEMS kinematic clamp for repeatable precision alignment Proceedings of the 24th Annual Meeting of the American Society For Precision Engineering, Aspe 2009. |
0.601 |
|
2007 |
Jones DG, Azevedo RG, Chan MW, Pisano AP, Wijesundara MBJ. Low temperature ion beam sputter deposition of amorphous silicon carbide for wafer-level vacuum sealing Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 275-278. |
0.682 |
|
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