James W. Joyner, Ph.D. - Publications

Affiliations: 
2003 Georgia Institute of Technology, Atlanta, GA 
Area:
Microelectronics/Microsystems

9 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2004 Joyner JW, Zarkesh-Ha P, Meindl JD. Global interconnect design in a three-dimensional system-on-a-chip Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 12: 367-372. DOI: 10.1109/Tvlsi.2004.825835  1
2003 Joyner JW, Venkatesan R, Davis JA, Meindl JD. The limits of system improvement through liquid diagonal routing of interconnects Proceedings of the Ieee 2003 International Interconnect Technology Conference, Iitc 2003. 227-229. DOI: 10.1109/IITC.2003.1219761  1
2002 Joyner JW, Meindl JD. Opportunities for reduced power dissipation using three-dimensional integration Proceedings of the Ieee 2002 International Interconnect Technology Conference, Iitc 2002. 148-150. DOI: 10.1109/IITC.2002.1014915  1
2002 Joyner JW, Meindl JD. A compact model for projections of future power supply distribution network requirements Proceedings of the Annual Ieee International Asic Conference and Exhibit. 2002: 376-380. DOI: 10.1109/ASIC.2002.1158088  1
2001 Joyner JW, Venkatesan R, Zarkesh-Ha P, Davis JA, Meindl JD. Impact of three-dimensional architectures on interconnects in gigascale integration Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 9: 922-928. DOI: 10.1109/92.974905  1
2001 Joyner JW, Zarkesh-Ha P, Meindl JD. A stochastic global net-length distribution for a three-dimensional system-on-a-chip (3D-SoC) Proceedings of the Annual Ieee International Asic Conference and Exhibit. 147-151.  1
2001 Meindl JD, Venkatesan R, Davis JA, Joyner J, Naeemi A, Zarkesh-Ha P, Bakir M, Mulé T, Kohl PA, Martin KP. Interconnecting device opportunities for gigascale integration (GSI) Technical Digest - International Electron Devices Meeting. 525-528.  1
2000 Joyner JW, Zarkesh-Ha P, Davis JA, Meindl JD. A three-dimensional stochastic wire-length distribution for variable separation of strata Proceedings of the Ieee 2000 International Interconnect Technology Conference, Iitc 2000. 126-128. DOI: 10.1109/IITC.2000.854301  1
2000 Joyner JW, Zarkesh-Ha P, Davis JA, Meindl JD. Vertical pitch limitations on performance enhancement in bonded three-dimensional interconnect architectures International Workshop On System-Level Interconnect Prediction (Slip 2000). 123-127.  1
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