Muhannad S. Bakir, Ph.D. - Publications

Affiliations: 
2003 Georgia Institute of Technology, Atlanta, GA 
Area:
Microelectronics/Microsystems

138 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2018 Wan C, Gaylord TK, Bakir MS. Grating-assisted-cylindrical-resonant-cavities interlayer coupler. Applied Optics. 57: 5079-5089. PMID 30117969  0.76
2016 Wan C, Gaylord TK, Bakir MS. Rigorous coupled-wave analysis equivalent-index-slab method for analyzing 3D angular misalignment in interlayer grating couplers. Applied Optics. 55: 10006-10015. PMID 27958403  0.76
2016 Wan C, Gaylord TK, Bakir MS. Grating design for interlayer optical interconnection of in-plane waveguides: erratum. Applied Optics. 55: 7987. PMID 27828035  0.76
2016 Wan C, Gaylord TK, Bakir MS. RCWA-EIS method for interlayer grating coupling. Applied Optics. 55: 5900-5908. PMID 27505369  0.76
2016 Wan C, Gaylord TK, Bakir MS. Grating design for interlayer optical interconnection of in-plane waveguides. Applied Optics. 55: 2601-10. PMID 27139662  0.76
2016 Zia M, Zhang C, Yang HS, Zheng L, Bakir MS. Chip-to-chip interconnect integration technologies Ieice Electronics Express. 13. DOI: 10.1587/elex.13.20162001  1
2016 Wan C, Gaylord TK, Bakir MS. Grating design for interlayer optical interconnection of in-plane waveguides Applied Optics. 55: 2601-2610. DOI: 10.1364/AO.55.002601  1
2016 Zhang X, Han X, Sarvey TE, Green CE, Kottke PA, Fedorov AG, Joshi Y, Bakir MS. Three-dimensional integrated circuit with embedded microfluidic cooling: Technology, thermal performance, and electrical implications Journal of Electronic Packaging, Transactions of the Asme. 138. DOI: 10.1115/1.4032496  1
2016 Kumar V, Oh H, Zhang X, Zheng L, Bakir MS, Naeemi A. Impact of On-Chip Interconnect on the Performance of 3-D Integrated Circuits With Through Silicon Vias: Part I Ieee Transactions On Electron Devices. DOI: 10.1109/TED.2016.2556709  1
2016 Zheng L, Zhang Y, Bakir MS. Full-Chip Power Supply Noise Time-Domain Numerical Modeling and Analysis for Single and Stacked ICs Ieee Transactions On Electron Devices. DOI: 10.1109/TED.2016.2521362  1
2016 Oh H, May GS, Bakir MS. Analysis of Signal Propagation Through TSVs Within Distilled Water for Liquid-Cooled Microsystems Ieee Transactions On Electron Devices. 63: 1176-1181. DOI: 10.1109/TED.2016.2519023  1
2016 Thadesar PA, Gu X, Alapati R, Bakir MS. Through-Silicon Vias: Drivers, Performance, and Innovations Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/TCPMT.2016.2524691  1
2016 Wahby W, Zheng L, Zhang Y, Bakir MS. A Simulation Tool for Rapid Investigation of Trends in 3-DIC Performance and Power Consumption Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/TCPMT.2015.2511082  1
2016 Thadesar PA, Bakir MS. Fabrication and Characterization of Polymer-Enhanced TSVs, Inductors, and Antennas for Mixed-Signal Silicon Interposer Platforms Ieee Transactions On Components, Packaging and Manufacturing Technology. 6: 455-463. DOI: 10.1109/TCPMT.2015.2511067  1
2016 Liu X, Thadesar PA, Taylor CL, Kunz M, Tamura N, Bakir MS, Sitaraman SK. Experimental Stress Characterization and Numerical Simulation for Copper Pumping Analysis of Through-Silicon Vias Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/TCPMT.2015.2507164  1
2016 Zhang Y, Sarvey T, Zhang C, Zia M, Bakir M. Thermal Isolation Using Air Gap and Mechanically Flexible Interconnects for Heterogeneous 3-D ICs Ieee Transactions On Components, Packaging and Manufacturing Technology. 6: 31-39. DOI: 10.1109/TCPMT.2015.2505670  1
2016 Yang HS, Zhang C, Bakir MS. A Self-Aligning Flip-Chip Assembly Method Using Sacrificial Positive Self-Alignment Structures Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/TCPMT.2015.2467318  1
2016 Oh H, Thadesar PA, May GS, Bakir MS. Low-Loss Air-Isolated Through-Silicon Vias for Silicon Interposers Ieee Microwave and Wireless Components Letters. 26: 168-170. DOI: 10.1109/LMWC.2016.2524506  1
2016 Zia M, Chi T, Zhang C, Thadesar P, Hookway T, Gonzalez J, McDevitt T, Wang H, Bakir MS. A microfabricated electronic microplate platform for low-cost repeatable biosensing applications Technical Digest - International Electron Devices Meeting, Iedm. 2016: 29.4.1-29.4.4. DOI: 10.1109/IEDM.2015.7409794  1
2016 Oh H, Zhang Y, Zheng L, May GS, Bakir MS. Fabrication and Characterization of Electrical Interconnects and Microfluidic Cooling for 3D ICS With Silicon Interposer Heat Transfer Engineering. 1-9. DOI: 10.1080/01457632.2015.1097753  1
2015 Zhang X, Han X, Sarvey TE, Green CE, Kottke PA, Fedorov AG, Joshi Y, Bakir MS. 3D IC with embedded microfluidic cooling: Technology, thermal performance, and electrical implications Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 3. DOI: 10.1115/IPACK2015-48584  1
2015 Green CE, Kottke PA, Sarvey TE, Fedorov AG, Joshi Y, Bakir MS. Performance and integration implications of addressing localized hotspots through two approaches: Clustering of micro pin-Fins and dedicated microgap coolers Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 1. DOI: 10.1115/IPACK2015-48537  1
2015 Green C, Kottke P, Han X, Woodrum C, Sarvey T, Asrar P, Zhang X, Joshi Y, Fedorov A, Sitaraman S, Bakir M. A review of two-phase forced cooling in three-dimensional stacked electronics: Technology integration Journal of Electronic Packaging, Transactions of the Asme. 137. DOI: 10.1115/1.4031481  1
2015 Zheng L, Zhang Y, Bakir MS. A Silicon Interposer Platform Utilizing Microfluidic Cooling for High-Performance Computing Systems Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/TCPMT.2015.2470544  1
2015 Woodrum DC, Sarvey T, Bakir MS, Sitaraman SK. Reliability study of micro-pin fin array for on-chip cooling Proceedings - Electronic Components and Technology Conference. 2015: 2283-2287. DOI: 10.1109/ECTC.2015.7159922  1
2015 Zheng L, Zhang Y, Zhang X, Bakir MS. Silicon interposer with embedded microfluidic cooling for high-performance computing systems Proceedings - Electronic Components and Technology Conference. 2015: 828-832. DOI: 10.1109/ECTC.2015.7159688  1
2015 Thadesar PA, Bakir MS. Fabrication and characterization of mixed-signal polymer-enhanced silicon interposer featuring photodefined coax TSVs and high-Q inductors Proceedings - Electronic Components and Technology Conference. 2015: 281-286. DOI: 10.1109/ECTC.2015.7159605  1
2015 Sarvey TE, Zhang Y, Zheng L, Thadesar P, Gutala R, Cheung C, Rahman A, Bakir MS. Embedded cooling technologies for densely integrated electronic systems Proceedings of the Custom Integrated Circuits Conference. 2015. DOI: 10.1109/CICC.2015.7338365  1
2015 Zia M, Zhang C, Thadesar P, Hookway T, Chi T, Gonzalez J, McDevitt T, Wang H, Bakir MS. Fabrication of and cell growth on 'silicon membranes' with high density TSVs for bio-sensing applications Ieee Biomedical Circuits and Systems Conference: Engineering For Healthy Minds and Able Bodies, Biocas 2015 - Proceedings. DOI: 10.1109/BioCAS.2015.7348428  1
2015 Oh H, May GS, Bakir MS. Silicon interposer platform with low-loss through-silicon vias using air 2015 International 3d Systems Integration Conference, 3dic 2015. TS11.3.1-TS11.3.4. DOI: 10.1109/3DIC.2015.7334621  1
2015 Oh H, Gu JM, Hong SJ, May GS, Bakir MS. High-aspect ratio through-silicon vias for the integration of microfluidic cooling with 3D microsystems Microelectronic Engineering. 142: 30-35. DOI: 10.1016/j.mee.2015.07.005  1
2014 Oh H, Zhang Y, Zheng L, Bakir MS. Electrical interconnect and microfluidic cooling within 3D ics and silicon interposer Asme 2014 12th International Conference On Nanochannels, Microchannels, and Minichannels, Icnmm 2014, Collocated With the Asme 2014 4th Joint Us-European Fluids Engineering Division Summer Meeting. DOI: 10.1115/ICNMM2014-21813  1
2014 Thadesar PA, Zheng L, Bakir MS. Low-loss silicon interposer for three-dimensional system integration with embedded microfluidic cooling Digest of Technical Papers - Symposium On Vlsi Technology. DOI: 10.1109/VLSIT.2014.6894399  1
2014 Zhang Y, Bakir MS. Thermal design and constraints for heterogeneous integrated chip stacks and isolation technology using air gap and thermal bridge Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1914-1924. DOI: 10.1109/TCPMT.2014.2364742  1
2014 Yang HS, Zhang C, Bakir MS. Self-aligned silicon interposer tiles and silicon bridges using positive self-alignment structures and rematable mechanically flexible interconnects Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1760-1768. DOI: 10.1109/TCPMT.2014.2357020  1
2014 Kumar V, Sharma R, Uzunlar E, Zheng L, Bashirullah R, Kohl P, Bakir MS, Naeemi A. Airgap interconnects: Modeling, optimization, and benchmarking for backplane, PCB, and interposer applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1335-1346. DOI: 10.1109/TCPMT.2014.2326798  1
2014 Gu JM, Thadesar PA, Dembla A, Bakir MS, May GS, Hong SJ. Endpoint detection in low open area TSV fabrication using optical emission spectroscopy Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1251-1260. DOI: 10.1109/TCPMT.2014.2323070  1
2014 Zheng L, Zhang Y, Huang G, Bakir MS. Novel electrical and fluidic microbumps for silicon interposer and 3-D ICs Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 777-785. DOI: 10.1109/TCPMT.2014.2309680  1
2014 Yang HS, Zhang C, Zia M, Zheng L, Bakir MS. Interposer-to-interposer electrical and silicon photonic interconnection platform using silicon bridge 2014 Ieee Optical Interconnects Conference, Oi 2014. 71-72. DOI: 10.1109/OIC.2014.6886084  1
2014 Sarvey TE, Zhang Y, Oh H, Bakir MS. Thermal and electrical effects of staggered micropin-fin dimensions for cooling of 3D microsystems Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 205-212. DOI: 10.1109/ITHERM.2014.6892283  1
2014 Zhang C, Yang HS, Bakir MS. Mechanically flexible interconnects with highly scalable pitch and large stand-off height for silicon interposer tile and bridge interconnection Proceedings - Electronic Components and Technology Conference. 13-19. DOI: 10.1109/ECTC.2014.6897260  1
2014 Zhang Y, Sarvey TE, Bakir MS. Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation 2014 International 3d Systems Integration Conference, 3dic 2014 - Proceedings. DOI: 10.1109/3DIC.2014.7152174  1
2014 Zhang C, Thadesar P, Zia M, Sarvey T, Bakir MS. Au-NiW mechanically flexible interconnects (MFIs) and TSV integration for 3D interconnects 2014 International 3d Systems Integration Conference, 3dic 2014 - Proceedings. DOI: 10.1109/3DIC.2014.7152166  1
2014 Zhang C, Yang HS, Bakir MS. Mechanically flexible interconnects (MFIs) with highly scalable pitch Journal of Micromechanics and Microengineering. 24. DOI: 10.1088/0960-1317/24/5/055024  1
2014 Liu X, Thadesar PA, Taylor CL, Oh H, Kunz M, Tamura N, Bakir MS, Sitaraman SK. In-situ microscale through-silicon via strain measurements by synchrotron x-ray microdiffraction exploring the physics behind data interpretation Applied Physics Letters. 105. DOI: 10.1063/1.4896141  1
2014 Yang HS, Zhang C, Bakir MS. Self-aligning silicon interposer tiles and silicon bridges for large nanophotonics enabled systems Electronics Letters. 50: 1475-1477. DOI: 10.1049/el.2014.1013  1
2013 Isaacs SA, Joshi Y, Zhang Y, Bakir MS, Kim YJ. Two-phase flow and heat transfer in pin-fin enhanced micro-gaps with non-uniform heating Asme 2013 4th International Conference On Micro/Nanoscale Heat and Mass Transfer, Mnhmt 2013. DOI: 10.1115/MNHMT2013-22124  1
2013 Zhang Y, Zheng L, Bakir MS. 3-D stacked tier-specific microfluidic cooling for heterogeneous 3-D ICs Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1811-1819. DOI: 10.1109/TCPMT.2013.2281605  1
2013 Zhang C, Yang HS, Bakir MS. Highly elastic gold passivated mechanically flexible interconnects Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1632-1639. DOI: 10.1109/TCPMT.2013.2276436  1
2013 Zhang Y, Dembla A, Bakir MS. Silicon micropin-fin heat sink with integrated TSVs for 3-D ICs: Tradeoff analysis and experimental testing Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1842-1850. DOI: 10.1109/TCPMT.2013.2267492  1
2013 Thadesar PA, Bakir MS. Novel photo-defined polymer-enhanced through-silicon vias for silicon interposers Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1130-1137. DOI: 10.1109/TCPMT.2013.2261122  1
2013 Thadesar PA, Dembla A, Brown D, Bakir MS. Novel through-silicon via technologies for 3D system integration Proceedings of the 2013 Ieee International Interconnect Technology Conference, Iitc 2013. DOI: 10.1109/IITC.2013.6615595  1
2013 Gu JM, Thadesar PA, Dembla A, Hong SJ, Bakir MS, May GS. Endpoint detection using optical emission spectroscopy in TSV fabrication Proceedings of the 2013 Ieee International Interconnect Technology Conference, Iitc 2013. DOI: 10.1109/IITC.2013.6615575  1
2013 Kumar V, Zheng L, Bakir M, Naeemi A. Compact modeling and optimization of fine-pitch interconnects for silicon interposers Proceedings of the 2013 Ieee International Interconnect Technology Conference, Iitc 2013. DOI: 10.1109/IITC.2013.6615571  1
2013 Zhang Y, Zheng L, Bakir MS. Tier-independent microfluidic cooling for heterogeneous 3D ICs with nonuniform power dissipation Proceedings of the 2013 Ieee International Interconnect Technology Conference, Iitc 2013. DOI: 10.1109/IITC.2013.6615561  1
2013 Zheng L, Zhang Y, Bakir MS. Design, fabrication and assembly of a novel electrical and microfluidic I/Os for 3-D chip stack and silicon interposer Proceedings - Electronic Components and Technology Conference. 2243-2248. DOI: 10.1109/ECTC.2013.6575894  1
2013 Thadesar PA, Bakir MS. Fabrication and characterization of novel photodefined polymer-enhanced through-silicon vias for silicon interposers Proceedings - Electronic Components and Technology Conference. 1970-1974. DOI: 10.1109/ECTC.2013.6575848  1
2013 Yang HS, Zhang C, Bakir MS. Self-alignment structures for heterogeneous 3D integration Proceedings - Electronic Components and Technology Conference. 232-239. DOI: 10.1109/ECTC.2013.6575577  1
2013 Thadesar PA, Gu J, Dembla A, Hong SJ, May GS, Bakir MS. Novel photodefined polymer-clad through-silicon via technology integrated with endpoint detection using optical emission spectroscopy Asmc (Advanced Semiconductor Manufacturing Conference) Proceedings. 56-61. DOI: 10.1109/ASMC.2013.6552775  1
2013 Zhang Y, Oh H, Bakir MS. Within-tier cooling and thermal isolation technologies for heterogeneous 3D ICs 2013 Ieee International 3d Systems Integration Conference, 3dic 2013. DOI: 10.1109/3DIC.2013.6702398  1
2013 Wahby W, Dembla A, Bakir M. Evaluation of 3DICs and fabrication of monolithic interlayer vias 2013 Ieee International 3d Systems Integration Conference, 3dic 2013. DOI: 10.1109/3DIC.2013.6702378  1
2013 Thadesar PA, Bakir MS. Novel photodefined polymer-embedded vias for silicon interposers Journal of Micromechanics and Microengineering. 23. DOI: 10.1088/0960-1317/23/3/035003  1
2013 Liu X, Thadesar PA, Taylor CL, Kunz M, Tamura N, Bakir MS, Sitaraman SK. Dimension and liner dependent thermomechanical strain characterization of through-silicon vias using synchrotron x-ray diffraction Journal of Applied Physics. 114. DOI: 10.1063/1.4818327  1
2013 Liu X, Thadesar PA, Taylor CL, Kunz M, Tamura N, Bakir MS, Sitaraman SK. Thermomechanical strain measurements by synchrotron x-ray diffraction and data interpretation for through-silicon vias Applied Physics Letters. 103. DOI: 10.1063/1.4813742  1
2013 Zhang Y, Bakir MS. Independent interlayer microfluidic cooling for heterogeneous 3D IC applications Electronics Letters. 49: 388-389. DOI: 10.1049/el.2012.3313  1
2013 Thadesar PA, Bakir MS. Novel Low-Loss Photodefined Electrical TSVs For Silicon Interposers International Conference and Exhibition On Device Packaging 2013. 335-354.  1
2013 Thadesar P, Dembla A, Zhang Y, Bakir MS. 3D ICs with embedded microfluidic cooling and high aspect ratio TSV integration International Conference and Exhibition On Device Packaging 2013. 900-912.  1
2013 Bakir MS, Zhang Y, Zheng L. TSV and chip I/O compatible embedded microfluidic cooling technology for 3D ICs Advancing Microelectronics. 40: 6-8.  1
2012 Thadesar PA, Bakir MS. Silicon interposer featuring novel electrical and optical TSVs Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 9: 405-412. DOI: 10.1115/IMECE2012-89742  1
2012 Huang G, Bakir MS, Naeemi A, Meindl JD. Power delivery for 3-D chip stacks: Physical modeling and design implication Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 852-859. DOI: 10.1109/TCPMT.2012.2185047  1
2012 Yang HS, Bakir MS. Design, fabrication, and characterization of freestanding mechanically flexible interconnects using curved sacrificial layer Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 561-568. DOI: 10.1109/TCPMT.2011.2177462  1
2012 Zheng L, Bakir MS. Electrical and fluidic microbumps and interconnects for 3D-IC and silicon interposer International System On Chip Conference. 159-164. DOI: 10.1109/SOCC.2012.6398388  1
2012 Dembla A, Zhang Y, Bakir MS. High aspect ratio TSVs in micropin-fin heat sinks for 3D ICs Proceedings of the Ieee Conference On Nanotechnology. DOI: 10.1109/NANO.2012.6322214  1
2012 Dembla A, Zhang Y, Bakir MS. Fine pitch TSV integration in silicon micropin-fin heat sinks for 3D ICs 2012 Ieee International Interconnect Technology Conference, Iitc 2012. DOI: 10.1109/IITC.2012.6251587  1
2012 Zhang Y, Dembla A, Joshi Y, Bakir MS. 3D stacked microfluidic cooling for high-performance 3D ICs Proceedings - Electronic Components and Technology Conference. 1644-1650. DOI: 10.1109/ECTC.2012.6249058  1
2012 Zhang C, Yang HS, Bakir MS. Gold passivated mechanically flexible interconnects (MFIs) with high elastic deformation Proceedings - Electronic Components and Technology Conference. 245-250. DOI: 10.1109/ECTC.2012.6248835  1
2012 Kumar P, Dutta I, Bakir MS. Interfacial effects during thermal cycling of Cu-filled through-silicon vias (TSV) Journal of Electronic Materials. 41: 322-335. DOI: 10.1007/s11664-011-1726-6  1
2011 Bakir MS, Thadesar PA, King C, Zaveri J, Yang HS, Zhang C, Zhang Y. Revolutionary innovation in system interconnection: A new era for the IC Proceedings of Spie - the International Society For Optical Engineering. 7928. DOI: 10.1117/12.876823  1
2011 García-Blanco SM, Bakir MS, Matthews KI, Ohashi K, Horst F. Introduction to the issue on photonic packaging and integration technologies Ieee Journal On Selected Topics in Quantum Electronics. 17: 495-497. DOI: 10.1109/JSTQE.2011.2120770  1
2011 Zhang Y, King CR, Zaveri J, Kim YJ, Sahu V, Joshi Y, Bakir MS. Coupled electrical and thermal 3D IC centric microfluidic heat sink design and technology Proceedings - Electronic Components and Technology Conference. 2037-2044. DOI: 10.1109/ECTC.2011.5898797  1
2011 Parekh MS, Thadesar PA, Bakir MS. Electrical, optical and fluidic through-silicon vias for silicon interposer applications Proceedings - Electronic Components and Technology Conference. 1992-1998. DOI: 10.1109/ECTC.2011.5898790  1
2011 Dutta I, Kumar P, Bakir MS. Interface-related reliability challenges in 3-D interconnect systems with through-silicon vias Jom. 63: 70-77. DOI: 10.1007/s11837-011-0179-y  1
2010 Dang B, Bakir MS, Sekar DC, King CR, Meindl JD. Integrated microfluidic cooling and interconnects for 2D and 3D chips Ieee Transactions On Advanced Packaging. 33: 79-87. DOI: 10.1109/TADVP.2009.2035999  1
2010 Meindl J, Naeemi A, Bakir M, Murali R. Nanoelectronics in retrospect, prospect and principle Digest of Technical Papers - Ieee International Solid-State Circuits Conference. 53: 31-35. DOI: 10.1109/ISSCC.2010.5434062  1
2010 Yang HS, Ravindran R, Bakir MS, Meindl JD. A 3D interconnect system for large biosensor array and CMOS signal-processing IC integration 2010 Ieee International Interconnect Technology Conference, Iitc 2010. DOI: 10.1109/IITC.2010.5510591  1
2010 Ravindran R, Sadie JA, Scarberry KE, Yang HS, Bakir MS, McDonald JF, Meindl JD. Biochemical sensing with an arrayed silicon nanowire platform Proceedings - Electronic Components and Technology Conference. 1015-1020. DOI: 10.1109/ECTC.2010.5490826  1
2010 King CR, Zaveri J, Bakir MS, Meindl JD. Electrical and fluidic C4 interconnections for inter-layer liquid cooling of 3D ICs Proceedings - Electronic Components and Technology Conference. 1674-1681. DOI: 10.1109/ECTC.2010.5490755  1
2010 Yang HS, Bakir MS. 3D integration of CMOS and MEMS using mechanically flexible interconnects (MFI) and through silicon vias (TSV) Proceedings - Electronic Components and Technology Conference. 822-828. DOI: 10.1109/ECTC.2010.5490716  1
2010 Lai JH, Yang HS, Chen H, King CR, Zaveri J, Ravindran R, Bakir MS. A 'mesh' seed layer for improved through-silicon-via fabrication Journal of Micromechanics and Microengineering. 20. DOI: 10.1088/0960-1317/20/2/025016  1
2010 Yang HS, Bakir MS. Interconnect technologies for heterogeneous 3D integration: CMOS and MEMS Materials Research Society Symposium Proceedings. 1249: 289-298.  1
2009 Bakir M, Huang G, Sekar D, King C. 3D integrated circuits: Liquid cooling and power delivery Iete Technical Review (Institution of Electronics and Telecommunication Engineers, India). 26: 407-416. DOI: 10.4103/0256-4602.57826  1
2009 Zaveri J, King CR, Yang HS, Bakir MS. Wafer level batch fabrication of silicon microchannel heat sink and electrical through-silicon vias for 3D ICs Proceedings - 2009 International Symposium On Microelectronics, Imaps 2009. 579-584.  1
2009 Bakir MS, Huang G. Power delivery, signaling and cooling for 3D integrated systems Materials Research Society Symposium Proceedings. 1156: 169-179.  1
2009 Lee YJ, Yoon JK, Gang H, Bakir M, Joshi Y, Fedorov A, Sung KL. Co-design of signal, power, and thermal distribution networks for 3D ICs Proceedings -Design, Automation and Test in Europe, Date. 610-615.  1
2008 Bakir MS, Glebov AL, Lee MG, Kohl PA, Meindl JD. Mechanically flexible chip-to-substrate optical interconnections using optical pillars Ieee Transactions On Advanced Packaging. 31: 143-153. DOI: 10.1109/TADVP.2007.914976  1
2008 Sekar D, King C, Dang B, Spencer T, Thacker H, Joseph P, Bakir M, Meindl J. A 3D-IC technology with integrated microchannel cooling 2008 Ieee International Interconnect Technology Conference, Iitc. 13-15. DOI: 10.1109/IITC.2008.4546911  1
2008 King CR, Sekar D, Bakir MS, Dang B, Pikarsky J, Meindl JD. 3D stacking of chips with electrical and microfluidic I/O interconnects Proceedings - Electronic Components and Technology Conference. 1-7. DOI: 10.1109/ECTC.2008.4549941  1
2008 Bakir MS, King C, Sekar D, Thacker H, Dang B, Huang G, Naeemi A, Meindl JD. 3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation Proceedings of the Custom Integrated Circuits Conference. 663-670. DOI: 10.1109/CICC.2008.4672173  1
2008 Bakir MS, Dang B, Meindl JD. Revolutionary NanoSilicon ancillary technologies for ultimate-performance gigascale systems Proceedings of the Custom Integrated Circuits Conference. 421-428. DOI: 10.1109/CICC.2007.4405766  1
2008 Bakir MS, King C, Sekar D, Dang B. Electrical, optical, and fluidic interconnect networks for 3D heterogeneous integrated systems Ieee Avionics, Fiber-Optics and Photonics Technology Conference, Avfop 2008. 7-8. DOI: 10.1109/AVFOP.2008.4653149  1
2007 Bakir MS, Kohl PA, Glebov AL, Elce E, Bhusari D, Lee MG, Meindl JD. Flexible polymer pillars for optical chip assembly: Materials, structures, and characterization Proceedings of Spie - the International Society For Optical Engineering. 6478. DOI: 10.1117/12.699174  1
2007 Bakir MS, Dang B, Meindl JD. Electrical, optical, and thermofluidic chip I/O interconnections 2007 Proceedings of the Asme Interpack Conference, Ipack 2007. 1: 11-17. DOI: 10.1115/IPACK2007-33464  1
2007 Bakir MS, Dang B, Ogunsola OOA, Sarvari R, Meindl JD. Electrical and optical chip I/O interconnections for gigascale systems Ieee Transactions On Electron Devices. 54: 2426-2437. DOI: 10.1109/TED.2007.903203  1
2007 Naeemi A, Bakir MS. Chip-level and input/output interconnects for gigascale SOCs: Limits and opportunities 2006 Ieee International Systems-On-Chip Conference, Soc. 323-324. DOI: 10.1109/SOCC.2006.283908  1
2007 Thacker H, Ogunsola O, Carson A, Bakir M, Meindl J. Optical through-wafer interconnects for 3D hyper-integration Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-Leos. 28-29. DOI: 10.1109/LEOS.2006.278802  1
2007 Huang G, Bakir M, Naeemi A, Chen H, Meindl JD. Power delivery for 3D chip stacks: Physical modeling and design implication Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 205-208. DOI: 10.1109/EPEP.2007.4387161  1
2007 Bakir MS, Dang B, Ogunsola OO, Meindl JD. 'Trimodal' wafer-level package: Fully compatible electrical, optical, and fluidic chip I/O interconnects Proceedings - Electronic Components and Technology Conference. 585-592. DOI: 10.1109/ECTC.2007.373855  1
2007 Stay JL, Bakir MS, Villalaz R, Ogra R, Gaylord TK, Meindl JD. Integration of polymer pins, volume gratings, and waveguides for chip-to-board and board-to-chip optical interconnects Optics Infobase Conference Papers 1
2006 Ogunsola OO, Thacker HD, Bachim BL, Bakir MS, Pikarsky J, Gaylord TK, Meindl JD. Chip-level waveguide-mirror-pillar optical interconnect structure Ieee Photonics Technology Letters. 18: 1672-1674. DOI: 10.1109/LPT.2006.879533  1
2006 Glebov AL, Bhusari D, Kohl P, Bakir MS, Meindl JD, Lee MG. Flexible pillars for displacement compensation in optical chip assembly Ieee Photonics Technology Letters. 18: 974-976. DOI: 10.1109/LPT.2006.873563  1
2006 Dang B, Bakir MS, Meindl JD. Integrated thermal-fluidic I/O interconnects for an on-chip microchannel heat sink Ieee Electron Device Letters. 27: 117-119. DOI: 10.1109/LED.2005.862693  1
2006 Dang B, Bakir MS, Patel CS, Thacker HD, Meindl JD. Sea-of-Leads MEMS I/O interconnects for low-k IC packaging Journal of Microelectromechanical Systems. 15: 523-530. DOI: 10.1109/JMEMS.2006.876792  1
2006 Ogunsola OO, Thacker HD, Bachim BL, Bakir MS, Gaylord TK, Meindl JD. Polymer pillars as optical I/O for gigascale chips using mirror-terminated waveguides 2006 International Interconnect Technology Conference, Iitc. 170-172. DOI: 10.1109/IITC.2006.1648679  1
2006 Bakir MS, Dang B, Thacker HD, Ogunsola OO, Ogra R, Meindl JD. Dual-mode electrical-optical flip-chip I/O interconnects and a compatible probe substrate for wafer-level testing Proceedings - Electronic Components and Technology Conference. 2006: 768-775. DOI: 10.1109/ECTC.2006.1645744  1
2006 He A, Bakir MS, Allen SAB, Kohl PA. Fabrication of compliant, copper-based chip-to-substrate connections Proceedings - Electronic Components and Technology Conference. 2006: 29-34. DOI: 10.1109/ECTC.2006.1645622  1
2005 Dang B, Joseph PJ, Wei X, Bakir MS, Kohl PA, Joshi YK, Meindl JD. A chip-scale cooling scheme with integrated heat sink and thermal-fluidic I/O interconnects Proceedings of the Asme/Pacific Rim Technical Conference and Exhibition On Integration and Packaging of Mems, Nems, and Electronic Systems: Advances in Electronic Packaging 2005. 605-610. DOI: 10.1115/IPACK2005-73416  1
2005 Bakir MS, Dang B, Emery R, Vandentop G, Kohl PA, Meindl JD. Sea of leads compliant I/O interconnect process integration for the ultimate enabling of chips with low-k interlayer dielectrics Ieee Transactions On Advanced Packaging. 28: 488-494. DOI: 10.1109/TADVP.2005.848386  1
2005 Thacker HD, Ogunsola OO, Bakir MS, Meindl JD. High-density probe substrate for testing optical interconnects Proceedings of the Ieee 2005 International Interconnect Technology Conference, Iitc. 159-161.  1
2005 Dang B, Joseph PJ, Wei X, Bakir MS, Kohl PA, Joshi YK, Meindl JD. A chip-scale cooling scheme with integrated heat sink and thermal-fluidic I/O interconnects Proceedings of the Asme/Pacific Rim Technical Conference and Exhibition On Integration and Packaging of Mems, Nems, and Electronic Systems: Advances in Electronic Packaging 2005. 605-610.  1
2005 Villalaz RA, Bakir MS, Gaylord TK, Meindl JD. Integration of waveguide volume grating couplers with optical polymer pillars Optics Infobase Conference Papers 1
2004 Bakir MS, Chui CO, Okyay AK, Saraswat KC, Meindl JD. Integration of optical polymer pillars chip I/O interconnections with Si MSM photodetectors Ieee Transactions On Electron Devices. 51: 1084-1090. DOI: 10.1109/TED.2004.830643  1
2004 Bakir MS, Meindl JD. Sea of polymer pillars electrical and optical chip I/O interconnections for gigascale integration Ieee Transactions On Electron Devices. 51: 1069-1077. DOI: 10.1109/TED.2004.829865  1
2004 Bakir MS, Gaylord TK, Ogunsola OO, Glytsis EN, Meindl JD. Optical Transmission of Polymer Pillars for Chip I/O Optical Interconnections Ieee Photonics Technology Letters. 16: 117-119. DOI: 10.1109/LPT.2003.819398  1
2004 Bakir MS, Meindl JD. Integrated electrical, optical, and thermal high density and compliant wafer-level chip I/O interconnections for gigascale integration Proceedings - Electronic Components and Technology Conference. 1: 1-6.  1
2004 Bakir MS, Dang B, Emery R, Vandentop G, Martin KP, Kohl PA, Meindl JD. Chip integration of sea of leads compliant I/O interconnections for the ultimate enabling of chips with low-k interlayer dielectrics Proceedings - Electronic Components and Technology Conference. 1: 1167-1173.  1
2004 Bakir MS, Meindl JD. Wafer-level packaging of optoelectronic chips using sea of leads electrical and optical I/O interconnections Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-Leos. 2: 583-584.  1
2003 Keezer DC, Patel CS, Bakir MS, Zhou Q, Meindl JD. Electrical test strategies for a wafer-level packaging technology Ieee Transactions On Electronics Packaging Manufacturing. 26: 267-272. DOI: 10.1109/TEPM.2003.822063  1
2003 Bakir MS, Reed HA, Thacker HD, Patel CS, Kohl PA, Martin KP, Meindl JD. Sea of leads (SoL) ultrahigh density wafer-level chip input/output interconnections for gigascale integration (GSI) Ieee Transactions On Electron Devices. 50: 2039-2048. DOI: 10.1109/TED.2003.816528  1
2003 Bakir MS, Gaylord TK, Martin KP, Meindl JD. Sea of polymer pillars: Compliant wafer-level electrical-optical chip I/O interconnections Ieee Photonics Technology Letters. 15: 1567-1569. DOI: 10.1109/LPT.2003.818651  1
2003 Bakir MS, Villalaz RA, Ogunsola OO, Gaylord TK, Kohl PA, Martin KP, Meindl JD. Sea of polymer pillars: Dual-mode electrical-optical Input/Output interconnections Proceedings of the Ieee 2003 International Interconnect Technology Conference, Iitc 2003. 77-79. DOI: 10.1109/IITC.2003.1219718  1
2003 Bakir MS, Mule AV, Gaylord TK, Kohl PA, Martin KP, Meindl JD. Sea of dual mode polymer pillar I/O interconnects for gigascale integration Digest of Technical Papers - Ieee International Solid-State Circuits Conference. 367+372-373.  1
2003 Bakir MS, Reed HA, Mulé AV, Jayachandran JP, Kohl PA, Martin KP, Gaylord TK, Meindl JD. Chip-to-module interconnections using "sea of leads" technology Mrs Bulletin. 28: 61-63+66.  1
2002 Bakir MS, Thacker HD, Zhou Z, Kohl PA, Martin KP, Meindl JD. Sea of leads microwave characterization and process integration with FEOL and BEOL Proceedings of the Ieee 2002 International Interconnect Technology Conference, Iitc 2002. 116-118. DOI: 10.1109/IITC.2002.1014906  1
2002 Thacker HD, Bakir MS, Keezer DC, Martin KP, Meindl JD. Compliant probe substrates for testing high pin-count chip scale packages Proceedings - Electronic Components and Technology Conference. 1188-1193.  1
2002 Bakir MS, Reed HA, Mule' AV, Kohl PA, Martin KP, Meindl JD. Sea of leads (SoL) characterization and design for compatibility with board-level optical waveguide interconnection Proceedings of the Custom Integrated Circuits Conference. 491-494.  1
2002 Bakir MS, Reed HA, Kohl PA, Martin KP, Meindl JD. Sea of leads ultra high-density compliant wafer-level packaging technology Proceedings - Electronic Components and Technology Conference. 1087-1094.  1
2001 Naeemi A, Patel CS, Bakir MS, Zarkesh-Ha P, Martin KP, Meindl JD. Sea of leads: A disruptive paradigm for a system-on-a-chip (SoC) Digest of Technical Papers - Ieee International Solid-State Circuits Conference. 280-281.  1
2001 Bakir MS, Patel CS, Kohl PA, Martin KP, Meindl JD. Ultra high I/O density package: Sea of leads (SoL) Proceedings of Spie - the International Society For Optical Engineering. 4428: 335-339.  1
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