Hiren D. Thacker, Ph.D. - Publications

Affiliations: 
2006 Georgia Institute of Technology, Atlanta, GA 
Area:
Microelectronics/Microsystems

88 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2016 Lee DY, Zheng X, Yao J, Luo Y, Lee JH, Lin S, Thacker H, Bovington J, Shubin I, Djordjevic SS, Cunningham JE, Raj K, Krishnamoorthy AV. Error-free operation of a polarization-insensitive 4λ × 25 Gbps silicon photonic WDM receiver with closed-loop thermal stabilization of Si microrings Optics Express. 24: 13204-13209. DOI: 10.1364/OE.24.013204  1
2016 Luo Y, Zheng X, Lin S, Yao J, Thacker H, Shubin I, Cunningham JE, Lee JH, Djordjevic SS, Bovington J, Lee DY, Raj K, Krishnamoorthy AV. A Process-Tolerant Ring Modulator Based on Multi-Mode Waveguides Ieee Photonics Technology Letters. 28: 1391-1394. DOI: 10.1109/LPT.2016.2544138  1
2016 Shubin I, Yao J, Lee JH, Djordjevic SS, Bovington J, Zhang C, Thacker H, Lin S, Lee D, Luo Y, Raj K, Cunningham JE, Krishnamoorthy AV, Zheng X. Hybrid III-V/SOI Optoelectronic Laser Module Proceedings - Electronic Components and Technology Conference. 2016: 1069-1074. DOI: 10.1109/ECTC.2016.297  1
2015 Shubin I, Zheng X, Thacker H, Djordjevic SS, Lin S, Amberg P, Yao J, Lexau J, Chang E, Liu F, Park N, Raj K, Ho R, Cunningham JE, Krishnamoorthy AV. Microring-based multi-chip WDM photonic module Optics Express. 23: 13172-13184. DOI: 10.1364/OE.23.013172  1
2015 Thacker HD, Zheng X, Lexau J, Shafiiha R, Shubin I, Lin S, Djordjevic S, Amberg P, Chang E, Liu F, Simons J, Lee JH, Abed A, Liang H, Luo Y, et al. An all-solid-state, WDM silicon photonic digital link for chip-to-chip communications Optics Express. 23: 12808-12822. DOI: 10.1364/OE.23.012808  1
2015 Shubin I, Zheng X, Thacker H, Djordjevic SS, Lin S, Amberg P, Lexau J, Raj K, Cunningham JE, Krishnamoorthy AV. All solid-state multi-chip multi-channel WDM photonic module Proceedings - Electronic Components and Technology Conference. 2015: 1293-1298. DOI: 10.1109/ECTC.2015.7159764  1
2015 Thacker HD, Shafiiha R, Lexau J, Zheng X, Djordjevic SS, Lin S, Simons J, Abed A, Amberg P, Chang E, Shubin I, Lee JH, Luo Y, Yao J, Liu F, et al. Hybrid integration and packaging of an energy-efficient WDM silicon photonic chip-to-chip interconnect Proceedings - Electronic Components and Technology Conference. 2015: 762-767. DOI: 10.1109/ECTC.2015.7159678  1
2014 Lee JH, Shubin I, Yao J, Bickford J, Luo Y, Lin S, Djordjevic SS, Thacker HD, Cunningham JE, Raj K, Zheng X, Krishnamoorthy AV. High power and widely tunable Si hybrid external-cavity laser for power efficient Si photonics WDM links. Optics Express. 22: 7678-85. PMID 24718143 DOI: 10.1364/OE.22.007678  1
2014 Zheng X, Chang E, Amberg P, Shubin I, Lexau J, Liu F, Thacker H, Djordjevic SS, Lin S, Luo Y, Yao J, Lee JH, Raj K, Ho R, Cunningham JE, et al. A high-speed, tunable silicon photonic ring modulator integrated with ultra-efficient active wavelength control Optics Express. 22: 12628-12633. DOI: 10.1364/OE.22.012628  1
2014 Krishnamoorthy AV, Zheng X, Feng D, Lexau J, Buckwalter JF, Thacker HD, Liu F, Luo Y, Chang E, Amberg P, Shubin I, Djordjevic SS, Lee JH, Lin S, Liang H, et al. A low-power, high-speed, 9-channel germaniumsilicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer Optics Express. 22: 12289-12295. DOI: 10.1364/OE.22.012289  1
2014 Lin S, Djordjevic SS, Cunningham JE, Shubin I, Luo Y, Yao J, Li G, Thacker H, Lee JH, Raj K, Zheng X, Krishnamoorthy AV. Vertical-coupled high-efficiency tunable III-V-CMOS SOI hybrid external-cavity laser 2014 Ieee Optical Interconnects Conference, Oi 2014. 79-80. DOI: 10.1109/OIC.2014.6886088  1
2014 Lee JH, Shubin I, Yao J, Bickford J, Luo Y, Lin S, Djordjevic SS, Thacker HD, Cunningham JE, Raj K, Zheng X, Krishnamoorthy AV. High power and energy-efficient WDM Si/III-V hybrid external-cavity lasers 2014 Ieee Optical Interconnects Conference, Oi 2014. 75-76. DOI: 10.1109/OIC.2014.6886086  1
2013 Lin S, Djordjevic SS, Cunningham JE, Shubin I, Luo Y, Yao J, Li G, Thacker H, Lee JH, Raj K, Zheng X, Krishnamoorthy AV. Vertical-coupled high-efficiency tunable III-VCMOS SOI hybrid external-cavity laser Optics Express. 21: 32425-32431. DOI: 10.1364/OE.21.032425  1
2013 Yao J, Shubin I, Zheng X, Li G, Luo Y, Thacker H, Lee JH, Bickford J, Raj K, Cunningham JE, Krishnamoorthy AV. Low loss optical interlayer coupling using reflector-enhanced grating couplers 2013 Optical Interconnects Conference, Oi 2013. 31-32. DOI: 10.1109/OIC.2013.6552909  1
2013 Ho R, Amberg P, Chang E, Koka P, Lexau J, Li G, Liu FY, Schwetman H, Shubin I, Thacker HD, Zheng X, Cunningham JE, Krishnamoorthy AV. Silicon photonic interconnects for large-scale computer systems Ieee Micro. 33: 68-78. DOI: 10.1109/MM.2012.91  1
2013 Li G, Krishnamoorthy AV, Shubin I, Yao J, Luo Y, Thacker H, Zheng X, Raj K, Cunningham JE. Ring resonator modulators in silicon for interchip photonic links Ieee Journal On Selected Topics in Quantum Electronics. 19. DOI: 10.1109/JSTQE.2013.2278885  1
2013 Zheng X, Lin S, Luo Y, Yao J, Li G, Djordjevic SS, Lee JH, Thacker HD, Shubin I, Raj K, Cunningham JE, Krishnamoorthy AV. Efficient WDM laser sources towards terabyte/s silicon photonic interconnects Journal of Lightwave Technology. 31: 4142-4154. DOI: 10.1109/JLT.2013.2288917  1
2013 Zheng X, Shubin I, Li G, Luo Y, Park N, Yao J, Thacker H, Lee JH, Raj K, Cunningham JE, Krishnamoorthy AV. 1x8 Si ring Mux/DeMux with ultra-low tuning power Ieee International Conference On Group Iv Photonics Gfp. 23-24. DOI: 10.1109/Group4.2013.6644471  1
2013 Shubin I, Chow EM, Chow A, De Bruyker D, Thacker HD, Fujimoto K, Raj K, Krishnamoorthy AV, Mitchell JG, Cunningham JE. Package demonstration of an interposer with integrated TSVs and flexible compliant interconnects Proceedings - Electronic Components and Technology Conference. 329-333. DOI: 10.1109/ECTC.2013.6575591  1
2013 Zhang C, Thacker HD, Shubin I, Krishnamoorthy AV, Mitchell JG, Cunningham JE. Large-scale, surface tension assisted Ball-in-Pit self population for chip-to-chip passive alignment Proceedings - Electronic Components and Technology Conference. 214-220. DOI: 10.1109/ECTC.2013.6575574  1
2013 Lexau J, Zheng X, Chang E, Shubin I, Li G, Luo Y, Yao J, Thacker H, Lee JH, Liu F, Amberg P, Raj K, Cunningham JE, Krishnamoorthy AV, Ho R. Design considerations for a 33mW, 12.5 Gbps × 8 channel silicon photonic transmitter array Proceedings of the 2013 Ieee Asian Solid-State Circuits Conference, a-Sscc 2013. 37-40. DOI: 10.1109/ASSCC.2013.6690976  1
2013 Zheng X, Chang E, Shubin I, Li G, Luo Y, Yao J, Thacker H, Lee JH, Lexau J, Liu F, Amberg P, Raj K, Ho R, Cunningham JE, Krishnamoorthy AV. A 33mW 100Gbps CMOS silicon photonic WDM transmitter using off-chip laser source Optical Fiber Communication Conference, Ofc 2013. PDP5C.9.  1
2013 Zheng X, Chang E, Shubin I, Li G, Luo Y, Yao J, Thacker H, Lee JH, Lexau J, Liu F, Amberg P, Raj K, Ho R, Cunningham JE, Krishnamoorthy AV. A 33mW 100Gbps CMOS silicon photonic WDM transmitter using off-chip laser sources National Fiber Optic Engineers Conference, Nfoec 2013. PDP5C.9.  1
2012 Li G, Luo Y, Zheng X, Masini G, Mekis A, Sahni S, Thacker H, Yao J, Shubin I, Raj K, Cunningham JE, Krishnamoorthy AV. Improving CMOS-compatible Germanium photodetectors. Optics Express. 20: 26345-50. PMID 23187489 DOI: 10.1364/OE.20.026345  1
2012 Li G, Yao J, Thacker H, Mekis A, Zheng X, Shubin I, Luo Y, Lee JH, Raj K, Cunningham JE, Krishnamoorthy AV. Ultralow-loss, high-density SOI optical waveguide routing for macrochip interconnects. Optics Express. 20: 12035-9. PMID 22714189 DOI: 10.1364/OE.20.012035  1
2012 Luo Y, Zheng X, Li G, Shubin I, Thacker H, Yao J, Lee JH, Feng D, Fong J, Kung CC, Liao S, Shafiiha R, Asghari M, Raj K, Krishnamoorthy AV, et al. Strong electro-absorption in GeSi epitaxy on silicon-on-insulator (SOI) Micromachines. 3: 345-363. DOI: 10.3390/mi3020345  1
2012 Zheng X, Luo Y, Li G, Shubin I, Thacker H, Yao J, Raj K, Cunningham JE, Krishnamoorthy AV. Enhanced optical bistability from self-heating due to free carrier absorption in substrate removed silicon ring modulators Optics Express. 20: 11478-11486. DOI: 10.1364/OE.20.011478  1
2012 Yao J, Zheng X, Shubin I, Li G, Thacker H, Luo Y, Lee JH, Raj K, Cunningham JE, Krishnamoorthy AV. Optical interlayer coupling design for optical interconnects based on mirror enhanced grating couplers 2012 Optical Interconnects Conference, Oic 2012. 27-28. DOI: 10.1109/OIC.2012.6224464  1
2012 Zheng X, Luo Y, Lexau J, Liu F, Li G, Thacker HD, Shubin I, Yao J, Ho R, Cunningham JE, Krishnamoorthy AV. 2-pJ/bit (On-Chip) 10-Gb/s digital CMOS silicon photonic link Ieee Photonics Technology Letters. 24: 1260-1262. DOI: 10.1109/LPT.2012.2200885  1
2012 Zheng X, Liu F, Lexau J, Patil D, Li G, Luo Y, Thacker HD, Shubin I, Yao J, Raj K, Ho R, Cunningham JE, Krishnamoorthy AV. Ultralow power 80 Gb/s arrayed CMOS silicon photonic transceivers for WDM optical links Journal of Lightwave Technology. 30: 641-650. DOI: 10.1109/JLT.2011.2179287  1
2012 Li G, Zheng X, Thacker H, Yao J, Luo Y, Shubin I, Raj K, Cunningham JE, Krishnamoorthy AV. 40 Gb/s thermally tunable CMOS ring modulator Ieee International Conference On Group Iv Photonics Gfp. DOI: 10.1109/GROUP4.2012.6324190  1
2012 Luo Y, Li G, Zheng X, Yao J, Thacker H, Lee JH, Cunningham JE, Raj K, Krishnamoorthy AV. Low-loss low-crosstalk silicon rib waveguide crossing with tapered multimode-interference design Ieee International Conference On Group Iv Photonics Gfp. 150-152. DOI: 10.1109/GROUP4.2012.6324116  1
2012 Yang HS, Thacker HD, Shubin I, Cunningham JE, Mitchell JG. Assembly and alignment of proximity communication enabled multi-chip packages using elastomeric bump interposers Proceedings - Electronic Components and Technology Conference. 2029-2035. DOI: 10.1109/ECTC.2012.6249119  1
2012 Cunningham JE, Shubin I, Thacker HD, Lee JH, Li G, Zheng X, Lexau J, Ho R, Mitchell JG, Luo Y, Yao J, Raj K, Krishnamoorthy AV. Scaling hybrid-integration of silicon photonics in Freescale 130nm to TSMC 40nm-CMOS VLSI drivers for low power communications Proceedings - Electronic Components and Technology Conference. 1518-1525. DOI: 10.1109/ECTC.2012.6249037  1
2012 Shubin I, Chow EM, Chow A, Thacker HD, DebBruyker D, Fujimoto K, Raj K, Krishnamoorthy AV, Mitchell JG, Cunningham JE. Integrating through-silicon vias with solder free, compliant interconnects for novel, large area interposers Proceedings - Electronic Components and Technology Conference. 263-267. DOI: 10.1109/ECTC.2012.6248838  1
2012 Thacker HD, Shubin I, Luo Y, Raj K, Mitchell JG, Krishnamoorthy AV, Cunningham JE. "Dual-purpose" remateable conductive ball-in-pit interconnects for chip powering and passive alignment in proximity communication enabled multi-chip packages Proceedings - Electronic Components and Technology Conference. 36-42. DOI: 10.1109/ECTC.2012.6248803  1
2012 Shubin I, Li G, Zheng X, Luo Y, Thacker H, Yao J, Park N, Krishnamoorthy AV, Cunningham JE. Integration, processing and performance of low power thermally tunable CMOS-SOI WDM resonators Optical and Quantum Electronics. 44: 589-604. DOI: 10.1007/s11082-012-9577-9  1
2012 Zheng X, Luo Y, Lexau J, Liu F, Li G, Thacker H, Shubin I, Yao J, Ho R, Cunningham JE, Krishnamoorthy AV. A complete 10 Gbps chip-to-chip digital CMOS silicon photonic link 2012 Conference On Lasers and Electro-Optics, Cleo 2012 1
2011 Li G, Zheng X, Yao J, Thacker H, Shubin I, Luo Y, Raj K, Cunningham JE, Krishnamoorthy AV. 25Gb/s 1V-driving CMOS ring modulator with integrated thermal tuning Optics Express. 19: 20435-20443. DOI: 10.1364/OE.19.020435  1
2011 Zheng X, Patil D, Lexau J, Liu F, Li G, Thacker H, Luo Y, Shubin I, Li J, Yao J, Dong P, Feng D, Asghari M, Pinguet T, Mekis A, et al. Ultra-efficient 10Gb/s hybrid integrated silicon photonic transmitter and receiver Optics Express. 19: 5172-5186. DOI: 10.1364/OE.19.005172  1
2011 Thacker HD, Shubin I, Luo Y, Costa J, Lexau J, Zheng X, Li G, Yao J, Patil D, Liu F, Ho R, Pinguet T, Dong P, Feng D, Asghari M, et al. Hybrid-integrated silicon photonic bridge chips for ultralow energy inter-chip communications Proceedings of Spie - the International Society For Optical Engineering. 7944. DOI: 10.1117/12.876526  1
2011 Luo Y, Simons J, Costa J, Shubin I, Chen W, Frans B, Robinson M, Shafiiha R, Liao S, Feng NN, Zheng X, Li G, Yao J, Thacker H, Asghari M, et al. Experimental studies of the Franz-Keldysh effect in CVD grown GeSi epi on SOI Proceedings of Spie - the International Society For Optical Engineering. 7944. DOI: 10.1117/12.876492  1
2011 Yao J, Zheng X, Li G, Shubin I, Luo Y, Thacker H, Mekis A, Pinguet T, Sahni S, Raj K, Cunningham JE, Krishnamoorthy AV. Grating-coupler-based optical proximity coupling for scalable computing systems Proceedings of Spie - the International Society For Optical Engineering. 7944. DOI: 10.1117/12.876443  1
2011 Shubin I, Zheng X, Li G, Thacker H, Yao J, Guenin B, Pinguet T, Mekis A, Krishnamoorthy AV, Cunningham JE. Low power thermal tuning of SOI-CMOS photonic structures Proceedings of Spie - the International Society For Optical Engineering. 7944. DOI: 10.1117/12.876428  1
2011 Krishnamoorthy AV, Zheng X, Li G, Dong P, Feng D, Pinguet T, Mekis A, Schwetman H, Lexau J, Patil D, Liu F, Koka P, McCracken M, Shubin I, Thacker H, et al. Dense WDM silicon photonic interconnects for compact high-end computing systems 2011 Ieee Winter Topicals, Wtm 2011. 108-110. DOI: 10.1109/PHOTWTM.2011.5730071  1
2011 Cunningham JE, Krishnamoorthy AV, Ho R, Shubin I, Thacker H, Lexau J, Lee DC, Feng D, Chow E, Luo Y, Zheng X, Li G, Yao J, Pinguet T, Raj K, et al. Integration and packaging of a macrochip with silicon nanophotonic links Ieee Journal On Selected Topics in Quantum Electronics. 17: 546-558. DOI: 10.1109/JSTQE.2010.2091674  1
2011 Thacker HD, Ogunsola OO, Muler AV, Meindl JD. Wafer-testing of optoelectonic - Gigascale CMOS integrated circuits Ieee Journal On Selected Topics in Quantum Electronics. 17: 659-670. DOI: 10.1109/JSTQE.2010.2089431  1
2011 Zheng X, Liu F, Patil D, Lexau J, Li G, Luo Y, Thacker H, Shubin I, Yao J, Raj K, Cunningham JE, Ho R, Krishnamoorthy AV. Sub pJ/bit WDM silicon photonic communications for many-core computing systems 2011 Ico International Conference On Information Photonics, Ip 2011. DOI: 10.1109/ICO-IP.2011.5953764  1
2011 Yao J, Zheng X, Li G, Shubin I, Thacker H, Luo Y, Raj K, Cunningham JE, Krishnamoorthy AV. Grating-coupler based low-loss optical interlayer coupling Ieee International Conference On Group Iv Photonics Gfp. 383-385. DOI: 10.1109/GROUP4.2011.6053824  1
2011 Li G, Zheng X, Yao J, Thacker H, Shubin I, Luo Y, Raj K, Cunningham JE, Krishnamoorthy AV. High-efficiency 25Gb/s CMOS ring modulator with integrated thermal tuning Ieee International Conference On Group Iv Photonics Gfp. 8-10. DOI: 10.1109/GROUP4.2011.6053698  1
2011 Thacker HD, Shubin I, Luo Y, Costa J, Lexau J, Zheng X, Li G, Yao J, Li J, Patil D, Liu F, Ho R, Feng D, Asghari M, Pinguet T, et al. Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers Proceedings - Electronic Components and Technology Conference. 829-835. DOI: 10.1109/ECTC.2011.5898607  1
2011 Shubin I, Chow A, Popovic D, Thacker H, Giere M, Hopkins R, Krishnamoorthy AV, Mitchell JG, Cunningham JE. A novel MCM package enabling proximity communication I-O Proceedings - Electronic Components and Technology Conference. 224-229. DOI: 10.1109/ECTC.2011.5898517  1
2011 Cunningham JE, Shubin I, Zheng X, Li G, Thacker H, Luo Y, Yao J, Raj K, Guenin B, Pinguet T, Krishnamoorthy AV. Compact, thermally-tuned resonant ring muxes in CMOS with integrated backside pyramidal etch pit Optics Infobase Conference Papers 1
2011 Zheng X, Liu F, Lexau J, Patil D, Li G, Luo Y, Thacker H, Shubin I, Yao J, Raj K, Ho R, Cunningham JE, Krishnamoorthy AV. Ultra-low power arrayed CMOS silicon photonic transceivers for an 80 Gbps WDM optical link Optics Infobase Conference Papers 1
2010 Zheng X, Liu F, Patil D, Thacker H, Luo Y, Pinguet T, Mekis A, Yao J, Li G, Shi J, Raj K, Lexau J, Alon E, Ho R, Cunningham JE, et al. A sub-picojoule-per-bit CMOS photonic receiver for densely integrated systems. Optics Express. 18: 204-11. PMID 20173840 DOI: 10.1364/OE.18.000204  1
2010 Cunningham JE, Shubin I, Zheng X, Pinguet T, Mekis A, Luo Y, Thacker H, Li G, Yao J, Raj K, Krishnamoorthy AV. Highly-efficient thermally-tuned resonant optical filters Optics Express. 18: 19055-19063. DOI: 10.1364/OE.18.019055  1
2010 Zheng X, Shubin I, Li G, Pinguet T, Mekis A, Yao J, Thacker H, Luo Y, Costa J, Raj K, Cunningham JE, Krishnamoorthy AV. A tunable 1×4 silicon CMOS photonic wavelength multiplexer/ demultiplexer for dense optical interconnects Optics Express. 18: 5151-5160. DOI: 10.1364/OE.18.005151  1
2010 Zheng X, Lexau J, Luo Y, Thacker H, Pinguet T, Mekis A, Li G, Shi J, Amberg P, Pinckney N, Raj K, Ho R, Cunningham JE, Krishnamoorthy AV. Ultra-low-energy all-CMOS modulator integrated with driver Optics Express. 18: 3059-3070. DOI: 10.1364/OE.18.003059  1
2010 Zheng X, Cunningham JE, Li G, Luo Y, Thacker H, Yao J, Ho R, Lexau J, Liu F, Patil D, Amberg P, Pinckney N, Dong P, Feng D, Asghari M, et al. Ultra-low power silicon photonic transceivers for inter/intra-chip interconnects Proceedings of Spie - the International Society For Optical Engineering. 7797. DOI: 10.1117/12.863087  1
2010 Shubin I, Zheng X, Thacker H, Yao J, Costa J, Luo Y, Li G, Krishnamoorthy AV, Cunningham JE, Pinguet T, Mekis A. Thermally tunable SOI CMOS photonics circuits Proceedings of Spie - the International Society For Optical Engineering. 7607. DOI: 10.1117/12.842903  1
2010 Li G, Zheng X, Lexau J, Luo Y, Thacker H, Pinguet T, Dong P, Feng D, Liao S, Shafiiha R, Asghari M, Yao J, Shi J, Shubin IN, Patil D, et al. Ultralow-power silicon photonic interconnect for high-performance computing systems Proceedings of Spie - the International Society For Optical Engineering. 7607. DOI: 10.1117/12.842884  1
2010 Raj K, Cunningham JE, Ho R, Zheng X, Schwetman H, Koka P, McCracken M, Lexau J, Li G, Thacker H, Shubin I, Luo Y, Yao J, Asghari M, Pinguet T, et al. "Macrochip" computer systems enabled by silicon photonic interconnects Proceedings of Spie - the International Society For Optical Engineering. 7607. DOI: 10.1117/12.842818  1
2010 Thacker HD, Shubin I, Zheng X, Costa J, Luo Y, Li G, Yao J, Shi J, Lexau J, Ho R, Raj K, Mitchell JG, Cunningham JE, Krishnamoorthy AV. CMOS-photonic "macrochip" packaging 2010 23rd Annual Meeting of the Ieee Photonics Society, Photinics 2010. 485-486. DOI: 10.1109/PHOTONICS.2010.5698972  1
2010 Krishnamoorthy AV, Ho R, Zheng X, Li G, Cunningham JE, Feng D, Dong P, Pinguet T, Mekis A, Schwetman H, Lexau J, Patil D, Liu F, Koka P, McCracken M, ... ... Thacker H, et al. Low-power photonic links: Breaking the picojoule-per-bit barrier 2010 23rd Annual Meeting of the Ieee Photonics Society, Photinics 2010. 228-229. DOI: 10.1109/PHOTONICS.2010.5698842  1
2010 Zheng X, Cunningham JE, Ho R, Lexau J, Li G, Luo Y, Thacker H, Yao J, Liu F, Patil D, Amberg P, Pinckney N, Dong P, Feng D, Asghari M, et al. Low power silicon photonic transceivers 2010 Ieee Photonics Society Summer Topical Meeting Series, Phosst 2010. 199-200. DOI: 10.1109/PHOSST.2010.5553683  1
2010 Thacker HD, Luo Y, Shi J, Shubin I, Lexau J, Zheng X, Li G, Yao J, Costa J, Pinguet T, Mekis A, Dong P, Liao S, Feng D, Asghari M, et al. Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links Proceedings - Electronic Components and Technology Conference. 240-246. DOI: 10.1109/ECTC.2010.5490965  1
2010 Shi J, Popovic D, Nettleton N, Sze T, Douglas D, Thacker H, Cunningham J, Furuta K, Kojima R, Hirose K, Hwang K. Direct chip powering and enhancement of proximity communication through Anisotropic Conductive adhesive chip-to-chip bonding Proceedings - Electronic Components and Technology Conference. 363-368. DOI: 10.1109/ECTC.2010.5490948  1
2010 Krishnamoorthy AV, Zheng X, Li G, Dong P, Feng D, Pinguet T, Mekis A, Schwetman H, Lexau J, Patil D, Liu F, Koka P, McCracken M, Shubin I, Thacker H, et al. Compacting high-end computing systems with dense WDM silicon photonic interconnects Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2010.5619671  1
2010 Shubin I, Cunningham JE, Popovic D, Thacker H, Zheng X, Luo Y, Mitchell J, Raj K, Krishnamoorthy AV, Zamek S, Chen W, Majumdar A. Ferro-electrically enhanced proximity communication 43rd International Symposium On Microelectronics 2010, Imaps 2010. 84-92.  1
2010 Li G, Zheng X, Lexau J, Luo Y, Thacker H, Dong P, Liao S, Feng D, Zheng D, Shafiiha R, Asghari M, Yao J, Shi J, Amberg P, Pinckney N, et al. Ultralow-power high-performance si photonic transmitter Optics Infobase Conference Papers 1
2010 Krishnamoorthy AV, Ho R, Zheng X, Li G, Feng D, Dong P, Pinguet T, Mekis A, Schwetman H, Lexau J, Patil D, Liu F, Koka P, McCracken M, Shubin I, ... Thacker H, et al. The integration of silicon photonics and VLSI electronics for computing and switching systems Optics Infobase Conference Papers 1
2009 Zheng X, Lexau J, luo Y, Thacker H, Pinguet T, Mekis A, Li G, Shi J, Amberg P, Pinckney N, Raj K, Ho R, Cunningham JE, Krishnamoorthy AV. An ultra-low power all CMOS Si photonic transmitter Optics Infobase Conference Papers 1
2008 Sekar D, King C, Dang B, Spencer T, Thacker H, Joseph P, Bakir M, Meindl J. A 3D-IC technology with integrated microchannel cooling 2008 Ieee International Interconnect Technology Conference, Iitc. 13-15. DOI: 10.1109/IITC.2008.4546911  1
2008 Bakir MS, King C, Sekar D, Thacker H, Dang B, Huang G, Naeemi A, Meindl JD. 3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation Proceedings of the Custom Integrated Circuits Conference. 663-670. DOI: 10.1109/CICC.2008.4672173  1
2007 Thacker HD, Meindl JD. Prospects for wafer-level testing of gigascale chips with electrical and optical I/O interconnects Proceedings - International Test Conference. DOI: 10.1109/TEST.2006.297668  1
2007 Thacker H, Ogunsola O, Carson A, Bakir M, Meindl J. Optical through-wafer interconnects for 3D hyper-integration Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-Leos. 28-29. DOI: 10.1109/LEOS.2006.278802  1
2006 Ogunsola OO, Thacker HD, Bachim BL, Bakir MS, Pikarsky J, Gaylord TK, Meindl JD. Chip-level waveguide-mirror-pillar optical interconnect structure Ieee Photonics Technology Letters. 18: 1672-1674. DOI: 10.1109/LPT.2006.879533  1
2006 Dang B, Bakir MS, Patel CS, Thacker HD, Meindl JD. Sea-of-Leads MEMS I/O interconnects for low-k IC packaging Journal of Microelectromechanical Systems. 15: 523-530. DOI: 10.1109/JMEMS.2006.876792  1
2006 Ogunsola OO, Thacker HD, Bachim BL, Bakir MS, Gaylord TK, Meindl JD. Polymer pillars as optical I/O for gigascale chips using mirror-terminated waveguides 2006 International Interconnect Technology Conference, Iitc. 170-172. DOI: 10.1109/IITC.2006.1648679  1
2006 Bakir MS, Dang B, Thacker HD, Ogunsola OO, Ogra R, Meindl JD. Dual-mode electrical-optical flip-chip I/O interconnects and a compatible probe substrate for wafer-level testing Proceedings - Electronic Components and Technology Conference. 2006: 768-775. DOI: 10.1109/ECTC.2006.1645744  1
2005 Thacker HD, Ogunsola OO, Bakir MS, Meindl JD. High-density probe substrate for testing optical interconnects Proceedings of the Ieee 2005 International Interconnect Technology Conference, Iitc. 159-161.  1
2005 Thacker H, Ogunsola O, Bakir M, Meindl J. Probe module for wafer-level testing of gigascale chips with electrical and optical I/O interconnects Proceedings of the Asme/Pacific Rim Technical Conference and Exhibition On Integration and Packaging of Mems, Nems, and Electronic Systems: Advances in Electronic Packaging 2005. 1593-1599.  1
2004 Thacker H, Mule A, Villalaz R, Gaylord T, Meindl J. Compliant probe substrates with two-material, air-clad, grating-in-waveguide optical I/O interconnects Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-Leos. 1: 439-440.  1
2004 Dang B, Patel C, Thacker H, Bakir M, Martin K, Meindl J. Optimal implementation of sea of leads (SoL) compliant interconnect technology Proceedings of the Ieee 2004 International Interconnect Technology Conference. 99-101.  1
2003 Bakir MS, Reed HA, Thacker HD, Patel CS, Kohl PA, Martin KP, Meindl JD. Sea of leads (SoL) ultrahigh density wafer-level chip input/output interconnections for gigascale integration (GSI) Ieee Transactions On Electron Devices. 50: 2039-2048. DOI: 10.1109/TED.2003.816528  1
2002 Bakir MS, Thacker HD, Zhou Z, Kohl PA, Martin KP, Meindl JD. Sea of leads microwave characterization and process integration with FEOL and BEOL Proceedings of the Ieee 2002 International Interconnect Technology Conference, Iitc 2002. 116-118. DOI: 10.1109/IITC.2002.1014906  1
2002 Thacker HD, Bakir MS, Keezer DC, Martin KP, Meindl JD. Compliant probe substrates for testing high pin-count chip scale packages Proceedings - Electronic Components and Technology Conference. 1188-1193.  1
2002 Bakir M, Mulé A, Thacker H, Kohl P, Martin K, Meindl J. Sol-compliant wafer-level package technologies Semiconductor International. 25: 61-64.  1
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