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Oluwafemi O. Ogunsola, Ph.D. - Publications

Affiliations: 
2006 Georgia Institute of Technology, Atlanta, GA 
Area:
Microelectronics/Microsystems
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12 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2011 Thacker HD, Ogunsola OO, Muler AV, Meindl JD. Wafer-testing of optoelectonic - Gigascale CMOS integrated circuits Ieee Journal On Selected Topics in Quantum Electronics. 17: 659-670. DOI: 10.1109/Jstqe.2010.2089431  0.762
2007 Thacker H, Ogunsola O, Carson A, Bakir M, Meindl J. Optical through-wafer interconnects for 3D hyper-integration Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-Leos. 28-29. DOI: 10.1109/LEOS.2006.278802  0.728
2007 Bakir MS, Dang B, Ogunsola OO, Meindl JD. 'Trimodal' wafer-level package: Fully compatible electrical, optical, and fluidic chip I/O interconnects Proceedings - Electronic Components and Technology Conference. 585-592. DOI: 10.1109/ECTC.2007.373855  0.753
2006 Ogunsola OO, Thacker HD, Bachim BL, Bakir MS, Pikarsky J, Gaylord TK, Meindl JD. Chip-level waveguide-mirror-pillar optical interconnect structure Ieee Photonics Technology Letters. 18: 1672-1674. DOI: 10.1109/Lpt.2006.879533  0.753
2006 Ogunsola OO, Thacker HD, Bachim BL, Bakir MS, Gaylord TK, Meindl JD. Polymer pillars as optical I/O for gigascale chips using mirror-terminated waveguides 2006 International Interconnect Technology Conference, Iitc. 170-172. DOI: 10.1109/IITC.2006.1648679  0.778
2006 Bakir MS, Dang B, Thacker HD, Ogunsola OO, Ogra R, Meindl JD. Dual-mode electrical-optical flip-chip I/O interconnects and a compatible probe substrate for wafer-level testing Proceedings - Electronic Components and Technology Conference. 2006: 768-775. DOI: 10.1109/ECTC.2006.1645744  0.758
2005 Bachim BL, Ogunsola OO, Gaylord TK. Optical-fiber-to-waveguide coupling using carbon-dioxide-laser-induced long-period fiber gratings. Optics Letters. 30: 2080-2. PMID 16127916 DOI: 10.1364/Ol.30.002080  0.476
2005 Thacker HD, Ogunsola OO, Bakir MS, Meindl JD. High-density probe substrate for testing optical interconnects Proceedings of the Ieee 2005 International Interconnect Technology Conference, Iitc. 159-161.  0.738
2005 Thacker H, Ogunsola O, Bakir M, Meindl J. Probe module for wafer-level testing of gigascale chips with electrical and optical I/O interconnects Proceedings of the Asme/Pacific Rim Technical Conference and Exhibition On Integration and Packaging of Mems, Nems, and Electronic Systems: Advances in Electronic Packaging 2005. 1593-1599.  0.784
2004 Ogunsola OO, Dang B, Bakir MS, Villalaz RA, Gaylord TK, Meindl JD. Polymer pillar optical transmittance analysis Frontiers in Optics. DOI: 10.1364/Fio.2004.Fthm5  0.758
2004 Bakir MS, Gaylord TK, Ogunsola OO, Glytsis EN, Meindl JD. Optical Transmission of Polymer Pillars for Chip I/O Optical Interconnections Ieee Photonics Technology Letters. 16: 117-119. DOI: 10.1109/Lpt.2003.819398  0.796
2003 Bakir MS, Villalaz RA, Ogunsola OO, Gaylord TK, Kohl PA, Martin KP, Meindl JD. Sea of polymer pillars: Dual-mode electrical-optical Input/Output interconnections Proceedings of the Ieee 2003 International Interconnect Technology Conference, Iitc 2003. 77-79. DOI: 10.1109/IITC.2003.1219718  0.757
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