Deepak C. Sekar, Ph.D. - Publications

Affiliations: 
2008 Georgia Institute of Technology, Atlanta, GA 
Area:
Microelectronics/Microsystems

22 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2016 Wang C, Wu H, Gao B, Dai L, Deng N, Sekar D, Lu Z, Kellam M, Bronner G, Qian H. Suppression of relaxation effect in HfO2 resistive random access memory array by improved program operations Applied Physics Express. 9. DOI: 10.7567/APEX.9.051501  1
2016 Wang C, Wu H, Gao B, Dai L, Deng N, Sekar DC, Lu Z, Kellam M, Bronner G, Qian H. Relaxation effect in RRAM arrays: Demonstration and characteristics Ieee Electron Device Letters. 37: 182-185. DOI: 10.1109/LED.2015.2508034  1
2015 Huang X, Wu H, Sekar DC, Nguyen SN, Wang K, Qian H. Optimization of TiN/TaOx/HfO2/TiN RRAM Arrays for Improved Switching and Data Retention 2015 Ieee 7th International Memory Workshop, Imw 2015. DOI: 10.1109/IMW.2015.7150300  1
2015 Sekar DC, Bateman B, Raghuram U, Bowyer S, Bai Y, Calarrudo M, Swab P, Wu J, Nguyen S, Mishra N, Meyer R, Kellam M, Haukness B, Chevallier C, Wu H, et al. Technology and circuit optimization of resistive RAM for low-power, reproducible operation Technical Digest - International Electron Devices Meeting, Iedm. 2015: 28.3.1-28.3.4. DOI: 10.1109/IEDM.2014.7047125  1
2014 Sekar DC. 3D memory with shared lithography steps: The memory industry's plan to 'cram more components onto integrated circuits' 2014 Soi-3d-Subthreshold Microelectronics Technology Unified Conference, S3s 2014. DOI: 10.1109/S3S.2014.7028196  1
2012 Wei H, Wu TF, Sekar D, Cronquist B, Pease RF, Mitra S. Cooling three-dimensional integrated circuits using power delivery networks Technical Digest - International Electron Devices Meeting, Iedm. 14.2.1-14.2.4. DOI: 10.1109/IEDM.2012.6479040  1
2011 Sekar DC, Or-Bach Z. Monolithic 3D-ICs with single crystal silicon layers 2011 Ieee International 3d Systems Integration Conference, 3dic 2011. DOI: 10.1109/3DIC.2012.6262978  1
2011 Kim W, Park SI, Zhang Z, Yang-Liauw Y, Sekar D, Wong HSP, Wong SS. Forming-free nitrogen-doped AlOX RRAM with sub-μA programming current Digest of Technical Papers - Symposium On Vlsi Technology. 22-23.  1
2010 Dang B, Bakir MS, Sekar DC, King CR, Meindl JD. Integrated microfluidic cooling and interconnects for 2D and 3D chips Ieee Transactions On Advanced Packaging. 33: 79-87. DOI: 10.1109/Tadvp.2009.2035999  1
2009 Bakir M, Huang G, Sekar D, King C. 3D integrated circuits: Liquid cooling and power delivery Iete Technical Review (Institution of Electronics and Telecommunication Engineers, India). 26: 407-416. DOI: 10.4103/0256-4602.57826  1
2008 Sekar D, King C, Dang B, Spencer T, Thacker H, Joseph P, Bakir M, Meindl J. A 3D-IC technology with integrated microchannel cooling 2008 Ieee International Interconnect Technology Conference, Iitc. 13-15. DOI: 10.1109/IITC.2008.4546911  1
2008 King CR, Sekar D, Bakir MS, Dang B, Pikarsky J, Meindl JD. 3D stacking of chips with electrical and microfluidic I/O interconnects Proceedings - Electronic Components and Technology Conference. 1-7. DOI: 10.1109/ECTC.2008.4549941  1
2008 Bakir MS, King C, Sekar D, Thacker H, Dang B, Huang G, Naeemi A, Meindl JD. 3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation Proceedings of the Custom Integrated Circuits Conference. 663-670. DOI: 10.1109/CICC.2008.4672173  1
2008 Huang G, Sekar D, Naeemi A, Shakeri K, Meindl JD. Physical model for power supply noise and chip/package co-design in gigascale systems with the consideration of hot spots Proceedings of the Custom Integrated Circuits Conference. 841-844. DOI: 10.1109/CICC.2007.4405859  1
2008 Bakir MS, King C, Sekar D, Dang B. Electrical, optical, and fluidic interconnect networks for 3D heterogeneous integrated systems Ieee Avionics, Fiber-Optics and Photonics Technology Conference, Avfop 2008. 7-8. DOI: 10.1109/AVFOP.2008.4653149  1
2007 Sekar DC, Dang B, Davis JA, Meindl JD. Electromigration resistant power delivery systems Ieee Electron Device Letters. 28: 767-769. DOI: 10.1109/Led.2007.902165  1
2007 Sekar DC, Naeemi A, Sarvari R, Davis JA, Meindl JD. IntSim: A CAD tool for optimization of multilevel interconnect networks Ieee/Acm International Conference On Computer-Aided Design, Digest of Technical Papers, Iccad. 560-567. DOI: 10.1109/ICCAD.2007.4397324  1
2007 Gang H, Sekar DC, Naeemi A, Shakeri K, Meindl JD. Compact physical models for power supply noise and chip/package co-design of gigascale integration Proceedings - Electronic Components and Technology Conference. 1659-1666. DOI: 10.1109/ECTC.2007.374017  1
2007 Sekar DC, Meindl JD. The impact of multi-core architectures on design of chip-level interconnect networks Proceedings of the Ieee 2007 International Interconnect Technology Conference - Digest of Technical Papers. 123-125.  1
2006 Sekar DC, Venkatesan R, Bowman KA, Joshi A, Davis JA, Meindl JD. Optimal repeaters for sub-50nm interconnect networks 2006 International Interconnect Technology Conference, Iitc. 199-201. DOI: 10.1109/IITC.2006.1648687  1
2006 Sekar DC, Demaray E, Zhang H, Kohl PA, Meindl JD. A new global interconnect paradigm: MIM power-ground plane capacitors 2006 International Interconnect Technology Conference, Iitc. 48-50. DOI: 10.1109/IITC.2006.1648643  1
2005 Sekar DC. Clock trees: Differential or single ended? Proceedings - International Symposium On Quality Electronic Design, Isqed. 548-553. DOI: 10.1109/ISQED.2005.31  1
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