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Gaofeng Wang, Ph.D. - Publications

Affiliations: 
2001 Stanford University, Palo Alto, CA 
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60 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Zhao W, Hu Q, Fu K, Zhang Y, Wang D, Wang J, Hu Y, Wang G. Modeling of Carbon Nanotube-Based Differential Through-Silicon Vias in 3-D ICs Ieee Transactions On Nanotechnology. 19: 492-499. DOI: 10.1109/Tnano.2020.3004825  0.327
2020 Wang W, Chen S, Cai J, Zhou XY, Chan WS, Wang G, Xue Q. A Dual-Band Outphasing Power Amplifier Based on Noncommensurate Transmission Line Concept Ieee Transactions On Microwave Theory and Techniques. 68: 3079-3089. DOI: 10.1109/Tmtt.2020.2995588  0.341
2020 Hu Q, Zhao W, Fu K, Wang G. Modeling and Characterization of Differential Multibit Carbon-Nanotube Through-Silicon Vias Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 534-537. DOI: 10.1109/Tcpmt.2020.2972340  0.322
2020 Fan L, Zhao W, Gan H, He L, Liu Q, Dong L, Wang G. A high-Q active substrate integrated waveguide based sensor for fully characterizing magneto-dielectric (MD) materials Sensors and Actuators a-Physical. 301: 111778. DOI: 10.1016/J.Sna.2019.111778  0.301
2019 Guan Z, Zhao P, Lao Q, Wang X, Wang G. Parameter Extraction for Equivalent Circuit Model of RF Devices Based on a Hybrid Optimization Method Electronics. 8: 1133. DOI: 10.3390/Electronics8101133  0.312
2019 Chu Y, Xu K, Zhong Y, Ye X, Zhou T, Chen X, Wang G. Fast Microwave Through Wall Imaging Method With Inhomogeneous Background Based on Levenberg–Marquardt Algorithm Ieee Transactions On Microwave Theory and Techniques. 67: 1138-1147. DOI: 10.1109/Tmtt.2018.2878703  0.306
2019 Wu L, Chen X, Wang G, Zhou Q. Dual-frequency piezoelectric micromachined ultrasonic transducers Applied Physics Letters. 115: 23501. DOI: 10.1063/1.5097624  0.301
2019 Cheng Z, Zhao W, Wang D, Wang J, Dong L, Wang G. Modelling and delay analysis of on-chip differential carbon nanotube interconnects Micro & Nano Letters. 14: 505-510. DOI: 10.1049/Mnl.2018.5166  0.306
2019 Pan J, Fu K, Liu Q, Zhao W, Dong L, Wang G. Modelling of crosstalk in differential through silicon vias for three-dimensional integrated circuits Iet Microwaves Antennas & Propagation. 13: 1529-1535. DOI: 10.1049/Iet-Map.2018.5297  0.302
2019 Zhang Y, Zhao W, Liu Q, Wang G. Novel electromagnetic bandgap structure for wideband suppression of simultaneous switching noise Electronics Letters. 55: 1243-1245. DOI: 10.1049/El.2019.2850  0.321
2019 Hu Y, Liu Z, Chen S, Wang J, Zhao W, Wang G. Numerical investigation on L-shaped vertical field plate in high-voltage LDMOS Results in Physics. 15: 102547. DOI: 10.1016/J.Rinp.2019.102547  0.304
2018 Chen S, Wang W, Xu K, Wang G. A Reactance Compensated Three-Device Doherty Power Amplifier for Bandwidth and Back-Off Range Extension Wireless Communications and Mobile Computing. 2018: 1-10. DOI: 10.1155/2018/8418165  0.332
2018 Zhao P, Zhang Y, Sun R, Zhao W, Hu Y, Wang G. Design of a Novel Miniaturized Frequency Selective Surface Based on 2.5-Dimensional Jerusalem Cross for 5G Applications Wireless Communications and Mobile Computing. 2018: 1-6. DOI: 10.1155/2018/3485208  0.327
2018 Fu K, Zhao W, Wang G, Swaminathan M. A Passive Equalizer Design for Shielded Differential Through-Silicon Vias in 3-D IC Ieee Microwave and Wireless Components Letters. 28: 768-770. DOI: 10.1109/Lmwc.2018.2854552  0.337
2018 Fu K, Zhao W, Wang D, Wang G, Swaminathan M, Yin W. A Compact Passive Equalizer Design for Differential Channels in TSV-Based 3-D ICs Ieee Access. 6: 75278-75292. DOI: 10.1109/Access.2018.2884036  0.338
2018 Chen S, Guo M, Xu K, Zhao P, Hu Y, Dong L, Wang G. A Dielectric Constant Measurement System for Liquid Based on SIW Resonator Ieee Access. 6: 41163-41172. DOI: 10.1109/Access.2018.2857514  0.3
2018 Fu K, Zhao W, Wang G, Swaminathan M. Modeling and Performance Analysis of Shielded Differential Annular Through-Silicon Via (SD-ATSV) for 3-D ICs Ieee Access. 6: 33238-33250. DOI: 10.1109/Access.2018.2846751  0.322
2018 Xu K, Liu Y, Chen S, Zhao P, Peng L, Dong L, Wang G. Novel Microwave Sensors Based on Split Ring Resonators for Measuring Permittivity Ieee Access. 6: 26111-26120. DOI: 10.1109/Access.2018.2834726  0.303
2018 Xu K, Liu Y, Dong L, Peng L, Chen S, Shen F, Ye X, Chen X, Wang G. Printed multi-band compound meta-loop antenna with hybrid-coupled SRRs Iet Microwaves, Antennas & Propagation. 12: 1382-1388. DOI: 10.1049/Iet-Map.2017.0925  0.305
2018 Wang L, Yuan Z, Wen F, Cheng Y, Zhang Y, Wang G. A bipolar passive DMFC stack for portable applications Energy. 144: 587-593. DOI: 10.1016/J.Energy.2017.12.039  0.303
2017 Zhao W, Zheng J, Chen S, Wang X, Wang G. Transient Analysis of Through-Silicon Vias in Floating Silicon Substrate Ieee Transactions On Electromagnetic Compatibility. 59: 207-216. DOI: 10.1109/Temc.2016.2592181  0.3
2017 Hu Y, Gong Y, Liu H, Xu Q, Zhao W, Wang J, Wang Y, Wang G. Numerical Investigation of High-Voltage Partial Buried P/N-Layer SOI LDMOS Ieee Transactions On Electron Devices. 64: 3725-3733. DOI: 10.1109/Ted.2017.2724921  0.3
2017 Wang Y, Liu Y, Wang Y, Yu C, Cao F, Hu Y, Wang G. Multiple Trench Split-gate SOI LDMOS Integrated With Schottky Rectifier Ieee Transactions On Electron Devices. 64: 3028-3031. DOI: 10.1109/Ted.2017.2704089  0.321
2017 Zhao W, Zheng J, Wang J, Liang F, Wen F, Dong L, Wang D, Wang G. Modeling and Characterization of Coaxial Through-Silicon Via With Electrically Floating Inner Silicon Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 936-943. DOI: 10.1109/Tcpmt.2017.2678203  0.301
2017 Chen S, Wang G, Cheng Z, Qin P, Xue Q. Adaptively Biased 60-GHz Doherty Power Amplifier in 65-nm CMOS Ieee Microwave and Wireless Components Letters. 27: 296-298. DOI: 10.1109/Lmwc.2017.2662011  0.3
2017 Xu K, Liu F, Peng L, Zhao W, Ran L, Wang G. Multimode and Wideband Printed Loop Antenna Based on Degraded Split-Ring Resonators Ieee Access. 5: 15561-15570. DOI: 10.1109/Access.2017.2729517  0.311
2017 Liu F, Xu K, Zhao P, Dong L, Wang G. Uniplanar dual-band printed compound loop antenna for WLAN/WiMAX applications Electronics Letters. 53: 1083-1084. DOI: 10.1049/El.2017.1543  0.306
2016 Peng L, Chen P, Wu A, Wang G. Efficient Radiation by Electrically Small Antennas made of Coupled Split-ring Resonators. Scientific Reports. 6: 33501. PMID 27630076 DOI: 10.1038/Srep33501  0.315
2016 Zhao WS, Zheng J, Liang F, Xu K, Chen X, Wang G. Wideband Modeling and Characterization of Differential Through-Silicon Vias for 3-D ICs Ieee Transactions On Electron Devices. DOI: 10.1109/Ted.2016.2516345  0.327
2016 Zhao WS, Zheng J, Dong L, Liang F, Hu Y, Wang L, Wang G, Zhou Q. High-Frequency Modeling of On-Chip Coupled Carbon Nanotube Interconnects for Millimeter-Wave Applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 6: 1226-1232. DOI: 10.1109/Tcpmt.2016.2580592  0.329
2016 Chen S, Wang G, Cheng Z, Xue Q. A Bandwidth Enhanced Doherty Power Amplifier With a Compact Output Combiner Ieee Microwave and Wireless Components Letters. DOI: 10.1109/Lmwc.2016.2558108  0.328
2016 Chen S, Cheng Z, Wang G, Xue Q. Compact Doherty Power Amplifier Design for 2 × 2 Multiple-Input Multiple-Output System Ieee Microwave and Wireless Components Letters. 26: 216-218. DOI: 10.1109/Lmwc.2016.2526024  0.324
2016 Chen P, Peng L, Wu A, Wang G. Rendering wide impedance band of ESA made of SRRs Electronics Letters. 52: 1582-1584. DOI: 10.1049/El.2016.2440  0.322
2016 Zhao WS, Zhang R, Fang Y, Yin WY, Wang G, Kang K. High-frequency modeling of Cu-graphene heterogeneous interconnects International Journal of Numerical Modelling: Electronic Networks, Devices and Fields. 29: 157-165. DOI: 10.1002/Jnm.2059  0.307
2015 Hu Y, Wang H, Du C, Ma M, Chan M, He J, Wang G. A High-Voltage (>600 V) N-Island LDMOS With Step-Doped Drift Region in Partial SOI Technology Ieee Transactions On Electron Devices. DOI: 10.1109/Ted.2015.2487345  0.312
2015 Chen A, Liang F, Wang G, Wang B. Closed-form impedance model for annular through-silicon via pairs in three-dimensional integration Iet Microwaves Antennas & Propagation. 9: 808-813. DOI: 10.1049/Iet-Map.2014.0606  0.347
2015 Wang L, He M, Hu Y, Zhang Y, Liu X, Wang G. A “4-cell” modular passive DMFC (direct methanol fuel cell) stack for portable applications Energy. 82: 229-235. DOI: 10.1016/J.Energy.2015.01.033  0.318
2014 Liu X, Wang G, Ding W. Efficient circuit modelling of wireless power transfer to multiple devices Iet Power Electronics. 7: 3017-3022. DOI: 10.1049/Iet-Pel.2013.0969  0.347
2013 Liang F, Wang G, Zhao D, Wang B. Wideband Impedance Model for Coaxial Through-Silicon Vias in 3-D Integration Ieee Transactions On Electron Devices. 60: 2498-2504. DOI: 10.1109/Ted.2013.2268869  0.333
2013 Qi C, Shi X, Ye S, Wang G. Equivalent Circuit-Level Model of Quantum Cascade Lasers: Influence of Doping Density on Steady State and Dynamic Responses Ieee Journal of Quantum Electronics. 49: 545-552. DOI: 10.1109/Jqe.2013.2259466  0.306
2013 Jiang X, Xiao P, Qiu M, Wang G. Performance effects of pipeline architecture on an FPGA-based binary32 floating point multiplier Microprocessors and Microsystems. 37: 1183-1191. DOI: 10.1016/J.Micpro.2013.08.007  0.309
2013 Cao Y, Wang G, Gunupudi P, Zhang QJ. Parametric modeling of microwave passive components using combined neural networks and transfer functions in the time and frequency International Journal of Rf and Microwave Computer-Aided Engineering. 23: 20-33. DOI: 10.1002/Mmce.20630  0.313
2012 Hu Y, Huang Q, Wang G, Chang S, Wang H. A Novel High-Voltage ( $>$ 600 V) LDMOSFET With Buried N-Layer in Partial SOI Technology Ieee Transactions On Electron Devices. 59: 1131-1136. DOI: 10.1109/Ted.2012.2185498  0.306
2011 Xu W, Wang G, Jiang J, Qi X, Zhang F. A high-PSR transient-enhanced output-capacitorless CMOS low-dropout regulator for SoC applications International Journal of Electronics. 98: 1319-1332. DOI: 10.1080/00207217.2011.593141  0.707
2011 Qi C, Shi X, Wang G. High-order circuit-level thermal model of vertical-cavity surface-emitting lasers Iet Optoelectronics. 5: 19-27. DOI: 10.1049/Iet-Opt.2010.0008  0.306
2011 Liu X, Wang G, Liu J. Wideband model of on-chip CMOS interconnects using space-mapping technique International Journal of Rf and Microwave Computer-Aided Engineering. 21: 439-445. DOI: 10.1002/Mmce.20534  0.305
2011 Xu W, Chen X, Wang G. A common-mode replica compensated inductor-capacitor voltage-controlled oscillator for mixed-signal system-on-chip applications International Journal of Circuit Theory and Applications. 41: 295-306. DOI: 10.1002/Cta.799  0.329
2010 Liu X, Wang G, Deng D, Liu F, Tu Z. A new model of on-chip inductors on ferrite film using KB-FDSMN neural network International Journal of Rf and Microwave Computer-Aided Engineering. 20: 399-407. DOI: 10.1002/Mmce.V20:4  0.302
2009 Wang H, Wang G, Chang S, Huang Q. High-Order Element Effects of the Green's Function in Quantum Transport Simulation of Nanoscale Devices Ieee Transactions On Electron Devices. 56: 3106-3114. DOI: 10.1109/Ted.2009.2033006  0.31
2009 Cao Y, Chen X, Wang G. Dynamic Behavioral Modeling of Nonlinear Microwave Devices Using Real-Time Recurrent Neural Network Ieee Transactions On Electron Devices. 56: 1020-1026. DOI: 10.1109/Ted.2009.2016029  0.315
2009 Ding W, Wang G. Analytical timing model for inductance-dominant interconnect based on traveling wave propagation Microelectronics Journal. 40: 905-911. DOI: 10.1016/J.Mejo.2008.11.061  0.319
2009 Huang Q, Chang S, Wang G. A novel photoelectric MOSFET with AC output under constant illumination Optical and Quantum Electronics. 41: 795-803. DOI: 10.1007/S11082-010-9393-Z  0.3
2007 Wang R, Yuan B, Wang G, Yi F. Efficient Design of Directive Patch Antennas in Mobile Communications Using Metamaterials International Journal of Infrared and Millimeter Waves. 28: 639-649. DOI: 10.1007/S10762-007-9249-1  0.32
2002 Wang G, Dutton RW, Rafferty CS. Device-level simulation of wave propagation along metal-insulator-semiconductor interconnects Ieee Transactions On Microwave Theory and Techniques. 50: 1127-1136. DOI: 10.1109/22.993416  0.313
2002 Wang G, Hou J, Hu J, Wang B. Analytical Modeling of Metal-Insulator-Semiconductor Interconnects Using the Energy Based Approach International Journal of Infrared and Millimeter Waves. 23: 267-274. DOI: 10.1023/A:1015074318737  0.326
2001 Wang G, Qi X, Yu Z. Device level modeling of metal-insulator-semiconductor interconnects Ieee Transactions On Electron Devices. 48: 1672-1682. DOI: 10.1109/16.936590  0.713
1997 Wang G. Application of wavelets on the interval to the analysis of thin-wire antennas and scatterers Ieee Transactions On Antennas and Propagation. 45: 885-893. DOI: 10.1109/8.575642  0.304
1996 Wang B, Zhang G, Wang G. The EMI properties of microstrip circuits in enclosures with slot apertures International Journal of Infrared and Millimeter Waves. 17: 1431-1439. DOI: 10.1007/Bf02068793  0.308
1995 Wang G, Pan G, Gilbert BK. A Hybrid Wavelet Expansion and Boundary Element Analysis for Multiconductor Transmission Lines in Multilayered Dielectric Media Ieee Transactions On Microwave Theory and Techniques. 43: 664-675. DOI: 10.1109/22.372114  0.306
1993 Pan GW, Wang G, Gilbert BK. Analysis of nonlinear termination networks for coupled lossy and dispersive transmission lines Ieee Transactions On Microwave Theory and Techniques. 41: 531-535. DOI: 10.1109/22.223758  0.304
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