Year |
Citation |
Score |
2015 |
Wu C, Sampurno Y, Liao X, Zhuang Y, Borucki L, Theng S, Philipossian A. Effect of pad groove design on slurry injection scheme during interlayer dielectric chemical mechanical planarization Ecs Journal of Solid State Science and Technology. 4: P272-P276. DOI: 10.1149/2.0281507Jss |
0.65 |
|
2015 |
Wu C, Sampurno Y, Liao X, Jiao Y, Theng S, Zhuang Y, Borucki L, Philipossian A. Pad surface thermal management during copper chemical mechanical planarization Ecs Journal of Solid State Science and Technology. 4: P206-P212. DOI: 10.1149/2.0101507Jss |
0.686 |
|
2014 |
Liao X, Zhuang Y, Borucki LJ, Cheng J, Theng S, Ashizawa T, Philipossian A. Effect of pad surface micro-Texture on dishing and erosion during shallow trench isolation chemical mechanical planarization Japanese Journal of Applied Physics. 53. DOI: 10.7567/Jjap.53.086501 |
0.589 |
|
2013 |
Liao X, Zhuang Y, Borucki LJ, Cheng J, Theng S, Ashizawa T, Philipossian A. Effect of pad surface micro-texture on removal rate during interlayer dielectric chemical mechanical planarization process Japanese Journal of Applied Physics. 52. DOI: 10.7567/Jjap.52.018001 |
0.609 |
|
2013 |
Wu C, Zhuang Y, Liao X, Jiao Y, Sampurno YA, Theng S, Sun F, Naman A, Philipossian A. Aggressive diamond characterization and wear analysis during chemical mechanical planarization Ecs Journal of Solid State Science and Technology. 2. DOI: 10.1149/2.036301Jss |
0.661 |
|
2012 |
Liao X, Sampurno Y, Zhuang Y, Philipossian A. Effect of slurry application/injection schemes on slurry availability during chemical mechanical planarization (CMP) Electrochemical and Solid-State Letters. 15. DOI: 10.1149/2.009205Esl |
0.677 |
|
2012 |
Liao X, Sampurno Y, Zhuang Y, Rice A, Sudargho F, Philipossian A, Wargo C. Effect of retaining ring slot designs and polishing conditions on slurry flow dynamics at bow wave Microelectronic Engineering. 98: 70-73. DOI: 10.1016/J.Mee.2012.06.002 |
0.652 |
|
2011 |
Liao X, Zhuang Y, Borucki LJ, Theng S, Wei X, Ashizawa T, Philipossian A. Effect of pad surface micro-texture on coefficient of friction and removal rate during copper CMP process Electrochemical and Solid-State Letters. 14. DOI: 10.1149/1.3555072 |
0.637 |
|
2010 |
Jiao Y, Zhuang Y, Han Z, Liao X, Sampuno YA, Naman A, Philipossian A. Effect of temperature on pad surface contact area in chemical mechanical planarization Advanced Metallization Conference (Amc). 286-287. DOI: 10.1149/2.016202Ssl |
0.646 |
|
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