Hai Wang, Ph.D. - Publications

Affiliations: 
2012 Electrical Engineering University of California, Riverside, Riverside, CA, United States 
Area:
Computer Engineering, Electronics and Electrical Engineering, Computer Science

22 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2022 Wang H, Long X, Liu XX. fastESN: Fast Echo State Network. Ieee Transactions On Neural Networks and Learning Systems. PMID 35482690 DOI: 10.1109/TNNLS.2022.3167466  0.506
2020 Wang H, Guo X, Tan SX, Zhang C, Tang H, Yuan Y. Leakage-Aware Predictive Thermal Management for Multicore Systems Using Echo State Network Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 39: 1400-1413. DOI: 10.1109/Tcad.2019.2915316  0.707
2019 Wang H, Huang D, Liu R, Zhang C, Tang H, Yuan Y. STREAM: Stress and Thermal Aware Reliability Management for 3-D ICs Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 38: 2058-2071. DOI: 10.1109/Tcad.2018.2877019  0.337
2019 Wang H, Tang D, Zhang M, Tan SX, Zhang C, Tang H, Yuan Y. GDP: A Greedy Based Dynamic Power Budgeting Method for Multi/Many-Core Systems in Dark Silicon Ieee Transactions On Computers. 68: 526-541. DOI: 10.1109/Tc.2018.2875986  0.698
2018 Zhao H, Hua Q, Chen H, Ye Y, Wang H, Tan SX-, Tlelo-Cuautle E. Thermal-Sensor-Based Occupancy Detection for Smart Buildings Using Machine-Learning Methods Acm Transactions On Design Automation of Electronic Systems. 23: 54. DOI: 10.1145/3200904  0.359
2018 Wang H, Wan J, Tan SX, Zhang C, Tang H, Yuan Y, Huang K, Zhang Z. A Fast Leakage-Aware Full-Chip Transient Thermal Estimation Method Ieee Transactions On Computers. 67: 617-630. DOI: 10.1109/Tc.2017.2778066  0.709
2017 Kim T, Sun Z, Chen H, Wang H, Tan SX. Energy and Lifetime Optimizations for Dark Silicon Manycore Microprocessor Considering Both Hard and Soft Errors Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 25: 2561-2574. DOI: 10.1109/Tvlsi.2017.2707401  0.7
2017 Tang H, Peng Y, Lu X, Wang AZ, Wang H. A quantitative design methodology for high-speed interpolation/averaging ADCs Integration. 58: 215-224. DOI: 10.1016/J.Vlsi.2017.03.008  0.362
2016 Wang H, Ma J, Tan SX-, Zhang C, Tang H, Huang K, Zhang Z. Hierarchical Dynamic Thermal Management Method for High-Performance Many-Core Microprocessors Acm Transactions On Design Automation of Electronic Systems. 22: 1-21. DOI: 10.1145/2891409  0.391
2016 Zhao Y, Kim T, Shin H, Tan SX, Li X, Chen H, Wang H. Statistical Rare-Event Analysis and Parameter Guidance by Elite Learning Sample Selection Acm Transactions On Design Automation of Electronic Systems. 21: 1-21. DOI: 10.1145/2875422  0.683
2016 He K, Tan SX-, Wang H, Shi G. GPU-Accelerated Parallel Sparse LU Factorization Method for Fast Circuit Analysis Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 24: 1140-1150. DOI: 10.1109/Tvlsi.2015.2421287  0.337
2016 He K, Tan SXD, Zhao H, Liu XX, Wang H, Shi G. Parallel GMRES solver for fast analysis of large linear dynamic systems on GPU platforms Integration, the Vlsi Journal. 52: 10-22. DOI: 10.1016/J.Vlsi.2015.07.005  0.584
2015 Chen H, Li Y, Tan SX-, Huang X, Wang H, Wong N. H -Matrix-Based Finite-Element-Based Thermal Analysis for 3D ICs Acm Transactions On Design Automation of Electronic Systems. 20: 47. DOI: 10.1145/2714563  0.331
2015 Liu Z, Tan SX-, Huang X, Wang H. Task Migrations for Distributed Thermal Management Considering Transient Effects Ieee Transactions On Very Large Scale Integration Systems. 23: 397-401. DOI: 10.1109/Tvlsi.2014.2309331  0.577
2015 Chen HB, Tan SXD, Shin DH, Huang X, Wang H, Shi G. H 2-matrix-based finite element linear solver for fast transient thermal analysis of high-performance ICs International Journal of Circuit Theory and Applications. 43: 1953-1970. DOI: 10.1002/Cta.2051  0.362
2014 Liu Z, Swarup S, Tan SXD, Chen HB, Wang H. Compact lateral thermal resistance model of TSVs for fast finite-difference based thermal analysis of 3-D stacked ICs Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 33: 1490-1502. DOI: 10.1109/Tcad.2014.2334321  0.607
2014 Liu Z, Tan SXD, Wang H, Hua Y, Gupta A. Compact thermal modeling for packaged microprocessor design with practical power maps Integration. 47: 71-85. DOI: 10.1016/J.Vlsi.2013.07.003  0.633
2013 Wang H, Tan SX, Li D, Gupta A, Yuan Y. Composable thermal modeling and simulation for architecture-level thermal designs of multicore microprocessors Acm Transactions On Design Automation of Electronic Systems. 18: 1-27. DOI: 10.1145/2442087.2442099  0.711
2012 Shen R, Tan SX-, Wang H, Xiong J. Fast Statistical Full-Chip Leakage Analysis for Nanometer VLSI Systems Acm Transactions On Design Automation of Electronic Systems. 17: 51. DOI: 10.1145/2348839.2348855  0.341
2012 Wang H, Tan SX-, Rakib R. Compact Modeling of Interconnect Circuits over Wide Frequency Band by Adaptive Complex-Valued Sampling Method Acm Transactions On Design Automation of Electronic Systems. 17: 5. DOI: 10.1145/2071356.2071361  0.348
2012 Wang H, Yu H, Tan SXD. Fast timing analysis of clock networks considering environmental uncertainty Integration. 45: 376-387. DOI: 10.1016/J.Vlsi.2011.03.001  0.368
2010 Tan SX-, Yan B, Wang H. Recent advance in non-Krylov subspace model order reduction of interconnect circuits Tsinghua Science & Technology. 15: 151-168. DOI: 10.1016/S1007-0214(10)70045-6  0.366
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