Weidong Xie, Ph.D. - Publications
Affiliations: | 2001 | Georgia Institute of Technology, Atlanta, GA |
Area:
Mechanical EngineeringYear | Citation | Score | |||
---|---|---|---|---|---|
2003 | Xie W, Sitaraman SK. Investigation of interfacial delamination of a copper-epoxy interface under monotonic and cyclic loading: Experimental characterization Ieee Transactions On Advanced Packaging. 26: 447-452. DOI: 10.1109/Tadvp.2003.821091 | 0.489 | |||
2003 | Xie W, Sitaraman SK. Investigation of interfacial delamination of a copper-epoxy interface under monotonic and cyclic loading: Modeling and evaluation Ieee Transactions On Advanced Packaging. 26: 441-446. DOI: 10.1109/Tadvp.2003.821087 | 0.499 | |||
2003 | Xie W, Sitaraman SK. An experimental technique to determine critical stress intensity factors for delamination initiation Engineering Fracture Mechanics. 70: 1193-1201. DOI: 10.1016/S0013-7944(02)00090-5 | 0.471 | |||
1999 | Variyam MN, Xie W, Sitaraman SK. Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling Journal of Electronic Packaging. 122: 121-127. DOI: 10.1115/1.483143 | 0.462 | |||
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