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Craig E. Green, Ph.D. - Publications

Affiliations: 
2012 Georgia Institute of Technology, Atlanta, GA 
Area:
Mechanical Engineering
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16 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2018 Asrar P, Zhang X, Green CE, Bakir M, Joshi YK. Flow boiling of R245fa in a microgap with staggered circular cylindrical pin fins International Journal of Heat and Mass Transfer. 121: 329-342. DOI: 10.1016/J.Ijheatmasstransfer.2017.12.117  0.531
2017 Nasr MH, Green CE, Kottke PA, Zhang X, Sarvey TE, Joshi YK, Bakir MS, Fedorov AG. Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps Journal of Electronic Packaging. 139. DOI: 10.1115/1.4035387  0.59
2017 Sarvey TE, Hu Y, Green CE, Kottke PA, Woodrum DC, Joshi YK, Fedorov AG, Sitaraman SK, Bakir MS. Integrated Circuit Cooling Using Heterogeneous Micropin-Fin Arrays for Nonuniform Power Maps Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 1465-1475. DOI: 10.1109/Tcpmt.2017.2704525  0.644
2017 Nasr MH, Green CE, Kottke PA, Zhang X, Sarvey TE, Joshi YK, Bakir MS, Fedorov AG. Flow regimes and convective heat transfer of refrigerant flow boiling in ultra-small clearance microgaps International Journal of Heat and Mass Transfer. 108: 1702-1713. DOI: 10.1016/J.Ijheatmasstransfer.2016.12.056  0.674
2016 Zhang X, Han X, Sarvey TE, Green CE, Kottke PA, Fedorov AG, Joshi Y, Bakir MS. Three-dimensional integrated circuit with embedded microfluidic cooling: Technology, thermal performance, and electrical implications Journal of Electronic Packaging, Transactions of the Asme. 138. DOI: 10.1115/1.4032496  0.602
2016 Kottke PA, Yun TM, Green CE, Joshi YK, Fedorov AG. Two-Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors Journal of Heat Transfer. 138. DOI: 10.1115/1.4031111  0.525
2016 Lorenzini D, Green C, Sarvey TE, Zhang X, Hu Y, Fedorov AG, Bakir MS, Joshi Y. Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering International Journal of Heat and Mass Transfer. 103: 1359-1370. DOI: 10.1016/J.Ijheatmasstransfer.2016.08.040  0.623
2015 Green CE, Kottke PA, Sarvey TE, Fedorov AG, Joshi Y, Bakir MS. Performance and integration implications of addressing localized hotspots through two approaches: Clustering of micro pin-Fins and dedicated microgap coolers Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 1. DOI: 10.1115/IPACK2015-48537  0.666
2015 Green C, Kottke P, Han X, Woodrum C, Sarvey T, Asrar P, Zhang X, Joshi Y, Fedorov A, Sitaraman S, Bakir M. A review of two-phase forced cooling in three-dimensional stacked electronics: Technology integration Journal of Electronic Packaging, Transactions of the Asme. 137. DOI: 10.1115/1.4031481  0.683
2014 Kottke PA, Yun TM, Green CE, Joshi YK, Fedorov AG. Two phase convective cooling for ultra-high power dissipation in microprocessors Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 199-204. DOI: 10.1109/ITHERM.2014.6892282  0.595
2014 Green CE, Fedorov AG, Joshi YK. Time scale matching of dynamically operated devices using composite thermal capacitors Microelectronics Journal. 45: 1069-1078. DOI: 10.1016/J.Mejo.2014.05.013  0.649
2012 Green CE, Fedorov AG, Joshi YK. Dynamic thermal management of high heat flux devices using embedded solid-liquid phase change materials and solid state coolers Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 853-862. DOI: 10.1109/ITHERM.2012.6231516  0.653
2011 Green CE, Fedorov AG, Joshi YK. Thermal capacitance matching in 3D many-core architectures Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 110-115. DOI: 10.1109/STHERM.2011.5767187  0.575
2010 Green CE, Fedorov AG, Joshi YK. Scaling analysis of performance trade-offs in electronics cooling Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 1047-1056. DOI: 10.1115/InterPACK2009-89389  0.421
2009 Green C, Fedorov AG, Joshi YK. Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management Journal of Electronic Packaging. 131. DOI: 10.1115/1.3104029  0.673
2009 Green CE, Fedorov AG, Joshi YK. Scaling analysis of performance tradeoffs in electronics cooling Ieee Transactions On Components and Packaging Technologies. 32: 868-875. DOI: 10.1109/Tcapt.2009.2013720  0.6
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