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Tz-Cheng Chiu, Ph.D. - Publications

Affiliations: 
2000 Lehigh University, Bethlehem, PA, United States 
Area:
Applied Mechanics, Mechanical Engineering, Materials Science Engineering
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9 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2014 Tsai SW, Chiu TC, Chue CH. Temperature distribution and heat flow around a crack of arbitrary orientation in a functionally graded medium Journal of Engineering Mathematics. 87: 123-137. DOI: 10.1007/S10665-013-9664-3  0.316
2014 Lai YS, Chen CH, Chiu T. Analysis of fatigue delamination growth in flip-chip package Acta Mechanica. 225: 2761-2773. DOI: 10.1007/S00707-014-1201-6  0.343
2011 Chiu T, Huang HW, Lai YS. Warpage evolution of overmolded ball grid array package during post-mold curing thermal process Microelectronics Reliability. 51: 2263-2273. DOI: 10.1016/J.Microrel.2011.06.001  0.312
2010 Chiu T, Edwards D, Ahmad M. Ball Grid Array Solder Joint Reliability Under System-Level Compressive Load Ieee Transactions On Device and Materials Reliability. 10: 324-337. DOI: 10.1109/Tdmr.2010.2049848  0.306
2009 Chiu T, Lin H. Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique International Journal of Fracture. 156: 75-96. DOI: 10.1007/S10704-009-9348-1  0.363
2008 Chiu T, Lin H. On the Homogenization of Multilayered Interconnect for Interfacial Fracture Analysis Ieee Transactions On Components and Packaging Technologies. 31: 388-398. DOI: 10.1109/Tcapt.2008.916839  0.358
2003 Erdogan F, Chiu T. Plane Strain And Axisymmetric Spallation Of Graded Coatings Under Thermal Loading Journal of Thermal Stresses. 26: 497-523. DOI: 10.1080/713855953  0.521
2003 Chiu T, Erdogan F. Debonding of graded coatings under in-plane compression International Journal of Solids and Structures. 40: 7155-7179. DOI: 10.1016/S0020-7683(03)00360-3  0.521
1999 Chiu T, Erdogan F. One-Dimensional Wave Propagation In A Functionally Graded Elastic Medium Journal of Sound and Vibration. 222: 453-487. DOI: 10.1006/Jsvi.1998.2065  0.457
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