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Boping Wu, Ph.D. - Publications

Affiliations: 
2010 University of Washington, Seattle, Seattle, WA 
Area:
Electronics and Electrical Engineering, Electricity and Magnetism Physics
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15 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2016 Wu B, Wang RC, Yang JH, Wu FY, Zhang WL, Gu XP, Zhang AC. Zr and REE mineralization in sodic lujavrite from the Saima alkaline complex, northeastern China: A mineralogical study and comparison with potassic rocks Lithos. 262: 232-246. DOI: 10.1016/j.lithos.2016.07.013  0.379
2012 Wu B, Lo HL. Methods and Designs for Improving the Signal Integrity of Vertical Interconnects in High Performance Packaging Progress in Electromagnetics Research-Pier. 123: 1-11. DOI: 10.2528/Pier11110503  0.335
2011 Wu B, Gu X, Tsang L, Ritter MB. Electromagnetic modeling of massively coupled through silicon vias for 3D interconnects Microwave and Optical Technology Letters. 53: 1204-1206. DOI: 10.1002/Mop.26021  0.648
2010 Wu B, Chang X, Tsang L, Mo T. Fast Electromagnetic Modeling of 3D Interconnects on Chip-package-board Piers Online. 6: 674-678. DOI: 10.2529/Piers091212144113  0.54
2010 Wu B, Tsang L. Signal Integrity Analysis of Package and Printed Circuit Board With Multiple Vias in Substrate of Layered Dielectrics Ieee Transactions On Advanced Packaging. 33: 510-516. DOI: 10.1109/Tadvp.2009.2026482  0.58
2009 Bagley JQ, Wu B, Tsang L. Electromagnetic fields and modal excitations on a thin silver film. Journal of the Optical Society of America. a, Optics, Image Science, and Vision. 26: 2362-7. PMID 19884933 DOI: 10.1364/Josaa.26.002362  0.583
2009 Wu B, Tsang L. FULL-WAVE MODELING OF MULTIPLE VIAS USING DIFFERENTIAL SIGNALING AND SHARED ANTIPAD IN MULTILAYERED HIGH SPEED VERTICAL INTERCONNECTS Progress in Electromagnetics Research. 97: 129-139. DOI: 10.2528/Pier09091707  0.557
2009 Kam DG, Ritter MB, Beukema TJ, Bulzacchelli JF, Pepeljugoski PK, Kwark YH, Shan L, Gu X, Baks CW, John RA, Hougham G, Schuster C, Rimolo-Donadio R, Wu B. Is 25 Gb/s on-board signaling viable? Ieee Transactions On Advanced Packaging. 32: 328-344. DOI: 10.1109/Tadvp.2008.2011138  0.487
2009 Wu B, Tsang L. Modeling Multiple Vias With Arbitrary Shape of Antipads and Pads in High Speed Interconnect Circuits Ieee Microwave and Wireless Components Letters. 19: 12-14. DOI: 10.1109/Lmwc.2008.2008532  0.545
2008 Wu B, Tsang L. Fast Computation of Layered Medium Green's Functions of Multilayers and Lossy Media Using Fast All-Modes Method and Numerical Modified Steepest Descent Path Method Ieee Transactions On Microwave Theory and Techniques. 56: 1446-1454. DOI: 10.1109/Tmtt.2008.923901  0.618
2008 Ong C, Wu B, Tsang L, Gu X. Full-Wave Solver for Microstrip Trace and Through-Hole Via in Layered Media Ieee Transactions On Advanced Packaging. 31: 292-302. DOI: 10.1109/Tadvp.2008.920374  0.621
2008 Bagley JQ, Wu B, Tsang L. Electromagnetic Fields of Hertzian Dipoles in Layered Negative Refractive Index Materials Ieee Antennas and Wireless Propagation Letters. 7: 749-752. DOI: 10.1109/Lawp.2008.2008031  0.618
2007 Tsang L, Wu B. Electromagnetic Fields of Hertzian Dipoles in Layered Media of Moderate Thickness Including the Effects of All Modes Ieee Antennas and Wireless Propagation Letters. 6: 316-319. DOI: 10.1109/Lawp.2007.899917  0.619
2007 Wu B, Tsang L, Ong C. Fast all modes (FAM) method combined with NMSP for evaluating spatial domain layered medium Green's functions of moderate thickness Microwave and Optical Technology Letters. 49: 3112-3118. DOI: 10.1002/Mop.22907  0.603
2006 Tsang L, Ong C, Wu B. Electromagnetic Fields of Hertzian Dipoles in Thin-Layered Media Ieee Antennas and Wireless Propagation Letters. 5: 537-540. DOI: 10.1109/Lawp.2006.889553  0.595
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