| Year |
Citation |
Score |
| 2018 |
Park JH, Watanabe T, Pinkowitz A, Duquette DJ, Hull R, Steingart DA, Ross FM. In situ EC-TEM Studies of Metal Thin Film Corrosion in Liquid Solutions at Elevated Temperatures Microscopy and Microanalysis. 24: 254-255. DOI: 10.1017/S1431927618001769 |
0.393 |
|
| 2016 |
Pinkowitz A, Chee SW, Engler BJ, Duquette DJ, Hull R. An In Situ Transmission Electron Microscopy Study of Localized Corrosion on Aluminum Mrs Advances. 1: 1877-1882. DOI: 10.1557/Adv.2016.334 |
0.42 |
|
| 2015 |
Chee SW, Pratt SH, Hattar K, Duquette D, Ross FM, Hull R. Studying localized corrosion using liquid cell transmission electron microscopy. Chemical Communications (Cambridge, England). 51: 168-71. PMID 25388023 DOI: 10.1039/C4Cc06443G |
0.394 |
|
| 2015 |
Wee Chee S, Park J, Pinkowitz A, Engler B, Ross FM, Duquette D, Hull R. Liquid Cell TEM of Al Thin Film Corrosion under Potentiostatic Polarization Microscopy and Microanalysis. 21: 973-974. DOI: 10.1017/S1431927615005668 |
0.39 |
|
| 2014 |
Chee SW, Duquette DJ, Ross FM, Hull R. Metastable structures in Al thin films before the onset of corrosion pitting as observed using liquid cell transmission electron microscopy. Microscopy and Microanalysis : the Official Journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada. 20: 462-8. PMID 24565052 DOI: 10.1017/S1431927614000221 |
0.424 |
|
| 2014 |
Wee Chee S, Ross FM, Duquette D, Hull R. Corrosion of metal films observed using in situ and Ex situ electron microscopy Microscopy and Microanalysis. 20: 1540-1541. DOI: 10.1017/S143192761400943X |
0.404 |
|
| 2013 |
Chee SW, Ross FM, Duquette D, Hull R. Studies of corrosion of Al thin films using liquid cell transmission electron microscopy Materials Research Society Symposium Proceedings. 1525: 12-17. DOI: 10.1557/Opl.2013.558 |
0.433 |
|
| 2013 |
Small L, Brumbach M, Apblett C, Ihlefeld JF, Brennecka G, Duquette D. On the degradation processes of thin film PZT in 0.1 N H2SO4 Journal of the Electrochemical Society. 160: C128-C135. DOI: 10.1149/2.005304Jes |
0.703 |
|
| 2013 |
Graham JT, Brennecka GL, Ferreira P, Small L, Duquette D, Apblett C, Landsberger S, Ihlefeld JF. Neutron irradiation effects on domain wall mobility and reversibility in lead zirconate titanate thin films Journal of Applied Physics. 113. DOI: 10.1063/1.4795869 |
0.697 |
|
| 2012 |
Small L, Apblett C, Ihlefeld JF, Brennecka G, Duquette DJ. Electrochemical Response of Ferroelectric PbZr0.52Ti0.48O3 Thin Films Journal of the Electrochemical Society. 159. DOI: 10.1149/2.031208Jes |
0.703 |
|
| 2012 |
Small L, Cook A, Apblett C, Ihlefeld JF, Brennecka G, Duquette D. An automated electrochemical probe for evaluation of thin films Journal of the Electrochemical Society. 159: F87-F90. DOI: 10.1149/2.007205Jes |
0.711 |
|
| 2011 |
Butail G, Ganesan PG, Raddiar M, Teki R, Ravishankar N, Duquette DJ, Ramanath G. Kinetics of titania nanotube formation by anodization of titanium films Thin Solid Films. 519: 1821-1824. DOI: 10.1016/J.Tsf.2010.10.004 |
0.325 |
|
| 2009 |
Yang L, Hawk JA, Duquette DJ, Schwant RC. Effect of microstructure and environment on static crack growth resistance in alloy 706 Journal of Materials Engineering and Performance. 18: 361-368. DOI: 10.1007/S11665-008-9297-2 |
0.318 |
|
| 2007 |
Kim S, Duquette DJ. Morphology Control of Copper Growth on TiN and TaN Diffusion Barriers in Seedless Copper Electrodeposition Journal of the Electrochemical Society. 154. DOI: 10.1149/1.2433703 |
0.417 |
|
| 2007 |
Lay NE, Ten Eyck GA, Duquette DJ, Lu TM. Direct plating of Cu on Pd plasma enhanced atomic layer deposition coated TaN Barrier Electrochemical and Solid-State Letters. 10. DOI: 10.1149/1.2388249 |
0.621 |
|
| 2007 |
Kim S, Duquette DJ. Quantitative Measurement of Interfacial Adhesion Between Seedless Electrodeposited Copper and Tantalum-Based Diffusion Barriers for Microelectronics Electrochemical and Solid State Letters. 10. DOI: 10.1149/1.2363937 |
0.376 |
|
| 2007 |
Kim S, Jang J, Lee J, Duquette DJ. Stress behavior of electrodeposited copper films as mechanical supporters for light emitting diodes Electrochimica Acta. 52: 5258-5265. DOI: 10.1016/J.Electacta.2007.02.040 |
0.414 |
|
| 2006 |
Kim S, Duquette DJ. Nucleation Characteristics of Directly Electrodeposited Copper on TiN Journal of the Electrochemical Society. 153. DOI: 10.1149/1.2219712 |
0.333 |
|
| 2006 |
Kim S, Duquette DJ. Effect of Chemical Composition on Adhesion of Directly Electrodeposited Copper Film on TiN Journal of the Electrochemical Society. 153. DOI: 10.1149/1.2189971 |
0.428 |
|
| 2006 |
Kim S, Duquette DJ. Multiple Bath Usage for Adhesion Enhancement of Directly Electrodeposited Copper on TaN Electrochemical and Solid State Letters. 9. DOI: 10.1149/1.2149208 |
0.454 |
|
| 2006 |
Kim S, Duquette DJ. Growth of conformal copper films on TaN by electrochemical deposition for ULSI interconnects Surface & Coatings Technology. 201: 2712-2716. DOI: 10.1016/J.Surfcoat.2006.05.022 |
0.49 |
|
| 2002 |
Graham L, Steinbrüchel C, Duquette DJ. Nucleation and Growth of Electrochemically Deposited Copper on TiN and Copper from a Cu NH 3 Bath Journal of the Electrochemical Society. 149. DOI: 10.1149/1.1487836 |
0.386 |
|
| 2001 |
Gill WN, Duquette DJ, Varadarajan D. Mass Transfer Models for the Electrodeposition of Copper with a Buffering Agent Journal of the Electrochemical Society. 148. DOI: 10.1149/1.1354618 |
0.332 |
|
| 2001 |
Rosecrans PM, Duquette DJ. Formation kinetics and rupture strain of Ni-Cr-Fe alloy corrosion films formed in high-temperature water Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science. 32: 3015-3021. DOI: 10.1007/S11661-001-0176-9 |
0.309 |
|
| 2000 |
Varadarajan D, Lee CY, Krishnamoorthy A, Duquette DJ, Gill WN. Tertiary current distribution model for the pulse plating of copper into high aspect ratio sub-0.25 μm trenches Journal of the Electrochemical Society. 147: 3382-3392. DOI: 10.1149/1.1393910 |
0.351 |
|
| 1996 |
Sainio CA, Duquette DJ, Steigerwald J, Murarka SP. Electrochemical effects in the chemical-mechanical polishing of copper for integrated circuits Journal of Electronic Materials. 25: 1593-1598. DOI: 10.1007/Bf02655581 |
0.375 |
|
| 1995 |
Steigerwald JM, Duquette DJ, Murarka SP, Gutmann RJ. Electrochemical Potential Measurements during the Chemical‐Mechanical Polishing of Copper Thin Films Journal of the Electrochemical Society. 142: 2379-2385. DOI: 10.1149/1.2044305 |
0.381 |
|
| 1995 |
Steigerwald JM, Murarka SP, Ho J, Gutmann RJ, Duquette DJ. Mechanisms of copper removal during chemical mechanical polishing Journal of Vacuum Science & Technology B. 13: 2215-2218. DOI: 10.1116/1.588106 |
0.377 |
|
| 1995 |
Steigerwald JM, Murarka SP, Gutmann RJ, Duquette DJ. Chemical processes in the chemical mechanical polishing of copper Materials Chemistry &Amp; Physics. 41: 217-228. DOI: 10.1016/0254-0584(95)01516-7 |
0.354 |
|
| 1995 |
Gutmann RJ, Steigerwald JM, You L, Price DT, Neirynck J, Duquette DJ, Murarka SP. Chemical-mechanical polishing of copper with oxide and polymer interlevel dielectrics Thin Solid Films. 270: 596-600. DOI: 10.1016/0040-6090(95)06717-5 |
0.317 |
|
| 1994 |
Kolaya LE, Duquette DJ, Hudson JB. The stability of MoSi 2 films in vacuum and oxidizing atmospheres Mrs Proceedings. 357: 207. DOI: 10.1557/Proc-357-207 |
0.399 |
|
| 1994 |
Steigerwald JM, Murarka SP, Duquette DJ, Gutmann RJ. Surface layer formation during the chemical mechanical polishing of copper thin films Materials Research Society Symposium - Proceedings. 337: 133-138. DOI: 10.1557/Proc-337-133 |
0.417 |
|
| 1993 |
Wu PK, Kolaya LE, Duquette DJ, Hudson JB. Interfacial Reaction Between a Sputter Deposited MoSi2 Film and its Oxidation Product on Al2O3 at 1300°C in Air. Mrs Proceedings. 317. DOI: 10.1557/Proc-317-559 |
0.418 |
|
| 1993 |
Stoloff NS, Duquette DJ. Moisture And Hydrogen-Induced Embrittlement Of Iron Aluminides Jom. 45: 30-35. DOI: 10.1007/Bf03222512 |
0.315 |
|
| 1992 |
Chen GS, Duquette DJ. Corrosion fatigue of a precipitation-hardened Al-Li-Zr alloy in a 0.5 M sodium chloride solution Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science. 23: 1563-1572. DOI: 10.1007/Bf02647338 |
0.319 |
|
| 1992 |
Chen GS, Duquette DJ. The effect of aging on the hydrogen-assisted fatigue cracking of a precipitation-hardened Al-Li-Zr alloy Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science. 23: 1551-1562. DOI: 10.1007/Bf02647337 |
0.32 |
|
| 1990 |
Wrisley KL, Duquette DJ, Steiner D, Motyka EF, Coomer ED. Corrosion studies of a stainless steel structure for the ITER aqueous lithium salt blanket concept Fusion Engineering and Design. 13: 45-52. DOI: 10.1016/0920-3796(90)90031-Z |
0.347 |
|
| 1990 |
Matuszyk W, Camus G, Duquette DJ, Stoloff NS. Effects of temperature and environment on the tensile and fatigue crack growth behavior of a Ni3AI-base alloy Metallurgical Transactions. a, Physical Metallurgy and Materials Science. 21: 2967-2976. DOI: 10.1007/Bf02647217 |
0.301 |
|
| 1989 |
Lambert MR, Duquette DJ. A study of electroless nickel coatings containing low phosphorus Thin Solid Films. 177: 207-223. DOI: 10.1016/0040-6090(89)90568-3 |
0.34 |
|
| 1986 |
Smith EF, Duquette DJ. The effect of cathodic polarization on the corrosion fatigue behavior of a precipitation hardened aluminum alloy Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science. 17: 339-347. DOI: 10.1007/Bf02643910 |
0.332 |
|
| 1980 |
Gaul DJ, Duquette DJ. Cyclic wear behavior (fretting) of a tempered martensite steel Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science. 11: 1581-1588. DOI: 10.1007/Bf02654522 |
0.334 |
|
| 1979 |
Hahn HN, Duquette DJ. The effect of heat treatment on the fatigue and corrosion fatigue behavior of a CuNiCr alloy Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science. 10: 1453-1460. DOI: 10.1007/Bf02812010 |
0.342 |
|
| 1978 |
Koburger CW, Duquette DJ, Stoloff NS. The effects of microstructure on the fatigue of Co, Cr, Ni-TaC eutectic alloys Acta Metallurgica. 26: 81-91. DOI: 10.1016/0001-6160(78)90203-1 |
0.31 |
|
| 1978 |
Hahn HN, Duquette DJ. The effect of surface dissolution on fatigue deformation and crack nucleation in copper and copper 8% aluminum single crystals Acta Metallurgica. 26: 279-287. DOI: 10.1016/0001-6160(78)90128-1 |
0.319 |
|
| 1977 |
Jacko RJ, Duquette DJ. Hydrogen Embrittlement of a Cyclically Deformed High Strength Al Alloy. Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science. 8: 1821-1827. DOI: 10.1007/Bf02646889 |
0.326 |
|
| 1976 |
Duquette DJ, Swann PR. An electron microscopic examination of pre-crack fatigue damage in age hardened Al 5.0 wt.% Zn 2.5 wt.% Mg Acta Metallurgica. 24: 241-248. DOI: 10.1016/0001-6160(76)90074-2 |
0.314 |
|
| 1975 |
Masuda H, Duquette DJ. The effect of surface dissolution on fatigue crack nucleation in polycrystalline copper Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science. 6: 87-94. DOI: 10.1007/Bf02673674 |
0.302 |
|
| 1973 |
Stoloff NS, Duquette DJ. Microstructural effects in the fatigue behavior of metals and alloys Critical Reviews in Solid State and Materials Sciences. 4: 615-687. DOI: 10.1080/10408437308245845 |
0.319 |
|
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