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Kuang-Chien Hsieh - Publications

Affiliations: 
University of Illinois, Urbana-Champaign, Urbana-Champaign, IL 
Area:
Materials Science Engineering, Electronics and Electrical Engineering
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3 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2007 Shi FF, Bulkowski M, Hsieh KC. Synthesis of indium nanoclusters and formation of thin film contacts on plastic substrates for organic and flexible electronics applications. Nanotechnology. 18: 265301. PMID 21730395 DOI: 10.1088/0957-4484/18/26/265301  0.363
2003 Shi F, MacLaren S, Xu C, Cheng KY, Hsieh KC. Hybrid-integrated GaAs/GaAs and InP/GaAs semiconductors through wafer bonding technology: Interface adhesion and mechanical strength Journal of Applied Physics. 93: 5750-5756. DOI: 10.1063/1.1563825  0.397
2002 Shi F, Chang K, Epple J, Xu C, Cheng KY, Hsieh KC. Characterization of GaAs-based n-n and p-n interface junctions prepared by direct wafer bonding Journal of Applied Physics. 92: 7544-7549. DOI: 10.1063/1.1522484  0.391
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