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William Robert Davis - Publications

Affiliations: 
1957- Physics North Carolina State University, Raleigh, NC 
Area:
mathematical physics
Website:
https://physics.sciences.ncsu.edu/people/wmrdavis/
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8 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2019 Park JB, Davis WR, Franzon PD. 3-D-DATE: A Circuit-Level Three-Dimensional DRAM Area, Timing, and Energy Model Ieee Transactions On Circuits and Systems I: Regular Papers. 66: 756-768. DOI: 10.1109/Tcsi.2018.2868901  0.314
2014 Chen X, Zhu T, Davis WR, Franzon PD. Adaptive and reliable clock distribution design for 3-D integrated circuits Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1862-1870. DOI: 10.1109/Tcpmt.2014.2361356  0.328
2012 Harris TR, Priyadarshi S, Melamed S, Ortega C, Manohar R, Dooley SR, Kriplani NM, Davis WR, Franzon PD, Steer MB. A transient electrothermal analysis of three-dimensional integrated circuits Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 660-667. DOI: 10.1109/Tcpmt.2011.2178414  0.325
2012 Priyadarshi S, Saunders CS, Kriplani NM, Demircioglu H, Davis WR, Franzon PD, Steer MB. Parallel transient simulation of multiphysics circuits using delay-based partitioning Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 31: 1522-1535. DOI: 10.1109/Tcad.2012.2201156  0.323
2012 Melamed S, Thorolfsson T, Harris TR, Priyadarshi S, Franzon P, Steer MB, Davis WR. Junction-level thermal analysis of 3-d integrated circuits using high definition power blurring Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 31: 676-689. DOI: 10.1109/Tcad.2011.2180384  0.335
2012 Priyadarshi S, Harris TR, Melamed S, Otero C, Kriplani NM, Christoffersen CE, Manohar R, Dooley SR, Davis WR, Franzon PD, Steer MB. Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels Iet Circuits, Devices and Systems. 6: 35-44. DOI: 10.1049/Iet-Cds.2011.0061  0.335
2011 Chen X, Zhu T, Davis WR. Three-dimensional SRAM design with on-chip access time measurement Electronics Letters. 47: 485-486. DOI: 10.1049/El.2010.3701  0.321
2009 Davis WR, Oh EC, Sule AM, Franzon PD. Application exploration for 3-D integrated circuits: TCAM, FIFO, and FFT case studies Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 17: 496-506. DOI: 10.1109/Tvlsi.2008.2009352  0.344
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