| Year |
Citation |
Score |
| 2017 |
Piotter V, Eberl C, Kraft O. Miniaturisation? Yes, please! German Research. 39: 26-29. DOI: 10.1002/germ.201770208 |
0.539 |
|
| 2016 |
Slaby SA, Kraft O, Eberl C. Fatigue properties of conventionally manufactured and micro‐powder‐injection‐moulded 17‐4PH micro‐components Fatigue & Fracture of Engineering Materials & Structures. 39: 780-789. DOI: 10.1111/FFE.12416 |
0.612 |
|
| 2015 |
Leisen D, Rusanov R, Rohlfing F, Fuchs T, Eberl C, Riesch-Oppermann H, Kraft O. Mechanical characterization between room temperature and 1000 °C of SiC free-standing thin films by a novel high-temperature micro-tensile setup. The Review of Scientific Instruments. 86: 055104. PMID 26026555 DOI: 10.1063/1.4919765 |
0.661 |
|
| 2014 |
Kim BJ, Haas T, Friederich A, Lee JH, Nam DH, Binder JR, Bauer W, Choi IS, Joo YC, Gruber PA, Kraft O. Improving mechanical fatigue resistance by optimizing the nanoporous structure of inkjet-printed Ag electrodes for flexible devices. Nanotechnology. 25: 125706. PMID 24577219 DOI: 10.1088/0957-4484/25/12/125706 |
0.681 |
|
| 2014 |
Ulas S, Bundschuh S, Jester SS, Eberl C, Kraft O, Hölscher H, Böttcher A, Kappes MM. Mechanical properties of C58 materials and their dependence on thermal treatment Carbon. 68: 125-137. DOI: 10.1016/j.carbon.2013.10.072 |
0.585 |
|
| 2014 |
Yoo BG, Boles ST, Liu Y, Zhang X, Schwaiger R, Eberl C, Kraft O. Quantitative damage and detwinning analysis of nanotwinned copper foil under cyclic loading Acta Materialia. 81: 184-193. DOI: 10.1016/J.Actamat.2014.08.021 |
0.633 |
|
| 2012 |
Eber C, Courty D, Walcker A, Kraft O. Stress-gradient induced fatigue at ultra high frequencies in sub micron thin metal films International Journal of Materials Research. 103: 80-86. DOI: 10.3139/146.110635 |
0.329 |
|
| 2011 |
Burger S, Eberl C, Siegel A, Ludwig A, Kraft O. A novel high-throughput fatigue testing method for metallic thin films. Science and Technology of Advanced Materials. 12: 054202. PMID 27877429 DOI: 10.1088/1468-6996/12/5/054202 |
0.366 |
|
| 2011 |
Burger S, Rupp B, Ludwig A, Kraft O, Eberl C. Fatigue testing of thin films Key Engineering Materials. 465: 552-555. DOI: 10.4028/www.scientific.net/KEM.465.552 |
0.67 |
|
| 2011 |
Burger S, Eberl C, Siegel A, Ludwig A, Kraft O. A novel high-throughput fatigue testing method for metallic thin films Science and Technology of Advanced Materials. 12. DOI: 10.1088/1468-6996/12/5/054202 |
0.664 |
|
| 2010 |
Eberl C, Riesch-Oppermann H, Spolenak R, Kubat F, Ruile W, Courty D, Kraft O. In situ Observations and Quantitative Analysis of Short Circuit Probability Due to Ultrahigh Frequency Fatigue Ieee Transactions On Device and Materials Reliability. 10: 366-373. DOI: 10.1109/Tdmr.2010.2047945 |
0.721 |
|
| 2010 |
Clark BG, Gianola DS, Kraft O, Frick CP. Size independent shape memory behavior of nickel-titanium Advanced Engineering Materials. 12: 808-815. DOI: 10.1002/Adem.201000048 |
0.598 |
|
| 2009 |
Schneider AS, Kaufmann D, Clark BG, Frick CP, Gruber PA, Mönig R, Kraft O, Arzt E. Correlation between critical temperature and strength of small-scale bcc pillars. Physical Review Letters. 103: 105501. PMID 19792329 DOI: 10.1103/Physrevlett.103.105501 |
0.671 |
|
| 2008 |
Lohmiller J, Eberl C, Schwaiger R, Kraft O, Balk TJ. Mechanical spectroscopy of nanocrystalline nickel near room temperature Scripta Materialia. 59: 467-470. DOI: 10.1016/j.scriptamat.2008.04.031 |
0.617 |
|
| 2007 |
Eberl C, Spolenak R, Kraft O, Ruile W, Arzt E. Fatigue damage in thin film Al interconnects at ultra high frequency: A finite element analysis approach Thin Solid Films. 515: 3291-3297. DOI: 10.1016/J.Tsf.2006.01.042 |
0.753 |
|
| 2007 |
Zhang G, Volkert C, Schwaiger R, Mönig R, Kraft O. Fatigue and thermal fatigue damage analysis of thin metal films Microelectronics Reliability. 47: 2007-2013. DOI: 10.1016/j.microrel.2007.04.005 |
0.301 |
|
| 2006 |
Eve S, Huber N, Kraft O, Last A, Rabus D, Schlagenhof M. Development and validation of an experimental setup for the biaxial fatigue testing of metal thin films Review of Scientific Instruments. 77: 103902. DOI: 10.1063/1.2357313 |
0.309 |
|
| 2006 |
Eberl C, Spolenak R, Kraft O, Kubat F, Ruile W, Arzt E. Damage analysis in Al thin films fatigued at ultrahigh frequencies Journal of Applied Physics. 99: 113501. DOI: 10.1063/1.2189970 |
0.78 |
|
| 2006 |
Eberl C, Spolenak R, Arzt E, Kubat F, Leidl A, Ruile W, Kraft O. Ultra high-cycle fatigue in pure Al thin films and line structures Materials Science and Engineering: A. 421: 68-76. DOI: 10.1016/J.Msea.2005.10.007 |
0.761 |
|
| 2006 |
Zhang GP, Volkert CA, Schwaiger R, Wellner P, Arzt E, Kraft O. Length-scale-controlled fatigue mechanisms in thin copper films Acta Materialia. 54: 3127-3139. DOI: 10.1016/J.Actamat.2006.03.013 |
0.558 |
|
| 2005 |
Zhang GP, Volkert CA, Schwaiger R, Arzt E, Kraft O. Damage behavior of 200-nm thin copper films under cyclic loading Journal of Materials Research. 20: 201-207. DOI: 10.1557/Jmr.2005.0019 |
0.574 |
|
| 2005 |
Vogel M, Kraft O, Arzt E. Effect of calcium additions on the creep behavior of magnesium die-cast alloy ZA85 Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science. 36: 1713-1719. DOI: 10.1007/S11661-005-0035-1 |
0.488 |
|
| 2004 |
Wellner P, Dehm G, Kraft O, Arzt E. Size effects in the plastic deformation of NiAl thin films Zeitschrift Fur Metallkunde. 95: 769-778. DOI: 10.3139/146.018020 |
0.569 |
|
| 2004 |
Dehm G, Riethmüller J, Wellner P, Kraft O, Clemens H, Arzt E. Microstructure and Thermo-Mechanical Behavior of NiAl Coatings Mrs Proceedings. 842: 73-78. DOI: 10.1557/Proc-842-S1.3 |
0.466 |
|
| 2004 |
Schwaiger R, Kraft O. Analyzing the mechanical behavior of thin films using nanoindentation, cantilever microbeam deflection, and finite element modeling Journal of Materials Research. 19: 315-324. DOI: 10.1557/JMR.2004.19.1.315 |
0.344 |
|
| 2004 |
Hyun S, Kraft O, Vinci RP. Mechanical behavior of Pt and Pt–Ru solid solution alloy thin films Acta Materialia. 52: 4199-4211. DOI: 10.1016/J.Actamat.2004.05.034 |
0.308 |
|
| 2004 |
Wellner P, Kraft O, Dehm G, Andersons J, Arzt E. Channel cracking of β-NiAl thin films on Si substrates Acta Materialia. 52: 2325-2336. DOI: 10.1016/J.Actamat.2004.01.023 |
0.561 |
|
| 2003 |
Vogel M, Kraft O, Staron P, Clemens H, Rauh R, Arzt E. Microstructure of die-cast alloys Mg-Zn-Al(-Ca): A study by electron microscopy and small-angle neutron scattering Zeitschrift Fur Metallkunde. 94: 564-571. DOI: 10.3139/146.030564 |
0.458 |
|
| 2003 |
Zhang GP, Schwaiger R, Volkert CA, Kraft O. Effect of film thickness and grain size on fatigue-induced dislocation structures in Cu thin films Philosophical Magazine Letters. 83: 477-483. DOI: 10.1080/0950083031000151383 |
0.336 |
|
| 2003 |
Hesemann HT, Müllner P, Kraft O, Arzt E. Nucleation model for hcp martensite: Application to Co thin films Journal De Physique Iv. 112: 107-110. DOI: 10.1051/Jp4:2003844 |
0.516 |
|
| 2003 |
Hesemann HT, Müllner P, Kraft O, Nowak D, Baker SP, Finkelstein K, Arzt E. Texture dependence of the martensitic transformation in cobalt thin films Scripta Materialia. 48: 1129-1133. DOI: 10.1016/S1359-6462(02)00603-6 |
0.501 |
|
| 2003 |
Vogel M, Kraft O, Arzt E. Creep behavior of magnesium die-cast alloy ZA85 Scripta Materialia. 48: 985-990. DOI: 10.1016/S1359-6462(02)00588-2 |
0.5 |
|
| 2003 |
Haag M, Wanner A, Clemens H, Zhang P, Kraft O, Arzt E. Creep of aluminum-based closed-cell foams Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science. 34: 2809-2817. DOI: 10.1007/S11661-003-0182-1 |
0.5 |
|
| 2002 |
Kraft O, Wellner P, Hommel M, Schwaiger R, Arzt E. Fatigue behavior of polycrystalline thin copper films Zeitschrift Fur Metallkunde. 93: 392-400. DOI: 10.3139/146.020392 |
0.579 |
|
| 2002 |
Kraft O, Freund LB, Phillips R, Arzt E. Dislocation Plasticity in Thin Metal Films Mrs Bulletin. 27: 30-37. DOI: 10.1557/Mrs2002.17 |
0.563 |
|
| 2002 |
Weiss D, Kraft O, Arzt E. Grain-boundary Voiding in Self-passivated Cu–1 at.% Al Alloy Films on Si Substrates Journal of Materials Research. 17: 1363-1370. DOI: 10.1557/Jmr.2002.0203 |
0.566 |
|
| 2002 |
Zhang P, Haag M, Kraft O, Wanner A, Arzt E. Microstructural changes in the cell walls of a closed-cell aluminium foam during creep Philosophical Magazine. 82: 2895-2907. DOI: 10.1080/01418610208239623 |
0.486 |
|
| 2001 |
Wellner P, Kraft O, Arzt E. The Role of Chemical Composition for the Ductility and Microstructure of Thin NiAl Films Mrs Proceedings. 695. DOI: 10.1557/Proc-695-L9.6.1 |
0.563 |
|
| 2001 |
Vogel M, Kraft O, Dehm G, Arzt E. Quasi-crystalline grain-boundary phase in the magnesium die- cast alloy ZA85 Scripta Materialia. 45: 517-524. DOI: 10.1016/S1359-6462(01)01052-1 |
0.466 |
|
| 2001 |
Arzt E, Dehm G, Gumbsch P, Kraft O, Weiss D. Interface controlled plasticity in metals: dispersion hardening and thin film deformation Progress in Materials Science. 46: 283-307. DOI: 10.1016/S0079-6425(00)00015-3 |
0.551 |
|
| 2000 |
Kraft O, Hommel M, Arzt E. X-ray diffraction as a tool to study the mechanical behaviour of thin films Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 288: 209-216. DOI: 10.1016/S0921-5093(00)00876-5 |
0.552 |
|
| 1999 |
Hesemann HT, Müllner P, Kraft O, Arzt E. The Effect of Film Thickness on Stress and Transformation Behavior in Cobalt Thin Films Mrs Proceedings. 594: 219. DOI: 10.1557/Proc-594-219 |
0.545 |
|
| 1999 |
Rodbell KP, Weiss D, Kraft O, Arzt E. Microstructural Development of Dispersion Strengthened Cu Thin Films Mrs Proceedings. 562: 257-262. DOI: 10.1557/Proc-562-257 |
0.516 |
|
| 1999 |
Hommel M, Kraft O, Arzt E. A New Method To Study Cyclic Deformation Of Thin Films In Tension And Compression Journal of Materials Research. 14: 2373-2376. DOI: 10.1557/Jmr.1999.0317 |
0.567 |
|
| 1998 |
Hommel M, Kraft O, Baker SP, Arzt E. Micro-Tensile and Fatigue Testing of Copper Thin Films on Substrates Mrs Proceedings. 546. DOI: 10.1557/Proc-546-133 |
0.549 |
|
| 1998 |
Spolenak R, Mason J, Kraft O, Arzt E. Copper Versus Magnesium as an Alloying Element in Aluminum Interconnects: Effects on Electromigration Mrs Proceedings. 516. DOI: 10.1557/Proc-516-269 |
0.625 |
|
| 1998 |
Kraft O, Nix WD. Measurement of the lattice thermal expansion coefficients of thin metal films on substrates Journal of Applied Physics. 83: 3035-3038. DOI: 10.1063/1.367118 |
0.333 |
|
| 1998 |
Kraft O, Arzt E. Current density and line width effects in electromigration: a new damage-based lifetime model Acta Materialia. 46: 3733-3743. DOI: 10.1016/S1359-6454(97)00245-0 |
0.472 |
|
| 1998 |
Spolenak R, Kraft O, Arzt E. Effects of alloying elements on electromigration Microelectronics Reliability. 38: 1015-1020. DOI: 10.1016/S0026-2714(98)00110-3 |
0.633 |
|
| 1997 |
Kraft O, Sanchez JE, Bauer M, Arzt E. Quantitative Analysis of Electromigration Damage in Al-based Conductor Lines Journal of Materials Research. 12: 2027-2037. DOI: 10.1557/Jmr.1997.0272 |
0.473 |
|
| 1997 |
Kraft O, Arzt E. Electromigration mechanisms in conductor lines: Void shape changes and slit-like failure Acta Materialia. 45: 1599-1611. DOI: 10.1016/S1359-6454(96)00231-5 |
0.477 |
|
| 1996 |
Keller R-, Sigle W, Baker SP, Kraft O, Arzt E. In-Situ Tem Investigation During Thermal Cycling of thin Copper Films Mrs Proceedings. 436. DOI: 10.1557/Proc-436-221 |
0.558 |
|
| 1996 |
Kirchner S, Kraft O, Baker SP, Arzt E. Microstructure and Mechanical Properties of Thin Al-Si-Ge Films Mrs Proceedings. 436. DOI: 10.1557/Proc-436-21 |
0.55 |
|
| 1996 |
Kraft O, Mockl UE, Arzt E. Numerical Simulation of Surface Diffusion Controlled Motion and Shape Change of Electromigration Voids Mrs Proceedings. 428. DOI: 10.1557/Proc-428-161 |
0.39 |
|
| 1995 |
Kraft O, Arzt E. Numerical simulation of electromigration‐induced shape changes of voids in bamboo lines Applied Physics Letters. 66: 2063-2065. DOI: 10.1063/1.113903 |
0.455 |
|
| 1995 |
Kraft O, Möckl UE, Arzt E. Shape changes of voids in bamboo lines: A new electromigration failure mechanism Quality and Reliability Engineering International. 11: 279-283. DOI: 10.1002/Qre.4680110412 |
0.449 |
|
| 1994 |
Arzt E, Kraft O, MÖckl UE. Electromigration Damage in Conductor Lines: Recent Progress in Microscopic Observation and Mechanistic Modelling Mrs Proceedings. 338: 397. DOI: 10.1557/Proc-338-397 |
0.436 |
|
| 1994 |
Möckl UE, Bauer M, Kraft O, Sanchez JE, Arzt E. Detailed Study of Electromigration Induced Damage in Al and AlCuSi Interconnects Mrs Proceedings. 338: 373. DOI: 10.1557/Proc-338-373 |
0.472 |
|
| 1994 |
Arzt E, Kraft O, Nix WD, Sanchez JE. Electromigration failure by shape change of voids in bamboo lines Journal of Applied Physics. 76: 1563-1571. DOI: 10.1063/1.357734 |
0.461 |
|
| 1993 |
Kraft O, Bader S, Sanchez JE, Arzt E. Observation and Modelling of Electromigration-Induced Void growth in Al-Based Interconnects Mrs Proceedings. 309: 199. DOI: 10.1557/Proc-309-199 |
0.537 |
|
| 1992 |
Kraft O, Sanchez JE, Arzt E. Quantitative analysis of electromigration-induced damage in Al-based interconnects Mrs Proceedings. 265: 119. DOI: 10.1557/Proc-265-119 |
0.488 |
|
| 1992 |
Sanchez JE, Kraft O, Arzt E. Electromigration induced transgranular slit failures in near bamboo Al and Al-2% Cu thin-film interconnects Applied Physics Letters. 61: 3121-3123. DOI: 10.1063/1.107980 |
0.55 |
|
| 1991 |
Arzt E, Kraft O, Sanchez J, Bader S, Nix WD. Electromigration Resistance and Mechanical Strength: New Perspectives for Interconnect Materials? Mrs Proceedings. 239. DOI: 10.1557/Proc-239-677 |
0.551 |
|
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