| Year |
Citation |
Score |
| 2009 |
Allard LF, Bigelow WC, Jose-Yacaman M, Nackashi DP, Damiano J, Mick SE. A new MEMS-based system for ultra-high-resolution imaging at elevated temperatures. Microscopy Research and Technique. 72: 208-15. PMID 19165742 DOI: 10.1002/Jemt.20673 |
0.703 |
|
| 2008 |
Chandrasekar K, Wilson J, Erickson E, Feng Z, Xu J, Mick S, Franzon P. Inductively coupled connectors and sockets for multi-Gb/s pulse signaling Ieee Transactions On Advanced Packaging. 31: 749-758. DOI: 10.1109/Tadvp.2008.2005465 |
0.662 |
|
| 2008 |
Damiano J, Nackashi DP, Mick SE. A MEMS-based technology platform for in-situ TEM heating studies Microscopy and Microanalysis. 14: 1332-1333. DOI: 10.1017/S1431927608088363 |
0.69 |
|
| 2008 |
Allard LF, Bigelow WC, Nackashi D, Damiano J, Mick SE. A new paradigm for ultra-high-resolution imaging at elevated temperatures Microscopy and Microanalysis. 14: 792-793. DOI: 10.1017/S1431927608086406 |
0.68 |
|
| 2007 |
Quispe J, Damiano J, Mick SE, Nackashi DP, Fellmann D, Ajero TG, Carragher B, Potter CS. An improved holey carbon film for cryo-electron microscopy. Microscopy and Microanalysis : the Official Journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada. 13: 365-71. PMID 17900388 DOI: 10.1017/S1431927607070791 |
0.658 |
|
| 2007 |
Wilson JM, Mick SE, Xu J, Luo L, Erickson EL, Franzon PD. Considerations for transmission line design on MCMs using AC coupled interconnect with buried solder bumps Proceedings - 10th Ieee Workshop On Signal Propagation On Interconnects, Spi 2006. 281-282. DOI: 10.1109/SPI.2006.289245 |
0.722 |
|
| 2006 |
Luo L, Wilson JM, Mick SE, Xu J, Zhang L, Franzon PD. 3 gb/s AC coupled chip-to-chip communication using a low swing pulse receiver Ieee Journal of Solid-State Circuits. 41: 287-296. DOI: 10.1109/JSSC.2005.859881 |
0.578 |
|
| 2006 |
Luo L, Wilson J, Mick S, Xu J, Zhang L, Erickson E, Franzon P. A 36Gb/s ACCI multi-channel bus using a fully differential pulse receiver Proceedings of the Custom Integrated Circuits Conference. 773-776. DOI: 10.1109/CICC.2006.320976 |
0.55 |
|
| 2005 |
Wilson J, Mick S, Xu J, Luo L, Bonafede S, Huffman A, LaBennett R, Franzon P. Fully integrated AC coupled interconnect using buried bumps Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 2005: 7-10. DOI: 10.1109/Tadvp.2007.896920 |
0.604 |
|
| 2005 |
Davis WR, Wilson J, Mick S, Xu J, Hua H, Mineo C, Sule AM, Steer M, Franzon PD. Demystifying 3D ICs: The pros and cons of going vertical Ieee Design and Test of Computers. 22: 498-510. DOI: 10.1109/Mdt.2005.136 |
0.558 |
|
| 2005 |
Luo L, Wilson JM, Mick SE, Xu J, Zhang L, Franzon PD. 3Gb/s AC-coupled chip-to-chip communication using a low-swing pulse receiver Digest of Technical Papers - Ieee International Solid-State Circuits Conference. 48. |
0.584 |
|
| 2004 |
Franzon P, Mick S, Wilson J, Luo L, Chandrasakhar K. AC Coupled Interconnect for high-density high-bandwidth packaging Proceedings of Spie - the International Society For Optical Engineering. 5274: 67-69. DOI: 10.7567/Ssdm.2003.G-6-1 |
0.627 |
|
| 2004 |
Kim T, Nath J, Wilson J, Mick S, Franzon PD, Steer MB, Kingon AI. A High K Nanocomposite for High Density Chip-to-Package Interconnections Mrs Proceedings. 833. DOI: 10.1557/Proc-833-G5.9 |
0.384 |
|
| 2004 |
Mohan R, Choi MJ, Mick SE, Hart FP, Chandrasekar K, Cangellaris AC, Franzon PD, Steer MB. Causal reduced-order modeling of distributed structures in a transient circuit simulator Ieee Transactions On Microwave Theory and Techniques. 52: 2207-2214. DOI: 10.1109/Tmtt.2004.834588 |
0.572 |
|
| 2003 |
Franzon P, Kingon A, Mick S, Wilson J, Luo L, Chandrasakhar K, Xu J, Bonafede S, Huffman A, Statler C, LaBennett R. High Frequency, High Density Interconnect Using AC Coupling Mrs Proceedings. 783. DOI: 10.1557/Proc-783-B6.1 |
0.618 |
|
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