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Michael Liehr - Publications

Affiliations: 
2011- Nanoscale Science and Engineering-Nanoscale Engineering State University of New York, Albany, Albany, NY, United States 
Area:
Electronics and Electrical Engineering, Electricity and Magnetism Physics
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9 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2018 Adamshick S, Northrup S, Liehr M. Experimental characterisation of coaxial TSV transistor keep out zones Micro & Nano Letters. 13: 1457-1459. DOI: 10.1049/Mnl.2018.5280  0.387
2017 Adamshick S, Burke J, Liehr M. Fabrication method for annular/shielded copper interconnects Micro & Nano Letters. 12: 301-303. DOI: 10.1049/Mnl.2016.0462  0.357
2016 Liehr M. Merging photonics with nanoelectronics (Conference Presentation) Proceedings of Spie. 9750: 975002. DOI: 10.1117/12.2225039  0.348
2016 Koch TL, Liehr M, Coolbaugh D, Bowers JE, Alferness R, Watts M, Kimerling L. The American Institute for Manufacturing Integrated Photonics: Advancing the ecosystem Proceedings of Spie - the International Society For Optical Engineering. 9772. DOI: 10.1117/12.2220457  0.341
2015 Montgomery W, Chun JS, Liehr M, Tittnich M. The Patterning Center of Excellence (CoE): An evolving lithographic enablement model Proceedings of Spie - the International Society For Optical Engineering. 9422. DOI: 10.1117/12.2175733  0.32
2015 Adamshick S, Coolbaugh D, Liehr M. Experimental characterization of coaxial through silicon vias for 3D integration Microelectronics Journal. 46: 377-382. DOI: 10.1016/J.Mejo.2015.02.011  0.365
2014 Adamshick S, Carroll R, Rao M, La Tulipe D, Kruger S, Burke J, Liehr M. High frequency electrical characterization of 3D signal/ground through silicon vias Progress in Electromagnetics Research Letters. 47: 71-75. DOI: 10.2528/Pierl14052704  0.359
2013 Adamshick S, Coolbaugh D, Liehr M. Feasibility of coaxial through silicon via 3D integration Electronics Letters. 49: 1028-1030. DOI: 10.1049/El.2013.1165  0.383
2011 Montgomery W, Rice B, Brilla R, Liehr M, Tittnich M. Enabling EUV materials introduction: An evolutionary process Journal of Photopolymer Science and Technology. 24: 193-198. DOI: 10.2494/Photopolymer.24.193  0.304
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