| Year |
Citation |
Score |
| 2017 |
Chen K, Sun T. Effects of microstructure design on aluminum surface hydrophobic and ice‐retarding properties Asia-Pacific Journal of Chemical Engineering. 12: 307-312. DOI: 10.1002/Apj.2073 |
0.303 |
|
| 2012 |
Sun T, Zhuang Y, Li W, Philipossian A. Investigation of eccentric PVA brush behaviors in post-Cu CMP cleaning Microelectronic Engineering. 100: 20-24. DOI: 10.1016/J.Mee.2012.07.107 |
0.542 |
|
| 2010 |
Borucki LJ, Sun T, Zhuang Y, Slutz D, Philipossian A. Pad topography, contact area and hydrodynamic lubrication in chemical-mechanical polishing Materials Research Society Symposium Proceedings. 1157: 9-14. DOI: 10.1557/Proc-1157-E01-02 |
0.563 |
|
| 2010 |
Sun T, Zhuang Y, Borucki L, Philipossian A. Characterization of pad-wafer contact and surface topography in chemical mechanical planarization using laser confocal microscopy Japanese Journal of Applied Physics. 49: 0665011-0665014. DOI: 10.1143/Jjap.49.066501 |
0.577 |
|
| 2010 |
Sun T, Zhuang Y, Borucki L, Philipossian A. Optical and mechanical characterization of chemical mechanical planarization pad surfaces Japanese Journal of Applied Physics. 49: 0465011-0465015. DOI: 10.1143/Jjap.49.046501 |
0.575 |
|
| 2010 |
Sun T, Borucki L, Zhuang Y, Sampurno Y, Sudargho F, Wei X, Anjur S, Philipossian A. Investigating effect of conditioner aggressiveness on removal rate during interlayer dielectric chemical mechanical planarization through confocal microscopy and dual emission ultraviolet-enhanced fluorescence imaging Japanese Journal of Applied Physics. 49. DOI: 10.1143/Jjap.49.026501 |
0.69 |
|
| 2010 |
Sun T, Borucki L, Zhuang Y, Philipossian A. Investigating the effect of diamond size and conditioning force on chemical mechanical planarization pad topography Microelectronic Engineering. 87: 553-559. DOI: 10.1016/J.Mee.2009.08.007 |
0.556 |
|
| 2009 |
Sampurno Y, Zhuang Y, Gu X, Theng S, Nemoto T, Sun T, Sudargho F, Teramoto A, Philipossian A, Ohmi T. Effect of various cleaning solutions and brush scrubber kinematics on the frictional attributes of post copper CMP cleaning process Solid State Phenomena. 145: 363-366. DOI: 10.4028/Www.Scientific.Net/Ssp.145-146.363 |
0.66 |
|
| 2009 |
Philipossian A, Sun T. Frictional analysis of various poly(vinyl alcohol) brush roller designs for post-interlevel dielectric cmp scrubbing applications Electrochemical and Solid-State Letters. 12. DOI: 10.1149/1.3058994 |
0.544 |
|
| 2008 |
Sun T, Philipossian A. Method for determining the lubrication mechanism of post-ILD CMP brush scrubbing Electrochemical and Solid-State Letters. 11. DOI: 10.1149/1.2929065 |
0.543 |
|
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