Rensheng Sun, Ph.D. - Publications
Affiliations: | 2005 | Michigan State University, East Lansing, MI |
Area:
Electronics and Electrical Engineering, Chemical Engineering, Mechanical EngineeringYear | Citation | Score | |||
---|---|---|---|---|---|
2009 | Sun R, Kempel LC, Zong L, Hawley MC, Benard A. Coupled electromagnetic thermal and kinetic modeling for microwave processing of polymers with temperature- and cure-dependent permittivity using 3D FEM International Journal of Applied Electromagnetics and Mechanics. 30: 9-28. DOI: 10.3233/Jae-2009-1033 | 0.537 | |||
2009 | Zobg L, Hawley MC, Sun R, Kempel LC. Dielectric relaxation of curing DGEBA/mPDA system at 2.45 GHz Journal of Thermoplastic Composite Materials. 22: 249-257. DOI: 10.1177/0892705708093501 | 0.598 | |||
2005 | Zong L, Zhou S, Sgriccia N, Hawley MC, Sun R, Kempel LC. Dielectric properties of an epoxy-amine system at a high microwave frequency Polymer Engineering and Science. 45: 1576-1580. DOI: 10.1002/Pen.20345 | 0.608 | |||
2004 | Zong L, Zhou S, Sun R, Kempel LC, Hawley MC. Dielectric analysis of a crosslinking epoxy resin at a high microwave frequency Journal of Polymer Science, Part B: Polymer Physics. 42: 2871-2877. DOI: 10.1002/Polb.20154 | 0.6 | |||
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