Anjali Chauhan, Ph.D. - Publications
Affiliations: | 2014 | Mechanical Engineering | State University of New York at Binghamton, Vestal, NY, United States |
Area:
Mechanical Engineering, Computer Science, Computer EngineeringYear | Citation | Score | |||
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2013 | Chauhan A, Sammakia B, Afram FF, Ghose K, Refai-Ahmed G, Agonafer D. Solving thermal issues in a three-dimensional-stacked-quad-core processor by microprocessor floor planning, microchannel cooling, and insertion of through-silicon-vias Journal of Electronic Packaging, Transactions of the Asme. 135. DOI: 10.1115/1.4025531 | 0.436 | |||
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