Year |
Citation |
Score |
2019 |
Wu Y, Ding F, Connelly D, Chiang M, Chen JF, Liu TK. Simulation-Based Study of High-Density SRAM Voltage Scaling Enabled by Inserted-Oxide FinFET Technology Ieee Transactions On Electron Devices. 66: 1754-1759. DOI: 10.1109/Ted.2019.2900921 |
0.448 |
|
2018 |
Hsieh Y, Chen S, Chen N, Lee W, Tsai J, Chen C, Chiang M, Lu DD, Kao K. An FET With a Source Tunneling Barrier Showing Suppressed Short-Channel Effects for Low-Power Applications Ieee Transactions On Electron Devices. 65: 855-859. DOI: 10.1109/Ted.2018.2791467 |
0.357 |
|
2017 |
Wu Y, Ding F, Connelly D, Zheng P, Chiang M, Chen JF, Liu TK. Simulation-Based Study of Hybrid Fin/Planar LDMOS Design for FinFET-Based System-on-Chip Technology Ieee Transactions On Electron Devices. 64: 4193-4199. DOI: 10.1109/Ted.2017.2736442 |
0.393 |
|
2017 |
Liu H, Lin C, Hsu W, Lee C, Chiang M, Sun W, Wei S, Yu S. Integration of Gate Recessing and In Situ Cl − Doped Al 2 O 3 for Enhancement-Mode AlGaN/GaN MOSHEMTs Fabrication Ieee Electron Device Letters. 38: 91-94. DOI: 10.1109/Led.2016.2625304 |
0.373 |
|
2017 |
Huang Y, Chiang M, Wang S, Fossum JG. GAAFET Versus Pragmatic FinFET at the 5nm Si-Based CMOS Technology Node Ieee Journal of the Electron Devices Society. 5: 164-169. DOI: 10.1109/Jeds.2017.2689738 |
0.625 |
|
2016 |
Chen CY, Lin JT, Chiang MH. Subthreshold Kink Effect Revisited and Optimized for Si Nanowire MOSFETs Ieee Transactions On Electron Devices. DOI: 10.1109/Ted.2015.2512660 |
0.485 |
|
2015 |
Chiang MH, Hsu KH, Ding WW, Yang BR. A Predictive Compact Model of Bipolar RRAM Cells for Circuit Simulations Ieee Transactions On Electron Devices. 62: 2176-2183. DOI: 10.1109/Ted.2015.2428293 |
0.34 |
|
2014 |
Liu HY, Hsu W, Lee CS, Chou BY, Liao YB, Chiang M. Investigation of temperature-dependent characteristics of AlGaN/GaN MOS-HEMT by using hydrogen peroxide oxidation technique Ieee Transactions On Electron Devices. 61: 2760-2766. DOI: 10.1109/Ted.2014.2327123 |
0.386 |
|
2014 |
Liao Y, Chiang M, Damrongplasit N, Hsu W, Liu TK. Design of Gate-All-Around Silicon MOSFETs for 6-T SRAM Area Efficiency and Yield Ieee Transactions On Electron Devices. 61: 2371-2377. DOI: 10.1109/Ted.2014.2323059 |
0.462 |
|
2014 |
Liao Y, Chiang M, Lai Y, Hsu W. Stack Gate Technique for Dopingless Bulk FinFETs Ieee Transactions On Electron Devices. 61: 963-968. DOI: 10.1109/Ted.2014.2306012 |
0.427 |
|
2014 |
Chou BY, Lee CS, Yang CL, Hsu W, Liu HY, Chiang M, Sun WC, Wei SY, Yu SM. TiO2-dielectric AlGaN/GaN/Si metal-oxide-semiconductor high electron mobility transistors by using nonvacuum ultrasonic spray pyrolysis deposition Ieee Electron Device Letters. 35: 1091-1093. DOI: 10.1109/Led.2014.2354643 |
0.432 |
|
2012 |
Chu KY, Cheng SY, Chiang MH, Liu YJ, Huang CC, Chen TY, Hsu CS, Liu WC, Cheng WY, Lin BC. Comprehensive study of InGaP/InGaAs/GaAs dual channel pseudomorphic high electron mobility transistors Solid-State Electronics. 72: 22-28. DOI: 10.1016/J.Sse.2011.09.009 |
0.437 |
|
2012 |
Liao Y, Chiang M, Kim K, Hsu W. Assessment of structure variation in silicon nanowire FETs and impact on SRAM Microelectronics Journal. 43: 300-304. DOI: 10.1016/J.Mejo.2011.12.002 |
0.64 |
|
2008 |
Chiang M, Lin J, Kim K, Chuang C. Optimal Design of Triple-Gate Devices for High-Performance and Low-Power Applications Ieee Transactions On Electron Devices. 55: 2423-2428. DOI: 10.1109/Ted.2008.927664 |
0.491 |
|
2007 |
Chiang M, Lin J, Kim K, Chuang C. Random Dopant Fluctuation in Limited-Width FinFET Technologies Ieee Transactions On Electron Devices. 54: 2055-2060. DOI: 10.1109/Ted.2007.901154 |
0.44 |
|
2006 |
Chiang M, Kim K, Chuang C, Tretz C. High-Density Reduced-Stack Logic Circuit Techniques Using Independent-Gate Controlled Double-Gate Devices Ieee Transactions On Electron Devices. 53: 2370-2377. DOI: 10.1109/Ted.2006.881052 |
0.675 |
|
2006 |
Chiang M, Lin CN, Lin GS. Threshold voltage sensitivity to doping density in extremely scaled MOSFETs Semiconductor Science and Technology. 21: 190-193. DOI: 10.1088/0268-1242/21/2/017 |
0.443 |
|
2005 |
Chiang M, Kim K, Tretz C, Chuang C. Novel high-density low-power logic circuit techniques using DG devices Ieee Transactions On Electron Devices. 52: 2339-2342. DOI: 10.1109/Ted.2005.856191 |
0.447 |
|
2005 |
Cheng S, Chen C, Chen J, Liu W, Chang W, Chiang M. Comprehensive studies of InGaP/GaAs heterojunction bipolar transistors with different thickness of setback layers Superlattices and Microstructures. 37: 171-183. DOI: 10.1016/J.Spmi.2004.11.003 |
0.358 |
|
2004 |
Fossum JG, Ge L, Chiang M, Trivedi VP, Chowdhury MM, Mathew L, Workman GO, Nguyen BY. A process/physics-based compact model for nonclassical CMOS device and circuit design Solid-State Electronics. 48: 919-926. DOI: 10.1016/J.Sse.2003.12.030 |
0.654 |
|
2002 |
Fossum JG, Ge L, Chiang M. Speed superiority of scaled double-gate CMOS Ieee Transactions On Electron Devices. 49: 808-811. DOI: 10.1109/16.998588 |
0.67 |
|
1998 |
Possum JG, Chiang MH, Houston TW. Design issues and insights for low-voltage high-density SOI DRAM Ieee Transactions On Electron Devices. 45: 1055-1062. DOI: 10.1109/16.669528 |
0.435 |
|
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