Hua Ye, Ph.D. - Publications
Affiliations: | 2004 | State University of New York, Buffalo, Buffalo, NY, United States |
Area:
Civil Engineering, Mechanical Engineering, Electronics and Electrical EngineeringYear | Citation | Score | |||
---|---|---|---|---|---|
2006 | Ye H, Basaran C, Hopkins DC. Experimental damage mechanics of micro/power electronics solder joints under electric current stresses International Journal of Damage Mechanics. 15: 41-67. DOI: 10.1177/1056789506054311 | 0.526 | |||
2004 | Basaran C, Lin M, Ye H. A thermodynamic model for electrical current induced damage Proceedings - Electronic Components and Technology Conference. 2: 1738-1745. DOI: 10.1016/J.Ijsolstr.2003.08.018 | 0.586 | |||
2003 | Ye H, Basaran C, Hopkins DC. Numerical Simulation of Stress Evolution during Electromigration in IC Interconnect Lines Ieee Transactions On Components and Packaging Technologies. 26: 673-681. DOI: 10.1109/Tcapt.2003.817877 | 0.508 | |||
2003 | Ye H, Basaran C, Hopkins D. Thermomigration in Pb-Sn solder joints under joule heating during electric current stressing Applied Physics Letters. 82: 1045-1047. DOI: 10.1063/1.1554775 | 0.517 | |||
2003 | Ye H, Hopkins DC, Basaran C. Measurement of high electrical current density effects in solder joints Microelectronics Reliability. 43: 2021-2029. DOI: 10.1016/S0026-2714(03)00131-8 | 0.494 | |||
2001 | Ye H, Lin M, Basaran C. Failure modes and FEM analysis of power electronic packaging Advances in Electronic Packaging. 1: 417-428. DOI: 10.1016/S0168-874X(01)00094-4 | 0.569 | |||
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