Sakethraman Mahalingam, Ph.D. - Publications
Affiliations: | 2005 | Georgia Institute of Technology, Atlanta, GA |
Area:
Mechanical Engineering, Materials Science EngineeringYear | Citation | Score | |||
---|---|---|---|---|---|
2005 | Mahalingam S, Tonapi S, Sitaraman SK. The characterization of underfill-passivation interface under monotonic and fatigue loading and ITS application to flip chip reliability prediction American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 5: 219-224. DOI: 10.1115/IMECE2005-83029 | 0.417 | |||
2005 | Mahalingam S, Tonapi S, Sitaraman SK. A fracture mechanics analysis of underfill delamination in flip chip packages Proceedings of the Asme/Pacific Rim Technical Conference and Exhibition On Integration and Packaging of Mems, Nems, and Electronic Systems: Advances in Electronic Packaging 2005. 1341-1346. | 0.423 | |||
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