Melida Chin, Ph.D. - Publications
Affiliations: | 2005 | University of Michigan, Ann Arbor, Ann Arbor, MI |
Area:
Mechanical EngineeringYear | Citation | Score | |||
---|---|---|---|---|---|
2007 | Yue J, Camelio JA, Chin M, Cai W. Product-Oriented Sensitivity Analysis for Multistation Compliant Assemblies Journal of Mechanical Design. 129: 844-851. DOI: 10.1115/1.2735341 | 0.395 | |||
2007 | Chin M, Hu SJ. A multiple particle model for the prediction of electrical contact resistance in anisotropic conductive adhesive assemblies Ieee Transactions On Components and Packaging Technologies. 30: 745-753. DOI: 10.1109/TCAPT.2007.910136 | 0.4 | |||
2005 | Chin M, Hu SJ, Barber JR. Design guidelines for anisotropic conductive adhesive assemblies in microelectronics packaging American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 5: 371-374. DOI: 10.1115/1.2912180 | 0.404 | |||
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