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Abhijit Chandra - Publications

Affiliations: 
Iowa State University, Ames, IA, United States 
Area:
Applied Mechanics, Mechanical Engineering, Statistics
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46 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2019 Sarkar A, Shrotriya P, Chandra A. Simulation-driven Selection of Electrode Materials Based on Mechanical Performance for Lithium-Ion Battery. Materials (Basel, Switzerland). 12. PMID 30870987 DOI: 10.3390/Ma12050831  0.383
2019 Bastawros A, Chandra A, Gouda SD. A Quantitative Analysis of Multi-Scale Response of CMP Pad and Implication to Process Assessments Ecs Journal of Solid State Science and Technology. 8. DOI: 10.1149/2.0201905Jss  0.307
2019 Sarkar A, Shrotriya P, Chandra A. Modeling of separator failure in lithium-ion pouch cells under compression Journal of Power Sources. 435: 226756. DOI: 10.1016/J.Jpowsour.2019.226756  0.313
2019 Sarkar A, Shrotriya P, Chandra A, Hu C. Chemo-economic analysis of battery aging and capacity fade in lithium-ion battery Journal of Energy Storage. 25: 100911. DOI: 10.1016/J.Est.2019.100911  0.316
2017 Yu T, Bastawros AF, Chandra A. Experimental and modeling characterization of wear and life expectancy of electroplated CBN grinding wheels International Journal of Machine Tools & Manufacture. 121: 70-80. DOI: 10.1016/J.Ijmachtools.2017.04.013  0.376
2016 Yu T, Asplund DT, Bastawros AF, Chandra A. Performance and modeling of paired polishing process International Journal of Machine Tools and Manufacture. 109: 49-57. DOI: 10.1016/J.Ijmachtools.2016.07.003  0.441
2016 Chandra A, Bastawros AF, Yu T, Asplund DT. Chemical mechanical paired grinding: a tool for multi-wavelength planarization International Journal of Advanced Manufacturing Technology. 1-7. DOI: 10.1007/S00170-016-9085-3  0.364
2015 Chandra A, Bastawros AF, Wu KC, Karra P. Mixed strategy combination of pressure and velocity control for chemical mechanical planarization of patternedwafers Ecs Journal of Solid State Science and Technology. 4: P5105-P5111. DOI: 10.1149/2.0161511Jss  0.725
2015 Bastawros AF, Chandra A, Poosarla PA. Atmospheric pressure plasma enabled polishing of single crystal sapphire Cirp Annals - Manufacturing Technology. 64: 515-518. DOI: 10.1016/J.Cirp.2015.04.037  0.338
2012 Liu L, Kim G, Chandra A. Modeling of Ni–CGO anode in a solid oxide fuel cell deposited by spray pyrolysis Journal of Power Sources. 210: 129-137. DOI: 10.1016/J.Jpowsour.2012.03.031  0.354
2012 Liu L, Flesner R, Kim G-, Chandra A. Modeling of Solid Oxide Fuel Cells with Particle Size and Porosity Grading in Anode Electrode Fuel Cells. 12: 97-108. DOI: 10.1002/Fuce.201100095  0.304
2011 Chandra A, Ryu JJ, Karra P, Shrotriya P, Tvergaard V, Gaisser M, Weik T. Life expectancy of modular Ti6Al4V hip implants: influence of stress and environment. Journal of the Mechanical Behavior of Biomedical Materials. 4: 1990-2001. PMID 22098898 DOI: 10.1016/J.Jmbbm.2011.06.018  0.745
2010 Chandra A, Karra PK, Bastawros AF. Defectivity avoidance in chemical mechanical planarization: Role of multi-scale and multi-physics interactions Ecs Transactions. 33: 9-20. DOI: 10.1149/1.3489041  0.769
2010 Liu L, Kim G, Chandra A. Fabrication of solid oxide fuel cell anode electrode by spray pyrolysis Journal of Power Sources. 195: 7046-7053. DOI: 10.1016/J.Jpowsour.2010.04.083  0.329
2010 Liu L, Kim G, Chandra A. Modeling of thermal stresses and lifetime prediction of planar solid oxide fuel cell under thermal cycling conditions Journal of Power Sources. 195: 2310-2318. DOI: 10.1016/J.Jpowsour.2009.10.064  0.343
2009 Chandra A, Bastawros AF, Karra PK. Understanding Multi Scale Pad Effects in Chemical Mechanical Planarization Mrs Proceedings. 1157. DOI: 10.1557/Proc-1157-E02-01  0.744
2009 Chandra A, Ryu JJ, Karra P, Shrotriya P, Weik T. Electrochemical dissolution of biomedical grade Ti6Al4V: Influence of stress and environment Cirp Annals - Manufacturing Technology. 58: 499-502. DOI: 10.1016/J.Cirp.2009.03.114  0.743
2008 Shrotriya P, Karuppiah KKS, Zhang R, Chandra A, Sundararajan S. Surface stress generation during formation of alkanethiol self-assembled monolayer (SAM) Mechanics Research Communications. 35: 43-49. DOI: 10.1557/Proc-0951-E12-05  0.324
2008 Biswas R, Han Y, Karra P, Sherman P, Chandra A. Diffusion-Limited Agglomeration and Defect Generation during Chemical Mechanical Planarization Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2931519  0.746
2008 Chandra A, Karra P, Bastawros AF, Biswas R, Sherman PJ, Armini S, Lucca DA. Prediction of scratch generation in chemical mechanical planarization Cirp Annals - Manufacturing Technology. 57: 559-562. DOI: 10.1016/J.Cirp.2008.03.130  0.773
2008 Bastawros A, Che W, Chandra A. Measurement of ultrathin film mechanical properties by integrated nanoscratch/indentation approach Materials Research Society Symposium Proceedings. 1049: 57-62.  0.504
2007 Bastawros A, Che W, Chandra A. Measurement of Ultrathin Film Mechanical Properties by Integrated Nano-scratch/indentation Approach Mrs Proceedings. 1049. DOI: 10.1557/Proc-1049-Aa04-04  0.524
2007 Chua BH, Chandra A, Shrotriya P. Single Asperity Wear and Stress-Assisted Dissolution of Copper Mrs Proceedings. 1025. DOI: 10.1557/Proc-1025-B16-04  0.39
2007 Zhang R, Wang X, Shrotriya P, Biswas R, Bastawros A, Chandra A. Molecular approach to material detachment mechanism during chemical mechanical planarization Machining Science and Technology. 11: 515-530. DOI: 10.1080/10910340701700799  0.451
2006 Che W, Bastawros A, Chandra A. Surface evolution during the chemical mechanical planarization of copper Cirp Annals - Manufacturing Technology. 55: 605-608. DOI: 10.1016/S0007-8506(07)60493-4  0.61
2005 Wang C, Sherman P, Chandra A. Modelling and analysis of pad surface topography and slurry particle size distribution effects on material removal rate in chemical mechanical planarisation International Journal of Manufacturing Technology and Management. 7: 504-529. DOI: 10.1504/Ijmtm.2005.007700  0.61
2005 Kadavasal MS, Chandra A, Eamkajornsiri S, Bastawros AF. Yield improvement via minimisation of step height non-uniformity in chemical mechanical planarisation (CMP) with pressure and velocity as control variables International Journal of Manufacturing Technology and Management. 7: 467-489. DOI: 10.1504/Ijmtm.2005.007698  0.349
2005 Che W, Guo Y, Chandra A, Bastawros A. A scratch intersection model of material removal during Chemical Mechanical Planarization (CMP) Journal of Manufacturing Science and Engineering, Transactions of the Asme. 127: 545-554. DOI: 10.1115/1.1949616  0.612
2005 Wang C, Sherman P, Chandra A. A stochastic model for the effects of pad surface topography evolution on material removal rate decay in chemical-mechanical planarization Ieee Transactions On Semiconductor Manufacturing. 18: 695-708. DOI: 10.1109/Tsm.2005.858516  0.593
2005 Wang C, Sherman P, Chandra A, Dornfeld D. Pad Surface Roughness and Slurry Particle Size Distribution Effects on Material Removal Rate in Chemical Mechanical Planarization Cirp Annals. 54: 309-312. DOI: 10.1016/S0007-8506(07)60110-3  0.595
2005 Fu G, Chandra A. The relationship between wafer surface pressure and wafer backside loading in Chemical Mechanical Polishing Thin Solid Films. 474: 217-221. DOI: 10.1016/J.Tsf.2004.09.010  0.589
2005 Che W, Bastawros A, Chandra A. Synergy between chemical dissolution and mechanical abrasion during chemical mechanical polishing of copper Materials Research Society Symposium Proceedings. 867: 275-280.  0.605
2004 Guo Y, Chandra A, Bastawros AF. Analytical dishing and step height reduction model for CMP with a viscoelastic pad Journal of the Electrochemical Society. 151. DOI: 10.1149/1.1774189  0.456
2003 Che W, Guo Y, Chandra A, Bastawros A. Mechanistic Understanding of Material Detachment During Micro-Scale Polishing Journal of Manufacturing Science and Engineering. 125: 731-735. DOI: 10.1115/1.1619964  0.625
2003 Fu G, Chandra A. An analytical dishing and step height reduction model for chemical mechanical planarization (CMP) Ieee Transactions On Semiconductor Manufacturing. 16: 477-485. DOI: 10.1109/Tsm.2003.815202  0.607
2003 Eamkajornsiri S, Narayanaswami R, Chandra A. Yield improvement in wafer planarization: Modeling and simulation Journal of Manufacturing Systems. 22: 239-247. DOI: 10.1016/S0278-6125(03)90023-9  0.455
2003 Gouda SD, Bastawros A, Chandra A. Multi-Scale Characterization of Pad Role on Material Removal Rate in CMP Materials Research Society Symposium - Proceedings. 767: 95-100.  0.359
2002 Eamkajornsiri S, Narayanaswami R, Chandra A. Wafer scale modeling and control for yield improvement in wafer planarization Asme International Mechanical Engineering Congress and Exposition, Proceedings. 301-310. DOI: 10.1115/IMECE2002-33454  0.322
2002 Ye Y, Biswas R, Bastawros A, Chandra A. Simulation of chemical mechanical planarization of copper with molecular dynamics Applied Physics Letters. 81: 1875-1877. DOI: 10.1063/1.1505113  0.405
2002 Fu G, Chandra A. A model for wafer scale variation of material removal rate in chemical mechanical polishing based on viscoelastic pad deformation Journal of Electronic Materials. 31: 1066-1073. DOI: 10.1007/S11664-002-0044-4  0.648
2002 Bastawros A, Chandra A, Guo Y, Yan B. Pad effects on material-removal rate in chemical-mechanical planarization Journal of Electronic Materials. 31: 1022-1031. DOI: 10.1007/S11664-002-0038-2  0.456
2002 Bastawros A, Chandra A, Guo Y, Yan B. Pad effects on material-removal rate in chemical-mechanical planarization Journal of Electronic Materials. 31: 1022-1031.  0.354
2002 Che W, Guo Y, Bastawros A, Chandra A. Mechanistic understanding of material detachment during CMP processing Materials Research Society Symposium Proceedings. 732: 90-95.  0.597
2001 Fu G, Chandra A, Guha S, Subhash G. A plasticity-based model of material removal in chemical-mechanical polishing (CMP) Ieee Transactions On Semiconductor Manufacturing. 14: 406-417. DOI: 10.1109/66.964328  0.589
2001 Wang H, Subhash G, Chandra A. Characteristics of single-grit rotating scratch with a conical tool on pure titanium Wear. 249: 566-581. DOI: 10.1016/S0043-1648(01)00585-3  0.364
2001 Fu G, Chandra A. A model for wafer scale variation of removal rate in chemical mechanical polishing based on elastic pad deformation Journal of Electronic Materials. 30: 400-408. DOI: 10.1007/S11664-001-0051-X  0.63
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