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Jianyun Hu, Ph.D. - Publications

Affiliations: 
2012 Hajim School of Engineering and Applied Sciences University of Rochester, Rochester, NY 
Area:
Electronics and Electrical Engineering
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5 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2016 Savidis I, Ciftcioglu B, Xu J, Hu J, Jain M, Berman R, Xue J, Liu P, Moore D, Wicks G, Huang M, Wu H, Friedman EG. Heterogeneous 3-D circuits: Integrating free-space optics with CMOS Microelectronics Journal. 50: 66-75. DOI: 10.1016/J.Mejo.2015.10.004  0.676
2013 Hu J, Zhu Y, Wang S, Wu H. An Energy-Efficient IR-UWB Receiver Based on Distributed Pulse Correlator Ieee Transactions On Microwave Theory and Techniques. 61: 2447-2459. DOI: 10.1109/Tmtt.2013.2259371  0.616
2012 Ciftcioglu B, Berman R, Wang S, Hu J, Savidis I, Jain M, Moore D, Huang M, Friedman EG, Wicks G, Wu H. 3-D integrated heterogeneous intra-chip free-space optical interconnect. Optics Express. 20: 4331-45. PMID 22418191 DOI: 10.1364/Oe.20.004331  0.68
2012 Carpenter A, Hu J, Xu J, Huang M, Wu H, Liu P. Using Transmission Lines for Global On-Chip Communication Ieee Journal On Emerging and Selected Topics in Circuits and Systems. 2: 183-193. DOI: 10.1109/Jetcas.2012.2193519  0.531
2011 Ciftcioglu B, Berman R, Zhang J, Darling Z, Wang S, Hu J, Xue J, Garg A, Jain M, Savidis I, Moore D, Huang M, Friedman EG, Wicks G, Wu H. A 3-D integrated intrachip free-space optical interconnect for many-core chips Ieee Photonics Technology Letters. 23: 164-166. DOI: 10.1109/Lpt.2010.2093876  0.683
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