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Woo-Tae Park, Ph.D. - Publications

Affiliations: 
2012- Mechanical Engineering Seoul National University of Science and Technology 
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40 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Nguyen TQ, Park W. Fabrication method of multi-depth circular microchannels for investigating arterial thrombosis-on-a-chip Sensors and Actuators B-Chemical. 321: 128590. DOI: 10.1016/J.Snb.2020.128590  0.334
2018 Kim M, Choi J, Park W. MEMS PZT Oscillating Platform for Fine Dust Particle Removal at Resonance International Journal of Precision Engineering and Manufacturing. 19: 1851-1859. DOI: 10.1007/S12541-018-0214-9  0.335
2016 Teo AJT, Mishra A, Park I, Kim YJ, Park WT, Yoon YJ. Polymeric Biomaterials for Medical Implants and Devices. Acs Biomaterials Science & Engineering. 2: 454-472. PMID 33465850 DOI: 10.1021/Acsbiomaterials.5B00429  0.333
2016 Nguyen TQ, Park WT. Rapid, low-cost fabrication of circular microchannels by air expansion into partially cured polymer Sensors and Actuators, B: Chemical. 235: 302-308. DOI: 10.1016/J.Snb.2016.05.008  0.359
2015 Park W, Jeon J, Choi HT, Woo HK, Woo D, Lee S. Thermal Packaging for Firefighters` Personal Protective Elctronic Equipments Journal of Sensor Science and Technology. 24: 319-325. DOI: 10.5369/Jsst.2015.24.5.319  0.346
2014 Heidari A, Yoon YJ, Park WT, Su PC, Miao J, Lin JT, Park MK. Biotin-streptavidin binding interactions of dielectric filled silicon bulk acoustic resonators for smart label-free biochemical sensor applications. Sensors (Basel, Switzerland). 14: 4585-98. PMID 24608003 DOI: 10.3390/S140304585  0.385
2014 Han B, Yoon YJ, Hamidullah M, Lin ATH, Park WT. Silicon nanowire-based ring-shaped tri-axial force sensor for smart integration on guidewire Journal of Micromechanics and Microengineering. 24. DOI: 10.1088/0960-1317/24/6/065002  0.343
2013 Cheng MY, Je M, Tan KL, Tan EL, Lim R, Yao L, Li P, Park WT, Phua EJR, Gan CL, Yu A. A low-profile three-dimensional neural probe array using a silicon lead transfer structure Journal of Micromechanics and Microengineering. 23. DOI: 10.1088/0960-1317/23/9/095013  0.32
2013 Cheng MY, Park WT, Yu A, Xue RF, Tan KL, Yu D, Lee SH, Gan CL, Je M. A flexible polyimide cable for implantable neural probe arrays Microsystem Technologies. 19: 1111-1118. DOI: 10.1007/S00542-012-1707-6  0.315
2012 Cheong JH, Ng SS, Liu X, Xue RF, Lim HJ, Khannur PB, Chan KL, Lee AA, Kang K, Lim LS, He C, Singh P, Park WT, Je M. An inductively powered implantable blood flow sensor microsystem for vascular grafts. Ieee Transactions On Bio-Medical Engineering. 59: 2466-75. PMID 22692871 DOI: 10.1109/Tbme.2012.2203131  0.343
2012 Lou L, Yan H, Park WT, Kwong DL, Lee C. Characterization of piezoresistive-Si-nanowire-based pressure sensors by dynamic cycling test with extralarge compressive strain Ieee Transactions On Electron Devices. 59: 3097-3103. DOI: 10.1109/Ted.2012.2214440  0.313
2012 Singh P, Miao J, Pott V, Park WT, Kwong DL. Piezoresistive sensing performance of junctionless nanowire FET Ieee Electron Device Letters. 33: 1759-1761. DOI: 10.1109/Led.2012.2217112  0.328
2012 Zhang S, Lou L, Park WT, Lee C. Characterization of a silicon nanowire-based cantilever air-flow sensor Journal of Micromechanics and Microengineering. 22. DOI: 10.1088/0960-1317/22/9/095008  0.362
2012 Lou L, Zhang S, Park WT, Tsai JM, Kwong DL, Lee C. Optimization of NEMS pressure sensors with a multilayered diaphragm using silicon nanowires as piezoresistive sensing elements Journal of Micromechanics and Microengineering. 22. DOI: 10.1088/0960-1317/22/5/055012  0.363
2012 Heidari A, Yoon YJ, Park MK, Park WT, Tsai JML. High sensitive dielectric filled Lamé mode mass sensor Sensors and Actuators, a: Physical. 188: 82-88. DOI: 10.1016/J.Sna.2012.03.040  0.386
2011 Lou L, Park WT, Zhang S, Lim LS, Kwong DL, Lee C. Characterization of silicon nanowire embedded in a mems diaphragm structure within large compressive strain range Ieee Electron Device Letters. 32: 1764-1766. DOI: 10.1109/Led.2011.2169931  0.327
2011 Singh P, Miao J, Park WT, Kwong DL. Gate-bias-controlled sensitivity and SNR enhancement in a nanowire FET pressure sensor Journal of Micromechanics and Microengineering. 21. DOI: 10.1088/0960-1317/21/10/105007  0.312
2011 Singh P, Miao J, Shao L, Kotlanka RK, Park WT, Kwong DL. Microcantilever sensors with embedded piezoresistive transistor read-out: Design and characterization Sensors and Actuators, a: Physical. 171: 178-185. DOI: 10.1016/J.Sna.2011.08.012  0.361
2011 Lou L, Zhang S, Lim L, Park WT, Feng H, Kwong DL, Lee C. Characteristics of NEMS piezoresistive silicon nanowires pressure sensors with various diaphragm layers Procedia Engineering. 25: 1433-1436. DOI: 10.1016/J.Proeng.2011.12.354  0.377
2010 Park WT, Grote B, Dawson C, Liu L. Surface charge extraction methods in offset shift-related failures of MEMS pressure sensors Journal of Micromechanics and Microengineering. 20. DOI: 10.1088/0960-1317/20/11/115027  0.304
2009 Barlian AA, Park WT, Mallon JR, Rastegar AJ, Pruitt BL. Review: Semiconductor Piezoresistance for Microsystems. Proceedings of the Ieee. Institute of Electrical and Electronics Engineers. 97: 513-552. PMID 20198118 DOI: 10.1109/JPROC.2009.2013612  0.58
2009 Ayanoor-Vitikkate V, Chen Kl, Park WT, Kenny TW. Development of wafer scale encapsulation process for large displacement piezoresistive MEMS devices Sensors and Actuators, a: Physical. 156: 275-283. DOI: 10.1016/J.Sna.2009.09.001  0.611
2007 Park WT, O'Connor KN, Chen KL, Mallon JR, Maetani T, Dalal P, Candler RN, Ayanoor-Vitikkate V, Roberson JB, Puria S, Kenny TW. Ultraminiature encapsulated accelerometers as a fully implantable sensor for implantable hearing aids. Biomedical Microdevices. 9: 939-49. PMID 17574533 DOI: 10.1007/S10544-007-9072-4  0.677
2007 Kim B, Hopcroft M, Jha CM, Melamud R, Chandorkar S, Agarwal M, Chen KL, Park WT, Candler R, Yama G, Partridge A, Lutz M, Kenny TW. Using MEMS to build the device and the package Transducers and Eurosensors '07 - 4th International Conference On Solid-State Sensors, Actuators and Microsystems. 331-334. DOI: 10.1109/SENSOR.2007.4300135  0.743
2007 Kim B, Candler RN, Hopcroft MA, Agarwal M, Park WT, Kenny TW. Frequency stability of wafer-scale film encapsulated silicon based MEMS resonators Sensors and Actuators, a: Physical. 136: 125-131. DOI: 10.1016/J.Sna.2006.10.040  0.767
2006 Ayanoor-Vitikkate V, Chen KL, Park WT, Kenny TW. Development of process for wafer scale encapsulation of devices with very wide trenches American Society of Mechanical Engineers, Micro-Electro Mechanical Systems Division, (Publications) Mems. DOI: 10.1115/IMECE2006-14549  0.538
2006 Candler RN, Hopcroft MA, Kim B, Park WT, Melamud R, Agarwal M, Yama G, Partridge A, Lutz M, Kenny TW. Long-term and accelerated life testing of a novel single-wafer vacuum encapsulation for MEMS resonators Journal of Microelectromechanical Systems. 15: 1446-1456. DOI: 10.1109/Jmems.2006.883586  0.735
2006 Candler RN, Duwel A, Varghese M, Chandorkar SA, Hopcroft MA, Park WT, Kim B, Yama G, Partridge A, Lutz M, Kenny TW. Impact of geometry on thermoelastic dissipation in micromechanical resonant beams Journal of Microelectromechanical Systems. 15: 927-934. DOI: 10.1109/Jmems.2006.879374  0.742
2006 Park WT, Partridge A, Candler RN, Ayanoor-Vitikkate V, Yama G, Lutz M, Kenny TW. Encapsulated submillimeter piezoresistive accelerometers Journal of Microelectromechanical Systems. 15: 507-514. DOI: 10.1109/Jmems.2006.876648  0.743
2006 Ayanoor-Vitikkate V, Chen KL, Park WT, Yama G, Kenny TW. Wafer scale encapsulation of wide gaps using oxidation of sacrificial beams Proceedings of the Ieee/Cpmt International Electronics Manufacturing Technology (Iemt) Symposium. 300-306. DOI: 10.1109/IEMT.2006.4456470  0.477
2005 Candler RN, Park WT, Hopcroft M, Kim B, Kenny TW. Hydrogen diffusion and pressure control of encapsulated mems resonators Digest of Technical Papers - International Conference On Solid State Sensors and Actuators and Microsystems, Transducers '05. 1: 920-923. DOI: 10.1109/SENSOR.2005.1496568  0.768
2005 Kim B, Candler RN, Hopcroft M, Agarwal M, Park WT, Kenny TW. Frequency stability of wafer-scale encapsulated MEMS resonators Digest of Technical Papers - International Conference On Solid State Sensors and Actuators and Microsystems, Transducers '05. 2: 1965-1968.  0.781
2005 Park WT, Candler RN, Ayanoor-Vitikkate V, Lutz M, Partridge A, Yama G, Kenny TW. Fully encapsulated sub-millimeter accelerometers Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 347-350.  0.748
2005 Park WT, O'Connor KN, Mallon JR, Maetani T, Candler RN, Ayanoor-Vitikkate V, Roberson JB, Puria S, Kenny TW. Sub-mm encapsulated accelerometers: A fully implantable sensor for cochlear implants Digest of Technical Papers - International Conference On Solid State Sensors and Actuators and Microsystems, Transducers '05. 1: 109-112.  0.64
2004 Kim B, Candler RN, Hopcroft M, Agarwal M, Park WT, Li JT, Kenny T. Investigation of MEMS resonator characteristics during long-term and wide temperature variation operation American Society of Mechanical Engineers, Micro-Electro Mechanical Systems Division, (Publications) Mems. 413-416. DOI: 10.1115/IMECE2004-61727  0.773
2004 Pruitt BL, Park WT, Kenny TW. Measurement system for low force and small displacement contacts Journal of Microelectromechanical Systems. 13: 220-229. DOI: 10.1109/Jmems.2003.820266  0.636
2003 Candler RN, Park WT, Li H, Yama G, Partridge A, Lutz M, Kenny TW. Single Wafer Encapsulation of MEMS Devices Ieee Transactions On Advanced Packaging. 26: 227-232. DOI: 10.1109/Tadvp.2003.818062  0.783
2003 Park WT, Candler RN, Kronmueller S, Lutz M, Partridge A, Yama G, Kenny TW. Wafer-scale film encapsulation of micromachined accelerometers Transducers 2003 - 12th International Conference On Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers. 2: 1903-1906. DOI: 10.1109/SENSOR.2003.1217163  0.699
2003 Park WT, Cho J, Li H, Kenny TW, Candler RN, Li HJ, Partridge A, Yama G, Lutz M. Wafer scale encapsulation of MEMS devices Advances in Electronic Packaging. 1: 209-212.  0.754
2002 Kenny TW, Candler RN, Li HJ, Park WT, Cho J, Li H, Partridge A, Yama G, Lutz M. An integrated wafer-scale packaging process for MEMS American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 2: 51-54. DOI: 10.1115/IMECE2002-39270  0.755
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