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Jongpil Cheong, Ph.D. - Publications

Affiliations: 
2005 Pennsylvania State University, State College, PA, United States 
Area:
Mechanical Engineering
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4 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2005 Cheong J, Goyal A, Tadigadapa SA, Rahn CD. Fabrication and performance of a flextensional microactuator Journal of Micromechanics and Microengineering. 15: 1947-1955. DOI: 10.1088/0960-1317/15/10/022  0.636
2004 Cheong J, Goyal A, Tadigadapa S, Rahn C. Reliable bonding using indium-based solders Proceedings of Spie. 5343: 114-120. DOI: 10.1117/12.524823  0.615
2004 Cheong J, Tadigadapa SA, Rahn CD. Piezoelectric microflextensional actuator Proceedings of Spie. 5344: 106-114. DOI: 10.1117/12.524817  0.58
2004 Goyal A, Cheong J, Tadigadapa S. Tin-based solder bonding for MEMS fabrication and packaging applications Journal of Micromechanics and Microengineering. 14: 819-825. DOI: 10.1088/0960-1317/14/6/009  0.641
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