Dae-Lok Bae, Ph.D. - Publications
Affiliations: | 2004 | Rensselaer Polytechnic Institute, Troy, NY, United States |
Area:
Chemical EngineeringYear | Citation | Score | |||
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2006 | Senkevich JJ, Karabacak T, Bae DL, Cale TS. Formation of body-centered-cubic tantalum via sputtering on low- κ dielectrics at low temperatures Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 24: 534-538. DOI: 10.1116/1.2166860 | 0.461 | |||
2005 | Kim YS, Bae DI, Yang H, Shin HS, Wang GW, Senkevich JJ, Lu TM. Direct copper electroless deposition on a tungsten barrier Layer for ultralarge scale integration Journal of the Electrochemical Society. 152. DOI: 10.1149/1.1850377 | 0.339 | |||
2005 | Bae DL, Jezewski C, Cale TS, Senkevich JJ. Adhesion of sputter-deposited Ta to porous-methyl silsesquioxane pore sealed with molecular caulk Chemical Vapor Deposition. 11: 191-194. DOI: 10.1002/Cvde.200404198 | 0.471 | |||
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