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Brian H. Stark, Ph.D. - Publications

Affiliations: 
2004 University of Michigan, Ann Arbor, Ann Arbor, MI 
Area:
micromachining technologies, micromachined sensors, actuators, and MEMS; analog integrated circuits; implantable biomedical microsystems; micropackaging; and low-power wireless sensing/actuating systems
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12 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2006 Stark BH, Najafi K. A mold and transfer technique for lead-free fluxless soldering and application to MEMS packaging Journal of Microelectromechanical Systems. 15: 849-858. DOI: 10.1109/Jmems.2006.879812  0.558
2005 Chae J, Stark BH, Najafi K. A micromachined Pirani gauge with dual heat sinks Ieee Transactions On Advanced Packaging. 28: 619-625. DOI: 10.1109/Tadvp.2005.858316  0.649
2005 Stark BH, Chae J, Kuo A, Oliver A, Najafi K. A high-performance surface-micromachined pirani gauge in summit V™ Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 295-298.  0.309
2004 Zhu X, Aslam DM, Tang Y, Stark BH, Najafi K. The fabrication of all-diamond packaging panels with built-in interconnects for wireless integrated microsystems Journal of Microelectromechanical Systems. 13: 396-405. DOI: 10.1109/Jmems.2004.828739  0.522
2004 Stark BH, Najafi K. A low-temperature thin-film electroplated metal vacuum package Journal of Microelectromechanical Systems. 13: 147-157. DOI: 10.1109/Jmems.2004.825301  0.598
2004 Stark BH, Najafi K. A mold and transfer technique for lead-free fluxless soldering and application to wafer-level low-temperature thin-film packages Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 13-16.  0.325
2003 Stark BH, Dokmeci MR, Najafi K. Improving Corrosion-Resistance of Polysilicon Using Boron Doping and Self-Induced Galvanic Bias Ieee Transactions On Advanced Packaging. 26: 295-301. DOI: 10.1109/Tadvp.2003.818058  0.674
2003 Stark BH, Najafi K. An integrated process for post-packaging release and vacuum sealing of electroplated nickel packages Transducers 2003 - 12th International Conference On Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers. 2: 1911-1914. DOI: 10.1109/SENSOR.2003.1217165  0.535
2003 Stark BH, Mei Y, Zhang C, Najafi K. A doubly anchored surface micromachined pirani gauge for vacuum package characterization Proceedings of the Ieee Micro Electro Mechanical Systems (Mems). 506-509.  0.312
2002 Harpster TJ, Stark B, Najafi K. A passive wireless integrated humidity sensor Sensors and Actuators, a: Physical. 95: 100-107. DOI: 10.1016/S0924-4247(01)00720-8  0.67
2001 Stark BH, Dokmeci MR, Harpster TJ, Najafi K. Improving corrosion-resistance of silicon-glass micropackages using boron doping and/or self-induced galvanic bias Annual Proceedings - Reliability Physics (Symposium). 112-119. DOI: 10.1109/RELPHY.2001.922890  0.631
2000 Harpster T, Hauvespre S, Dokmeci M, Stark B, Vosoughi A, Najafi K. Passive humidity monitoring system for in-situ remote wireless testing of micropackages Proceedings of the Ieee Micro Electro Mechanical Systems (Mems). 335-340.  0.675
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