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Gang Huang, Ph.D. - Publications

Affiliations: 
2008 Georgia Institute of Technology, Atlanta, GA 
Area:
Microelectronics/Microsystems
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4 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2014 Zheng L, Zhang Y, Huang G, Bakir MS. Novel electrical and fluidic microbumps for silicon interposer and 3-D ICs Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 777-785. DOI: 10.1109/Tcpmt.2014.2309680  0.601
2012 Huang G, Bakir MS, Naeemi A, Meindl JD. Power delivery for 3-D chip stacks: Physical modeling and design implication Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 852-859. DOI: 10.1109/Tcpmt.2012.2185047  0.656
2009 Bakir M, Huang G, Sekar D, King C. 3D integrated circuits: Liquid cooling and power delivery Iete Technical Review (Institution of Electronics and Telecommunication Engineers, India). 26: 407-416. DOI: 10.4103/0256-4602.57826  0.586
2009 Bakir MS, Huang G. Power delivery, signaling and cooling for 3D integrated systems Materials Research Society Symposium Proceedings. 1156: 169-179. DOI: 10.1557/Proc-1156-D08-06-F06-06  0.691
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