Year |
Citation |
Score |
2020 |
Park SJ, Lee KH, Lee CS, Kim KT, Jang JH, Shin DH, Kim MS, Kim J, Cho SY, Jin DK. Impact of growth hormone treatment on scoliosis development and progression: analysis of 1128 patients with idiopathic short stature. Journal of Pediatric Endocrinology & Metabolism : Jpem. PMID 33180047 DOI: 10.1515/jpem-2020-0393 |
0.316 |
|
2019 |
Byun J, Kim KH, Kim BK, Chang JW, Cho SK, Kim JJ. Gravimetric analysis of the autocatalytic growth of copper microparticles in aqueous solution. Rsc Advances. 9: 37895-37900. PMID 35541779 DOI: 10.1039/c9ra06842b |
0.457 |
|
2017 |
Lee CH, Kim T, Park S, Lee S, Paek S, Ahn D, Cho S. Effect of cathode material on the electrorefining of U in LiCl-KCl molten salts Journal of Nuclear Materials. 488: 210-214. DOI: 10.1016/J.Jnucmat.2017.03.023 |
0.328 |
|
2015 |
Cho SK, Fan FR, Bard AJ. Electrochemical vapor deposition of semiconductors from gas phase with a solid membrane cell. Journal of the American Chemical Society. 137: 6638-42. PMID 25936392 DOI: 10.1021/Jacs.5B02878 |
0.356 |
|
2014 |
Kim J, Kim BK, Cho SK, Bard AJ. Tunneling ultramicroelectrode: nanoelectrodes and nanoparticle collisions. Journal of the American Chemical Society. 136: 8173-6. PMID 24857267 DOI: 10.1021/Ja503314U |
0.446 |
|
2012 |
Cho SK, Fan FR, Bard AJ. Electrodeposition of crystalline and photoactive silicon directly from silicon dioxide nanoparticles in molten CaCl2. Angewandte Chemie (International Ed. in English). 51: 12740-4. PMID 23143938 DOI: 10.1002/Anie.201206789 |
0.41 |
|
2012 |
Chang J, Leonard KC, Cho SK, Bard AJ. Examining ultramicroelectrodes for scanning electrochemical microscopy by white light vertical scanning interferometry and filling recessed tips by electrodeposition of gold. Analytical Chemistry. 84: 5159-63. PMID 22591026 DOI: 10.1021/Ac300863R |
0.354 |
|
2012 |
Cho S, Kim M, Koo H, Kim S, Kim J. An Empirical Relation between the Plating Process and Accelerator Coverage in Cu Superfilling Bulletin of the Korean Chemical Society. 33: 1603-1607. DOI: 10.5012/Bkcs.2012.33.5.1603 |
0.557 |
|
2007 |
Kim S, Kang M, Koo H, Cho S, Kim J, Yeo J. Cu Metallization for Giga Level Devices Using Electrodeposition Journal of the Korean Chemical Society. 10: 94-103. DOI: 10.5229/Jkes.2007.10.2.094 |
0.547 |
|
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