Ankit More
Affiliations: | Intel Corporation, Santa Clara, CA, United States | ||
2013 | Electrical and Computer Engineering | Drexel University, Philadelphia, PA, United States |
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"Ankit More"Parents
Sign in to add mentorBaris Taskin | grad student | 2013 | Drexel | |
(Dissertation: Network-on-Chip (NoC) Architectures for Exa-Scale Chip-Multi-Processors (CMPs)) |
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Publications
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Sangaiah K, Lui M, Jagtap R, et al. (2018) SynchroTrace: Synchronization-Aware Architecture-Agnostic Traces for Lightweight Multicore Simulation of CMP and HPC Workloads Acm Transactions On Architecture and Code Optimization. 15: 2 |
More A, Pano V, Taskin B. (2018) Vertical Arbitration-Free 3-D NoCs Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 37: 1853-1866 |
More A, Taskin B. (2015) Locality-aware network utilization balancing in NoCs Acm Transactions On Design Automation of Electronic Systems. 21 |
Honkote V, More A, Taskin B. (2012) 3-D parasitic modeling for rotary interconnects Proceedings of the Ieee International Conference On Vlsi Design. 137-142 |
More A, Taskin B. (2012) A unified design methodology for a hybrid wireless 2-D NoC Iscas 2012 - 2012 Ieee International Symposium On Circuits and Systems. 640-643 |
More A, Taskin B. (2011) EM and circuit co-simulation of a reconfigurable hybrid wireless NoC on 2D ICs Proceedings - Ieee International Conference On Computer Design: Vlsi in Computers and Processors. 19-24 |
More A, Taskin B. (2010) Simulation based study of wireless RF interconnects for practical CMOS implementation International Workshop On System Level Interconnect Prediction, Slip. 35-41 |
More A, Taskin B. (2010) Electromagnetic interaction of on-chip antennas and CMOS metal layers for wireless IC interconnects Proceedings of the Acm Great Lakes Symposium On Vlsi, Glsvlsi. 413-416 |
More A, Taskin B. (2010) Simulation based study of on-chip antennas for a reconfigurable hybrid 3D wireless NoC Proceedings - Ieee International Soc Conference, Socc 2010. 447-452 |
More A, Taskin B. (2010) Simulation based feasibility study of wireless RF interconnects for 3D ICs Proceedings - Ieee Annual Symposium On Vlsi, Isvlsi 2010. 228-231 |