Pei-I Wang, Ph.D.
Affiliations: | 2001 | Rensselaer Polytechnic Institute, Troy, NY, United States |
Area:
Materials Science EngineeringGoogle:
"Pei-I Wang"Parents
Sign in to add mentor| S P. Murarka | grad student | 2001 | RPI | |
| (Investigations of the interactions of silicon dioxide with copper-aluminum alloy used as an adhesion promoter and diffusion barrier for copper metallization on silicon dioxide.) | ||||
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Publications
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| Wang P, Li H, Lu T. (2012) Orientation Modulated Epitaxy of Cu Nanorods on Si(1 0 0) Substrate Ieee Transactions On Nanotechnology. 11: 542-545 |
| Wang P, Frey MD, Washington M, et al. (2012) Resistivity of sub-50 nm copper lines epitaxially grown on Si(100) substrate Thin Solid Films. 520: 6106-6108 |
| He M, Li H, Wang P, et al. (2011) Bias-temperature stress of Al on porous low-k dielectrics Microelectronics Reliability. 51: 1342-1345 |
| Wang P, Bult J, Ghoshal R, et al. (2011) Rapid ultraviolet-curing of epoxy siloxane films Materials Chemistry and Physics. 129: 678-682 |
| Li H, Snow P, He M, et al. (2010) Biaxially textured Al film growth on CaF2 nanostructures toward a method of preparing single-crystalline Si film on glass substrates. Acs Nano. 4: 5627-32 |
| He M, Ou Y, Wang P, et al. (2010) Kinetics of Ta ions penetration into porous low-k dielectrics under bias-temperature stress Applied Physics Letters. 96: 222901 |
| Wang PI, Parker TC, Karabacak T, et al. (2009) Size control of Cu nanorods through oxygen-mediated growth and low temperature sintering. Nanotechnology. 20: 085605 |
| Wang PI, Lee SH, Parker TC, et al. (2009) Low temperature wafer bonding by copper nanorod array Electrochemical and Solid-State Letters. 12 |
| Cansizoglu MF, Watanabe F, Wang PI, et al. (2008) Evolution of crystal orientation in obliquely deposited magnesium nanostructures for hydrogen storage applications Materials Research Society Symposium Proceedings. 1042: 53-58 |
| Ou Y, Wang P, He M, et al. (2008) Conduction Mechanisms of Ta/Porous SiCOH Films under Electrical Bias Journal of the Electrochemical Society. 155 |