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Jesus N. Calata, Ph.D.

Affiliations: 
2005 Virginia Polytechnic Institute and State University, Blacksburg, VA, United States 
Area:
Materials Science Engineering
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"Jesus Calata"
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Guo-Quan Lu grad student 2005 Virginia Tech
 (Densification behavior of ceramic and crystallizable glass materials constrained on a rigid substrate.)

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Publications

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Xiao K, Calata JN, Zheng H, et al. (2013) Simplification of the Nanosilver Sintering Process for Large-Area Semiconductor Chip Bonding: Reduction of Hot-Pressing Temperature Below 200 $^{\circ}{\rm C}$ Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1271-1278
Zheng H, Berry D, Calata JN, et al. (2013) Low-Pressure Joining of Large-Area Devices on Copper Using Nanosilver Paste Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 915-922
Calata JN, Lu G, Ngo K. (2013) Soft Magnetic Alloy–Polymer Composite for High-Frequency Power Electronics Application Journal of Electronic Materials. 43: 126-131
Calata JN, Lu G, Ngo K, et al. (2013) Electromigration in Sintered Nanoscale Silver Films at Elevated Temperature Journal of Electronic Materials. 43: 109-116
Xiao K, Calata J, Ngo K, et al. (2011) Large-Area Chip Attachment by Sintering Nanosilver Paste: Process Improvement by Nondestructive Characterization Transactions of the Japan Institute of Electronics Packaging. 4: 101-109
Calata JN, Lei TG, Lu GQ. (2009) Sintered nanosilver paste for high-temperature power semiconductor device attachment International Journal of Materials and Product Technology. 34: 95
Lei TG, Calata J, Luo SF, et al. (2007) Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules Key Engineering Materials. 2948-2953
Bai JG, Lei TG, Calata JN, et al. (2007) Control of nanosilver sintering attained through organic binder burnout Journal of Materials Research. 22: 3494-3500
Bai JG, Calata JN, Lu G. (2005) Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability Journal of Electronic Packaging. 128: 208-214
Calata JN, Lu G, Chuang T. (2001) Constrained sintering of glass, glass-ceramic and ceramic coatings on metal substrates Surface and Interface Analysis. 31: 673-681
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