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Anand Meled, Ph.D. - Publications

Affiliations: 
2011 Chemical Engineering University of Arizona, Tucson, AZ 
Area:
Chemical Engineering, Materials Science Engineering
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11 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2012 Jiao Y, Zhuang Y, Wei X, Sampurno Y, Meled A, Theng S, Cheng J, Hooper D, Moinpour M, Philipossiana A. Pad wear analysis during interlayer dielectric chemical mechanical planarization Ecs Journal of Solid State Science and Technology. 1. DOI: 10.1149/2.022205Jss  0.732
2011 Jiao Y, Sampurno YA, Zhuang Y, Wei X, Meled A, Philipossian A. Tribological, thermal, and kinetic characterization of 300-mm copper chemical mechanical planarization process Japanese Journal of Applied Physics. 50. DOI: 10.1143/Jjap.50.05Ec02  0.718
2011 Meled A, Zhuang Y, Sampurno YA, Theng S, Jiao Y, Borucki L, Philipossian A. Analysis of a novel slurry injection system in chemical mechanical planarization Japanese Journal of Applied Physics. 50. DOI: 10.1143/Jjap.50.05Ec01  0.707
2010 Meled A, Sampurno Y, Sudargho F, Zhuang Y, Philipossian A. Diamond disc diagnostic method based on "dry" coefficient of friction measurements Electrochemical and Solid-State Letters. 13. DOI: 10.1149/1.3494044  0.641
2010 Sampurno Y, Sudargho F, Meled A, Zhuang Y, Philipossian A. Novel diamond disc diagnostic method based on 'dry' coefficient of friction measurements Ecs Transactions. 27: 645-650. DOI: 10.1149/1.3360688  0.523
2010 Han Z, Zhuang Y, Sampurno Y, Meled A, Jiao Y, Wei X, Cheng J, Moinpour M, Hooper D, Philipossian A. Tribological and kinetic characterization of 300-mm copper chemical mechanical planarization process Ecs Transactions. 27: 587-592. DOI: 10.1149/1.3360679  0.715
2010 Wei X, Sampurno YA, Zhuang Y, Dittler R, Meled A, Cheng J, Wargo C, Stankowski R, Philipossian A. Effect of retaining ring slot design on slurry film thickness during CMP Electrochemical and Solid-State Letters. 13. DOI: 10.1149/1.3294496  0.683
2010 Meled A, Zhuang Y, Wei X, Cheng J, Sampurno YA, Borucki L, Moinpour M, Hooper D, Philipossian A. Analyses of diamond disk substrate wear and diamond microwear in copper chemical mechanical planarization process Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3273077  0.703
2010 Meled A, Sampurno Y, Zhuang Y, Philipossian A. Slurry-induced pad wear rate in chemical mechanical planarization Electrochemical and Solid-State Letters. 13. DOI: 10.1149/1.3271026  0.716
2010 Meled A, Borucki L, Sampurno Y, Zhuang Y, Theng S, Philipossian A. Novel slurry injector device for chemical mechanical planarization Advanced Metallization Conference (Amc). 156-157.  0.555
2008 Wei X, Cheng J, Meled A, Zhuang Y, Borucki L, Moinpour M, Hooper D, Philipossian A. Characterizing diamond disc substrate loss and diamond micro-wear in copper CMP 2008 Proceedings - 13th International Chemical-Mechanical Planarization For Ulsi Multilevel Interconnection Conference, Cmp-Mic 2008. 322-327.  0.525
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