Anand Meled, Ph.D.
Affiliations: | 2011 | Chemical Engineering | University of Arizona, Tucson, AZ |
Area:
Chemical Engineering, Materials Science EngineeringGoogle:
"Anand Meled"Parents
Sign in to add mentor| Ara Philipossian | grad student | 2011 | University of Arizona | |
| (Optimization of polishing kinematics and consumables during chemical mechanical planarization processes.) | ||||
BETA: Related publications
See more...
Publications
|
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
| Jiao Y, Zhuang Y, Wei X, et al. (2012) Pad wear analysis during interlayer dielectric chemical mechanical planarization Ecs Journal of Solid State Science and Technology. 1 |
| Jiao Y, Sampurno YA, Zhuang Y, et al. (2011) Tribological, thermal, and kinetic characterization of 300-mm copper chemical mechanical planarization process Japanese Journal of Applied Physics. 50 |
| Meled A, Zhuang Y, Sampurno YA, et al. (2011) Analysis of a novel slurry injection system in chemical mechanical planarization Japanese Journal of Applied Physics. 50 |
| Meled A, Sampurno Y, Sudargho F, et al. (2010) Diamond disc diagnostic method based on "dry" coefficient of friction measurements Electrochemical and Solid-State Letters. 13 |
| Sampurno Y, Sudargho F, Meled A, et al. (2010) Novel diamond disc diagnostic method based on 'dry' coefficient of friction measurements Ecs Transactions. 27: 645-650 |
| Han Z, Zhuang Y, Sampurno Y, et al. (2010) Tribological and kinetic characterization of 300-mm copper chemical mechanical planarization process Ecs Transactions. 27: 587-592 |
| Wei X, Sampurno YA, Zhuang Y, et al. (2010) Effect of retaining ring slot design on slurry film thickness during CMP Electrochemical and Solid-State Letters. 13 |
| Meled A, Zhuang Y, Wei X, et al. (2010) Analyses of diamond disk substrate wear and diamond microwear in copper chemical mechanical planarization process Journal of the Electrochemical Society. 157 |
| Meled A, Sampurno Y, Zhuang Y, et al. (2010) Slurry-induced pad wear rate in chemical mechanical planarization Electrochemical and Solid-State Letters. 13 |
| Meled A, Borucki L, Sampurno Y, et al. (2010) Novel slurry injector device for chemical mechanical planarization Advanced Metallization Conference (Amc). 156-157 |