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Youbo Lin, Ph.D. - Publications

Affiliations: 
2007 Harvard University, Cambridge, MA, United States 
Area:
Materials Science Engineering
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7 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2010 Lin Y, Tsui TY, Vlassak JJ. Adhesion degradation and water diffusion in nanoporous organosilicate glass thin film stacks Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3267313  0.557
2009 Li H, Lin Y, Tsui TY, Vlassak JJ. The effect of porogen loading on the stiffness and fracture energy of brittle organosilicates Journal of Materials Research. 24: 107-116. DOI: 10.1557/Jmr.2009.0005  0.582
2008 Lin Y, Xiang Y, Tsui TY, Vlassak JJ. PECVD low-permittivity organosilicate glass coatings: Adhesion, fracture and mechanical properties Acta Materialia. 56: 4932-4943. DOI: 10.1016/J.Actamat.2008.06.007  0.576
2007 Li H, Farmer DB, Gordon RG, Lin Y, Vlassak J. Vapor deposition of ruthenium from an amidinate precursor Journal of the Electrochemical Society. 154: D642-D647. DOI: 10.1149/1.2789294  0.513
2007 Lin Y, Tsui TY, Vlassak JJ. Water diffusion and fracture in organosilicate glass film stacks Acta Materialia. 55: 2455-2464. DOI: 10.1016/J.Actamat.2006.11.040  0.579
2006 Lin Y, Tsui TY, Vlassak JJ. Octamethylcyclotetrasiloxane-based, low-permittivity organosilicate coatings Journal of the Electrochemical Society. 153. DOI: 10.1149/1.2202120  0.538
2005 Li Z, Gordon RG, Farmer DB, Lin Y, Vlassak J. Nucleation and adhesion of ALD copper on cobalt adhesion layers and tungsten nitride diffusion barriers Electrochemical and Solid-State Letters. 8: G182-G185. DOI: 10.1149/1.1924929  0.526
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