Babak Arfaei, Ph.D.
Affiliations: | 2010 | Materials Science | State University of New York at Binghamton, Vestal, NY, United States |
Area:
Materials Science EngineeringGoogle:
"Babak Arfaei"Parents
Sign in to add mentor| Eric John Cotts | grad student | 2010 | SUNY Binghamton | |
| (The effects of nucleation and solidification mechanisms on the microstructure and thermomechanical response of tin silver copper solder joints.) | ||||
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Publications
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| Coyle RJ, Sweatman K, Arfaei B. (2017) Erratum to: Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends Jom. 69: 1244-1244 |
| Mutuku F, Arfaei B, Cotts EJ. (2017) The Influence of Processing on Strengthening Mechanisms in Pb-Free Solder Joints Journal of Electronic Materials. 46: 2067-2079 |
| Arfaei B, Mutuku F, Coyle R, et al. (2015) Failure mechanism and microstructural evolution of Pb-free solder alloys in thermal cycling tests: Effect of solder composition and Sn grain morphology Proceedings - Electronic Components and Technology Conference. 2015: 118-126 |
| Cotts E, Arfaei B. (2015) Emerging Interconnects and Pb-free Materials for Advanced Electronic Packaging Jom. 67: 2381-2382 |
| Coyle RJ, Sweatman K, Arfaei B. (2015) Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends Jom. 67: 2394-2415 |
| Mutuku F, Arfaei B, Cotts EJ. (2014) Effect of variation in the reflow profile on the microstructure of near eutectic SnAgCu alloys Proceedings - Electronic Components and Technology Conference. 1769-1775 |
| Arfaei B, Mutuku F, Sweatman K, et al. (2014) Dependence of solder joint reliability on solder volume, Composition and printed circuit board surface finish Proceedings - Electronic Components and Technology Conference. 655-665 |
| Coyle R, Parker R, Arfaei B, et al. (2014) The effect of nickel microalloying on thermal fatigue reliability and microstructure of SAC105 and SAC205 solders Proceedings - Electronic Components and Technology Conference. 425-440 |
| Arfaei B. (2014) Lead-Free Solders: Focus on Fundamentals, Reliability, and Applications Jom. 66: 2309-2310 |
| Obaidat M, Hamasha S, Jaradat Y, et al. (2013) Effects of varying amplitudes on the fatigue life of lead free solder joints Proceedings - Electronic Components and Technology Conference. 1308-1314 |