Yoonjin Won
Affiliations: | Stanford University, Palo Alto, CA |
Area:
heat transfer, phase change, AI for ScienceWebsite:
won.eng.uci.eduGoogle:
"https://scholar.google.com/citations?user=PZ37kkwAAAAJ&hl=en"Bio:
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Publications
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| Pham QN, Zhang S, Hao S, et al. (2020) Boiling Heat Transfer with Well-Ordered Microporous Architecture. Acs Applied Materials & Interfaces |
| Le DV, Pham QN, Lee J, et al. (2019) Evaporative Wicking Phenomena on Nanotextured Surfaces Journal of Electronic Packaging. 141 |
| Lee H, Maitra T, Palko J, et al. (2018) Enhanced Heat Transfer Using Microporous Copper Inverse Opals Journal of Electronic Packaging. 140 |
| Montazeri K, Lee H, Won Y. (2018) Microscopic analysis of thin-film evaporation on spherical pore surfaces International Journal of Heat and Mass Transfer. 122: 59-68 |
| Agonafer DD, Lee H, Vasquez PA, et al. (2017) Porous micropillar structures for retaining low surface tension liquids. Journal of Colloid and Interface Science. 514: 316-327 |
| Palko JW, Lee H, Zhang C, et al. (2017) Extreme Two-Phase Cooling from Laser-Etched Diamond and Conformal, Template-Fabricated Microporous Copper Advanced Functional Materials. 27: 1703265 |
| Lee H, Agonafer DD, Won Y, et al. (2016) Thermal modeling of extreme heat flux microchannel coolers for GaN-on-SiC semiconductor devices Journal of Electronic Packaging, Transactions of the Asme. 138 |
| Palko JW, Lee H, Agonafer DD, et al. (2016) High heat flux two-phase cooling of electronics with integrated diamond/porous copper heat sinks and microfluidic coolant supply Proceedings of the 15th Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2016. 1511-1517 |
| Agonafer DD, Lopez K, Palko JW, et al. (2015) Burst behavior at a capillary tip: Effect of low and high surface tension. Journal of Colloid and Interface Science. 455: 1-5 |
| Lee H, Won Y, Houshmand F, et al. (2015) Computational modeling of extreme heat flux microcooler for GaN-based HEMT Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 2 |