☰

Yoonjin Won - Publications

Affiliations: 
Stanford University, Palo Alto, CA 
Area:
heat transfer, phase change, AI for Science
Website:
won.eng.uci.edu
Tree Info Similar researchers PubMed Report error

33 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Pham QN, Zhang S, Hao S, Montazeri K, Lin CH, Lee J, Mohraz A, Won Y. Boiling Heat Transfer with Well-Ordered Microporous Architecture. Acs Applied Materials & Interfaces. PMID 32239917 DOI: 10.1021/Acsami.0C01113  0.301
2019 Le DV, Pham QN, Lee J, Zhang S, Won Y. Evaporative Wicking Phenomena on Nanotextured Surfaces Journal of Electronic Packaging. 141. DOI: 10.1115/1.4044373  0.346
2018 Lee H, Maitra T, Palko J, Kong D, Zhang C, Barako MT, Won Y, Asheghi M, Goodson KE. Enhanced Heat Transfer Using Microporous Copper Inverse Opals Journal of Electronic Packaging. 140. DOI: 10.1115/1.4040088  0.519
2018 Montazeri K, Lee H, Won Y. Microscopic analysis of thin-film evaporation on spherical pore surfaces International Journal of Heat and Mass Transfer. 122: 59-68. DOI: 10.1016/J.Ijheatmasstransfer.2018.01.002  0.347
2017 Agonafer DD, Lee H, Vasquez PA, Won Y, Jung KW, Lingamneni S, Ma B, Shan L, Shuai S, Du Z, Maitra T, Palko JW, Goodson KE. Porous micropillar structures for retaining low surface tension liquids. Journal of Colloid and Interface Science. 514: 316-327. PMID 29275250 DOI: 10.1016/J.Jcis.2017.12.011  0.457
2017 Palko JW, Lee H, Zhang C, Dusseault TJ, Maitra T, Won Y, Agonafer DD, Moss J, Houshmand F, Rong G, Wilbur JD, Rockosi D, Mykyta I, Resler D, Altman D, et al. Extreme Two-Phase Cooling from Laser-Etched Diamond and Conformal, Template-Fabricated Microporous Copper Advanced Functional Materials. 27: 1703265. DOI: 10.1002/Adfm.201703265  0.535
2016 Lee H, Agonafer DD, Won Y, Houshmand F, Gorle C, Asheghi M, Goodson KE. Thermal modeling of extreme heat flux microchannel coolers for GaN-on-SiC semiconductor devices Journal of Electronic Packaging, Transactions of the Asme. 138. DOI: 10.1115/1.4032655  0.532
2016 Palko JW, Lee H, Agonafer DD, Zhang C, Jung KW, Moss J, Wilbur JD, Dusseault TJ, Barako MT, Houshmand F, Rong G, Maitra T, Gorle C, Won Y, Rockosi D, et al. High heat flux two-phase cooling of electronics with integrated diamond/porous copper heat sinks and microfluidic coolant supply Proceedings of the 15th Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2016. 1511-1517. DOI: 10.1109/ITHERM.2016.7517728  0.333
2015 Agonafer DD, Lopez K, Palko JW, Won Y, Santiago JG, Goodson KE. Burst behavior at a capillary tip: Effect of low and high surface tension. Journal of Colloid and Interface Science. 455: 1-5. PMID 26046980 DOI: 10.1016/J.Jcis.2015.05.033  0.465
2015 Lee H, Won Y, Houshmand F, Gorle C, Asheghi M, Goodson KE. Computational modeling of extreme heat flux microcooler for GaN-based HEMT Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 2. DOI: 10.1115/IPACK2015-48670  0.467
2015 Liu T, Houshmand F, Gorle C, Scholl S, Lee H, Won Y, Asheghi M, Goodson K, Kazemi H, Vanhille K. Full scale simulation of an integrated monolithic heat sink for thermal management of a high power density gan-SiC chip Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 1. DOI: 10.1115/IPACK2015-48592  0.497
2015 Dowling KM, Suria AJ, Won Y, Shankar A, Lee H, Asheghi M, Goodson KE, Senesky DG. Inductive coupled plasma etching of high aspect ratio silicon carbide microchannels for localized cooling Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 3. DOI: 10.1115/IPACK2015-48409  0.411
2015 Scholl S, Gorle C, Houshmand F, Liu T, Lee H, Won Y, Asheghi M, Goodson K, Kazemi H. Numerical simulation of advanced monolithic microcooler designs for high heat flux microelectronics Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 2. DOI: 10.1115/IPACK2015-48122  0.472
2015 Won Y, Cho J, Agonafer D, Asheghi M, Goodson KE. Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2015.2433132  0.527
2015 Won Y, Gao Y, Guzman De Villoria R, Wardle BL, Xiang R, Maruyama S, Kenny TW, Goodson KE. Nonhomogeneous morphology and the elastic modulus of aligned carbon nanotube films Journal of Micromechanics and Microengineering. 25. DOI: 10.1088/0960-1317/25/11/115023  0.5
2014 Barako MT, Gao Y, Won Y, Marconnet AM, Asheghi M, Goodson KE. Reactive metal bonding of carbon nanotube arrays for thermal interface applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1906-1913. DOI: 10.1109/Tcpmt.2014.2369371  0.658
2014 Dusseault TJ, Gires J, Barako MT, Won Y, Agonafer DD, Asheghi M, Santiago JG, Goodson KE. Inverse opals for fluid delivery in electronics cooling systems Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 750-755. DOI: 10.1109/ITHERM.2014.6892356  0.396
2014 Won Y, Barako MT, Agonafer DD, Asheghi M, Goodson KE. Mechanical and thermal properties of copper inverse opals for two-phase convection enhancement Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 326-332. DOI: 10.1109/ITHERM.2014.6892299  0.486
2014 Agonafer DD, Lopez K, Won Y, Palko J, Asheghi M, Santiago JG, Goodson KE. Phase-separation of wetting fluids using nanoporous alumina membranes and micro-glass capillaries Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 306-316. DOI: 10.1109/ITHERM.2014.6892297  0.428
2014 Cho J, Won Y, Francis D, Asheghi M, Goodson KE. Thermal interface resistance measurements for GaN-on-diamond composite substrates Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2014.6978583  0.459
2014 Agonafer DD, Palko J, Won Y, Lopez K, Dusseault T, Gires J, Asheghi M, Santiago JG, Goodson KE. Progress on phase separation microfluidics Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2014.6978575  0.41
2014 Won Y, Houshmand F, Agonafer D, Asheghi M, Goodson KE. Microfluidic heat exchangers for high power density GaN on SiC Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2014.6978568  0.473
2013 Won Y, Gao Y, Panzer MA, Xiang R, Maruyama S, Kenny TW, Cai W, Goodson KE. Zipping, entanglement, and the elastic modulus of aligned single-walled carbon nanotube films. Proceedings of the National Academy of Sciences of the United States of America. 110: 20426-30. PMID 24309375 DOI: 10.1073/Pnas.1312253110  0.536
2013 Lee J, Kodama T, Won Y, Asheghi M, Goodson KE. Impact of annealing on the thermoelectric properties Ge 2Sb2Te5 films Materials Research Society Symposium Proceedings. 1490: 223-228. DOI: 10.1557/Opl.2012.1573  0.489
2013 Won Y, Cho J, Agonafer D, Asheghi M, Goodson KE. Cooling limits for GaN HEMT technology Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2013.6659222  0.41
2012 Lee J, Kodama T, Won Y, Asheghi M, Goodson KE. Thermoelectric characterization of Ge2Sb2Te 5 films for phase-change memory Asme 2012 3rd International Conference On Micro/Nanoscale Heat and Mass Transfer, Mnhmt 2012. 687-693. DOI: 10.1115/MNHMT2012-75092  0.44
2012 Won Y, Gao Y, De Villoria RG, Wardle BL, Kenny TW, Goodson KE. Crust removal and effective modulus of aligned multi-walled carbon nanotube films Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 1070-1076. DOI: 10.1109/ITHERM.2012.6231543  0.457
2012 Lee J, Kodama T, Won Y, Asheghi M, Goodson KE. Phase purity and the thermoelectric properties of Ge 2Sb 2Te 5 films down to 25 nm thickness Journal of Applied Physics. 112. DOI: 10.1063/1.4731252  0.489
2012 Won Y, Lee J, Asheghi M, Kenny TW, Goodson KE. Phase and thickness dependent modulus of Ge 2Sb 2Te 5 films down to 25 nm thickness Applied Physics Letters. 100. DOI: 10.1063/1.3699227  0.477
2012 Gao Y, Kodama T, Won Y, Dogbe S, Pan L, Goodson KE. Impact of nanotube density and alignment on the elastic modulus near the top and base surfaces of aligned multi-walled carbon nanotube films Carbon. 50: 3789-3798. DOI: 10.1016/J.Carbon.2012.04.004  0.501
2012 Won Y, Gao Y, Panzer MA, Dogbe S, Pan L, Kenny TW, Goodson KE. Mechanical characterization of aligned multi-walled carbon nanotube films using microfabricated resonators Carbon. 50: 347-355. DOI: 10.1016/J.Carbon.2011.08.009  0.51
2011 Won Y, Wang EN, Goodson KE, Kenny TW. 3-D visualization of flow in microscale jet impingement systems International Journal of Thermal Sciences. 50: 325-331. DOI: 10.1016/J.Ijthermalsci.2010.08.005  0.586
2010 Won YJ, Lee JH, Wang EN, Goodson KE, Kenny TW. An optimization design for a MEMS fabricated jet impingement cooling device Proceedings of the Asme Interpack Conference 2009, Ipack2009. 1: 491-496. DOI: 10.1115/InterPACK2009-89257  0.556
Show low-probability matches.