| Year |
Citation |
Score |
| 2020 |
Lee CJ, Park JK, Seo HE, Huh J, Chun JH. Fully Differential Touch Screen Controller with Wide Input Dynamic Range for Thin Displays. Sensors (Basel, Switzerland). 20. PMID 32033210 DOI: 10.3390/S20030837 |
0.386 |
|
| 2019 |
Jin X, Kwon K, Choi Y, Chun J. A Dual-loop Phase Locked Loop with Frequency to Voltage Converter Journal of Semiconductor Technology and Science. 19: 292-299. DOI: 10.5573/Jsts.2019.19.3.292 |
0.324 |
|
| 2019 |
Park J, Ko W, Kang D, Lee Y, Chun J. An Output Capacitor-Less Low-Dropout Regulator with 0–100 mA Wide Load Current Range Energies. 12: 211. DOI: 10.3390/En12020211 |
0.327 |
|
| 2019 |
Kim J, Jang W, Lee Y, Kim W, Oh S, Lee J, Choi J, Chun J, Cho TB. Design and Analysis of a 12-b Current-Steering DAC in a 14-nm FinFET Technology for 2G/3G/4G Cellular Applications Ieee Transactions On Circuits and Systems I-Regular Papers. 66: 3723-3732. DOI: 10.1109/Tcsi.2019.2913174 |
0.356 |
|
| 2018 |
Lee CJ, Park JK, Piao C, Seo HE, Choi J, Chun JH. Mutual Capacitive Sensing Touch Screen Controller for Ultrathin Display with Extended Signal Passband Using Negative Capacitance. Sensors (Basel, Switzerland). 18. PMID 30373156 DOI: 10.3390/S18113637 |
0.379 |
|
| 2018 |
Kim SH, Shin H, Jeong Y, Lee JH, Choi J, Chun JH. A 12-Gb/s Stacked Dual-Channel Interface for CMOS Image Sensor Systems. Sensors (Basel, Switzerland). 18. PMID 30126145 DOI: 10.3390/S18082709 |
0.389 |
|
| 2018 |
Saif H, Lee Y, Lee H, Kim M, Khan M, Chun J, Lee Y. A Wide Load Current and Voltage Range Switched Capacitor DC–DC Converter with Load Dependent Configurability for Dynamic Voltage Implementation in Miniature Sensors Energies. 11: 3092. DOI: 10.3390/En11113092 |
0.362 |
|
| 2018 |
Jin J, Kim S, Jin X, Kim S, Chun J. A 12.5-Gb/s Near-Ground Transceiver Employing a MaxEye Algorithm-Based Adaptation Technique Ieee Transactions On Very Large Scale Integration Systems. 26: 522-530. DOI: 10.1109/Tvlsi.2017.2773642 |
0.41 |
|
| 2018 |
Jin J, Jin X, Jung J, Kwon K, Kim J, Chun J. A 0.75–3.0-Gb/s Dual-Mode Temperature-Tolerant Referenceless CDR With a Deadzone-Compensated Frequency Detector Ieee Journal of Solid-State Circuits. 53: 2994-3003. DOI: 10.1109/Jssc.2018.2856243 |
0.363 |
|
| 2018 |
Jung J, Kim I, Kim S, Lee Y, Chun J. A 1.08-nW/kHz 13.2-ppm/°C Self-Biased Timer Using Temperature-Insensitive Resistive Current Ieee Journal of Solid-State Circuits. 53: 2311-2318. DOI: 10.1109/Jssc.2018.2824307 |
0.34 |
|
| 2018 |
Kim S, Kim S, Jin X, Lee Y, Chun J. A 21-Gb/s Dual-Channel Voltage-Mode Transmitter With Stacked NRZ and PAM4 Drivers Ieee Access. 6: 59761-59767. DOI: 10.1109/Access.2018.2874630 |
0.402 |
|
| 2018 |
Seo H, Kim B, Chun J, Kim S, Choi J. CMOS depth sensor with programmable filter circuits for environment-adaptive noise suppression Electronics Letters. 54: 1122-1124. DOI: 10.1049/El.2018.5078 |
0.353 |
|
| 2017 |
Ha J, Park B, Chun J. A 7-MHz Integrated Peak-Current-Mode Buck Regulator With a Charge-Recycling Technique Ieee Transactions On Circuits and Systems Ii-Express Briefs. 64: 797-801. DOI: 10.1109/Tcsii.2016.2608833 |
0.342 |
|
| 2016 |
Kim SY, Jin X, Chun JH, Kwon KW. A digital DLL with 4-cycle lock time and 1/4 NAND-delay accuracy Journal of Semiconductor Technology and Science. 16: 388-394. DOI: 10.5573/Jsts.2016.16.4.387 |
0.352 |
|
| 2016 |
Lee C, Park JK, Kim S, Chun J. A Study on a Lattice Resistance Mesh Model of Display Cathode Electrodes for Capacitive Touch Screen Panel Sensors Procedia Engineering. 168: 884-887. DOI: 10.1016/J.Proeng.2016.11.297 |
0.325 |
|
| 2015 |
Jin X, Bae JH, Chun JH, Kim J, Kwon KW. A 1.25 GHz low power multi-phase PLL using phase interpolation between two complementary clocks Journal of Semiconductor Technology and Science. 15: 594-600. DOI: 10.5573/Jsts.2015.15.6.594 |
0.34 |
|
| 2014 |
Ha J, Park B, Kong B, Chun J. A Fast Response Integrated Current-Sensing Circuit for Peak-Current-Mode Buck Regulator Journal of Semiconductor Technology and Science. 14: 810-817. DOI: 10.5573/Jsts.2014.14.6.810 |
0.315 |
|
| 2014 |
Choi S, Lee M, Jin J, Kwon K, Chun J. Dynamic Slew-Rate Control for High Uniformity and Low Power in LCD Driver ICs Jsts:Journal of Semiconductor Technology and Science. 14: 688-696. DOI: 10.5573/Jsts.2014.14.5.688 |
0.313 |
|
| 2014 |
Jeong Y, Kim H, Kim S, Kwon K, Chun J. An Inductive-coupling Link with a Complementary Switching Transmitter and an Integrating Receiver Journal of Semiconductor Technology and Science. 14: 227-234. DOI: 10.5573/Jsts.2014.14.2.227 |
0.397 |
|
| 2014 |
Kim S, Jin E, Kwon K, Kim J, Chun J. A 6.4-Gb/s Voltage-Mode Near-Ground Receiver With a One-Tap Data and Edge DFE Ieee Transactions On Circuits and Systems Ii-Express Briefs. 61: 438-442. DOI: 10.1109/Tcsii.2014.2320012 |
0.431 |
|
| 2014 |
Kim S, Jeong Y, Lee M, Kwon K, Chun J. A 5.2-Gb/s Low-Swing Voltage-Mode Transmitter With an AC-/DC-Coupled Equalizer and a Voltage Offset Generator Ieee Transactions On Circuits and Systems I: Regular Papers. 61: 213-225. DOI: 10.1109/Tcsi.2013.2262186 |
0.38 |
|
| 2013 |
Jeong J, Bae J, Lee J, Lee CS, Chun J, Kwon K. A Photovoltaic Power Management System using a Luminance-Controlled Oscillator for USN Applications Journal of Semiconductor Technology and Science. 13: 48-57. DOI: 10.5573/Jsts.2013.13.1.048 |
0.302 |
|
| 2013 |
Kang J, Jung W, Kwon K, Chun J. A 12.5-Gb/s Low Power Receiver with Equalizer Adaptation Journal of the Institute of Electronics Engineers of Korea. 50: 71-79. DOI: 10.5573/Ieek.2013.50.12.071 |
0.303 |
|
| 2013 |
Seo S, Chun J, Jun Y, Kwon K. An all-digital PLL with supply insensitive digitally controlled oscillator Ieice Electronics Express. 10: 20120902-20120902. DOI: 10.1587/Elex.10.20120902 |
0.315 |
|
| 2013 |
Kim SY, Baek JM, Seo DJ, Park JK, Chun JH, Kwon KW. Power-efficient fast write and hidden refresh of ReRAM using an ADC-based sense amplifier Ieee Transactions On Circuits and Systems Ii: Express Briefs. 60: 776-780. DOI: 10.1109/Tcsii.2013.2281767 |
0.404 |
|
| 2013 |
Shin WY, Hong GM, Lee H, Han JD, Park KS, Lim DH, Kim S, Shim D, Chun JH, Jeong DK. 4-slot, 8-drop impedance-matched bidirectional multidrop DQ bus with a 4.8-Gb/s memory controller transceiver Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 858-869. DOI: 10.1109/Tcpmt.2012.2231727 |
0.374 |
|
| 2012 |
Lee M, Kim S, Jeong Y, Bae J, Kwon K, Chun J. Low Power 4-Gb/s Receiver for GND-referenced Differential Signaling Journal of the Institute of Electronics Engineers of Korea. 49: 244-250. DOI: 10.5573/Ieek.2012.49.9.244 |
0.424 |
|
| 2012 |
Choi Y, Ko W, Kwon K, Chun J. A Study on the Modeling of a High-Voltage IGBT for SPICE Simulations Journal of the Institute of Electronics Engineers of Korea. 49: 194-200. DOI: 10.5573/Ieek.2012.49.12.194 |
0.388 |
|
| 2012 |
Moon J, Jung W, Kim J, Kwon K, Jun Y, Chun J. (A 2.0-GS/s 5-b Current Mode ADC-Based Receiver with Embedded Channel Equalizer ) Journal of the Institute of Electronics Engineers of Korea. 49: 184-193. DOI: 10.5573/Ieek.2012.49.12.184 |
0.414 |
|
| 2012 |
Lee G, Chun J, Cao S, Beebe SG, Kwon K, Dutton RW. Investigation on the Behavior of Stacked Devices Within Output Drivers Under ESD Conditions Ieee Transactions On Electron Devices. 59: 3313-3320. DOI: 10.1109/Ted.2012.2222888 |
0.368 |
|
| 2012 |
Baek JM, Seo DJ, Chun JH, Kwon KW. A dual charge pump for quiescent touch sensor power supply Ieee Transactions On Circuits and Systems Ii: Express Briefs. 59: 780-784. DOI: 10.1109/Tcsii.2012.2218475 |
0.347 |
|
| 2011 |
Seo S, Chun J, Jun Y, Kim S, Kwon K. A Digitally Controlled Oscillator With Wide Frequency Range and Low Supply Sensitivity Ieee Transactions On Circuits and Systems Ii-Express Briefs. 58: 632-636. DOI: 10.1109/Tcsii.2011.2164146 |
0.348 |
|
| 2011 |
Cao S, Chun J, Salman AA, Beebe SG, Dutton RW. Gate-controlled field-effect diodes and silicon-controlled rectifier for charged-device model ESD protection in advanced SOI technology Microelectronics Reliability. 51: 756-764. DOI: 10.1016/J.Microrel.2010.11.013 |
0.412 |
|
| 2010 |
Cao S, Salman AA, Chun J, Beebe SG, Pelella MM, Dutton RW. Design and Characterization of ESD Protection Devices for High-Speed I/O in Advanced SOI Technology Ieee Transactions On Electron Devices. 57: 644-653. DOI: 10.1109/Ted.2009.2039524 |
0.403 |
|
| 2010 |
Baek JM, Chun JH, Kwon KW. A power-efficient voltage upconverter for embedded EEPROM application Ieee Transactions On Circuits and Systems Ii: Express Briefs. 57: 435-439. DOI: 10.1109/Tcsii.2010.2048351 |
0.404 |
|
| 2010 |
Lee K, Chun J, Kwon K. A low power CMOS compatible embedded EEPROM for passive RFID tag Microelectronics Journal. 41: 662-668. DOI: 10.1016/J.Mejo.2010.06.006 |
0.414 |
|
| 2009 |
Ahn Y, Kim S, Chun J, Kim B. Efficient Scalable Modeling of Double- $\pi$ Equivalent Circuit for On-Chip Spiral Inductors Ieee Transactions On Microwave Theory and Techniques. 57: 2289-2300. DOI: 10.1109/Tmtt.2009.2029026 |
0.37 |
|
| 2009 |
Chen TW, Chun J, Lu Y, Navid R, Wang W, Chen C, Dutton RW. Thermal Modeling and Device Noise Properties of Three-Dimensional–SOI Technology Ieee Transactions On Electron Devices. 56: 656-664. DOI: 10.1109/Ted.2009.2014188 |
0.648 |
|
| 2009 |
Beyene WT, Madden C, Chun JH, Lee H, Frans Y, Leibowitz B, Chang K, Kim N, Wu T, Yip G, Perego R. Advanced modeling and accurate characterization of a 16 Gb/s memory interface Ieee Transactions On Advanced Packaging. 32: 306-327. DOI: 10.1109/Tadvp.2009.2018460 |
0.369 |
|
| 2009 |
Lee H, Chang KYK, Chun JH, Wu T, Frans Y, Leibowitz B, Nguyen N, Chin TJ, Kaviani K, Shen J, Shi X, Beyene WT, Li S, Navid R, Aleksic M, et al. A 16 Gb/s/link, 64 GB/s bidirectional asymmetric memory interface Ieee Journal of Solid-State Circuits. 44: 1235-1247. DOI: 10.1109/Jssc.2009.2014199 |
0.676 |
|
| 2006 |
Chun J, Murmann B. Analysis and Measurement of Signal Distortion due to ESD Protection Circuits Ieee Journal of Solid-State Circuits. 41: 2354-2358. DOI: 10.1109/Jssc.2006.881550 |
0.371 |
|
| 2004 |
Choi C, Chun J, Dutton RW. Electrothermal characteristics of strained-Si MOSFETs in high-current operation Ieee Transactions On Electron Devices. 51: 1928-1931. DOI: 10.1109/Ted.2004.836542 |
0.569 |
|
| Low-probability matches (unlikely to be authored by this person) |
| 2016 |
Choi SP, Kwon KW, Chun JH. A low-power two-line inversion method for driving LCD panels Journal of Semiconductor Technology and Science. 16: 481-487. DOI: 10.5573/Jsts.2016.16.4.481 |
0.3 |
|
| 2013 |
Lee J, Kim S, Jun Y, Kwon K, Chun J. A fully digital clock and data recovery with fast frequency offset acquisition technique for MIPI LLI applications Ieice Electronics Express. 10: 20130178-20130178. DOI: 10.1587/Elex.10.20130178 |
0.287 |
|
| 2015 |
Park JK, Lee C, Kim D, Chun J, Kim JT. Application of weighing matrices to simultaneous driving technique for capacitive touch sensors Ieee Transactions On Consumer Electronics. 61: 261-269. DOI: 10.1109/Tce.2015.7150602 |
0.285 |
|
| 2012 |
Roh J, Kwon K, Chun J. A Study on Accelerated Built-in Self Test for Error Detecting in Multi-Gbps High Speed Interfaces Journal of the Institute of Electronics Engineers of Korea. 49: 226-233. DOI: 10.5573/Ieek.2012.49.12.226 |
0.281 |
|
| 2017 |
Song KH, Choi J, Chun JH. A Method for Enhancing the Sensing Distance of a Fingerprint Sensor. Sensors (Basel, Switzerland). 17. PMID 28991158 DOI: 10.3390/S17102280 |
0.279 |
|
| 2020 |
Jin X, Park W, Kang D, Ko Y, Kwon K, Chun J. A 4-GHz Sub-Harmonically Injection-Locked Phase-Locked Loop With Self-Calibrated Injection Timing and Pulsewidth Ieee Journal of Solid-State Circuits. 1-1. DOI: 10.1109/Jssc.2020.3005806 |
0.273 |
|
| 2009 |
Kim S, Kim S, Jung G, Kwon K, Chun J. Design of a Reliable Broadband I/O Employing T-coil Journal of Semiconductor Technology and Science. 9: 198-204. DOI: 10.5573/Jsts.2009.9.4.198 |
0.27 |
|
| 2014 |
Kim SY, Baek JM, Seo DJ, Park JK, Chun JH, Kwon KW. Reliability analysis and yield enhancement of resistive random access memory with adaptive incremental step pulse programming sizing Japanese Journal of Applied Physics. 53. DOI: 10.7567/Jjap.53.04Ed15 |
0.264 |
|
| 2020 |
Kim D, Lee S, Park D, Piao C, Park J, Ahn Y, Cho K, Shin J, Song SM, Kim S, Chun J, Choi J. Indirect Time-of-Flight CMOS Image Sensor With On-Chip Background Light Cancelling and Pseudo-Four-Tap/Two-Tap Hybrid Imaging for Motion Artifact Suppression Ieee Journal of Solid-State Circuits. 1-1. DOI: 10.1109/Jssc.2020.3021246 |
0.244 |
|
| 2017 |
Um B, Kim J, Kim S, Lee J, Cheon J, Choi J, Chun J. Design and Evaluation of a CMOS Image Sensor with Dual-CDS and Column-parallel SS-ADCs Journal of Semiconductor Technology and Science. 17: 110-119. DOI: 10.5573/Jsts.2017.17.1.110 |
0.241 |
|
| 2014 |
Shin H, Kim S, Kwon K, Chun J. A Receiver for Dual-Channel CIS Interfaces Journal of the Institute of Electronics Engineers of Korea. 51: 87-95. DOI: 10.5573/Ieie.2014.51.10.087 |
0.239 |
|
| 2016 |
Kwon K, Jin J, Chun J. Dual-Mode Reference-less Clock Data Recovery Algorithm Journal of the Institute of Electronics Engineers of Korea. 53: 77-86. DOI: 10.5573/Ieie.2016.53.5.077 |
0.232 |
|
| 2001 |
Saka N, Lai J, Chun J, Sun NP. Mechanisms of the Chemical Mechanical Polishing (CMP) Process in Integrated Circuit Fabrication Cirp Annals. 50: 233-238. DOI: 10.1016/S0007-8506(07)62112-X |
0.177 |
|
| 2017 |
Desai PM, Hogan RC, Brancazio D, Puri V, Jensen KD, Chun JH, Myerson AS, Trout BL. Integrated hot-melt extrusion - injection molding continuous tablet manufacturing platform: Effects of critical process parameters and formulation attributes on product robustness and dimensional stability. International Journal of Pharmaceutics. PMID 28844899 DOI: 10.1016/J.Ijpharm.2017.08.097 |
0.13 |
|
| 1999 |
Rocha JC, Chun J. PRODUCTION OF HIGHLY UNIFORM SOLDER SPHERES USING A DIGITAL INTEGRAL CONTROL SCHEME Atomization and Sprays. 9: 601-621. DOI: 10.1615/ATOMIZSPR.V9.I6.30 |
0.118 |
|
| 2008 |
Chan-Park MB, Yang C, Guo X, Chen L, Yoon SF, Chun JH. Fabrication of 3-D curved microstructures by constrained gas expansion and photopolymerization. Langmuir : the Acs Journal of Surfaces and Colloids. 24: 5492-9. PMID 18442275 DOI: 10.1021/La703608P |
0.117 |
|
| 2006 |
Guo X, Chan-Park MB, Yoon SF, Chun JH, Hua L, Sze NS. UV embossed polymeric chip for protein separation and identification based on capillary isoelectric focusing and MALDI-TOF-MS. Analytical Chemistry. 78: 3249-56. PMID 16689523 DOI: 10.1021/ac051773e |
0.11 |
|
| 1997 |
Chen C, Chun J, Sohlenius G. Development of a Droplet-Based Manufacturing Process for Free-Form Fabrication Cirp Annals. 46: 131-134. DOI: 10.1016/S0007-8506(07)60791-4 |
0.11 |
|
| 2017 |
Puri V, Brancazio D, Desai PM, Jensen KD, Chun JH, Myerson AS, Trout BL. Development of Maltodextrin Based Immediate Release Tablets using an Integrated Twin-Screw Hot Melt Extrusion and Injection Molding Continuous Manufacturing Process. Journal of Pharmaceutical Sciences. PMID 28684263 DOI: 10.1016/J.Xphs.2017.06.020 |
0.108 |
|
| 1997 |
Acquaviva P, Chen C, Chun J, Ando T. Thermal Modeling of Deposit Solidification in Uniform Droplet Spray Forming Journal of Manufacturing Science and Engineering. 119: 332-340. DOI: 10.1115/1.2831111 |
0.106 |
|
| 2010 |
Saha B, Liu E, Tor SB, Khun NW, Hardt DE, Chun JH. Replication performance of Si-N-DLC-coated Si micro-molds in micro-hot-embossing Journal of Micromechanics and Microengineering. 20. DOI: 10.1088/0960-1317/20/4/045007 |
0.105 |
|
| 2014 |
Saha B, Dirckx M, Hardt DE, Tor SB, Liu E, Chun JH. Effect of sputtering power on friction coefficient and surface energy of co-sputtered titanium and molybdenum disulfide coatings and its performance in micro hot-embossing Microsystem Technologies. 20: 1069-1078. DOI: 10.1007/S00542-013-1783-2 |
0.105 |
|
| 2002 |
Lai JY, Saka N, Chun JH. Evolution of copper-oxide damascene structures in chemical mechanical polishing: I. Contact mechanics modeling Journal of the Electrochemical Society. 149. DOI: 10.1149/1.1420707 |
0.097 |
|
| 1998 |
Hytros MM, Chun J, Lanza RC, Saka N. A Solidification Front Monitor for Metal Casting Journal of Manufacturing Science and Engineering. 120: 515-522. DOI: 10.1115/1.2830154 |
0.097 |
|
| 2002 |
Lai JY, Saka N, Chun JH. Evolution of copper-oxide damascene structures in chemical mechanical polishing: II. Copper dishing and oxide erosion Journal of the Electrochemical Society. 149. DOI: 10.1149/1.1420708 |
0.096 |
|
| 2010 |
Saha B, Liu E, Tor SB, Hardt DE, Chun JH, Khun NW. Improvement in lifetime and replication quality of Si micromold using N:DLC:Ni coatings for microfluidic devices Sensors and Actuators, B: Chemical. 150: 174-182. DOI: 10.1016/J.Snb.2010.07.019 |
0.095 |
|
| 1988 |
Lee AK, Sanchez-Caldera LE, Chun J, Suh NP. Material with Novel Compositions and Fine Microstructljres Produced Via the Mixalloy Process Mrs Proceedings. 132. DOI: 10.1557/PROC-132-87 |
0.088 |
|
| 2000 |
Chun J, Rocha JC, Oh J. Synthesis and Analysis of a Digital Droplet-Size Control System Cirp Annals. 49: 143-146. DOI: 10.1016/S0007-8506(07)62915-1 |
0.088 |
|
| 2012 |
Saha B, Tor SB, Liu E, Hardt DE, Chun JH. Titanium-aluminum-polytetrafluoroethylene coated stainless steel micromold via co-sputtering deposition: Replication performance and limitation in hot-embossing Sensors and Actuators, B: Chemical. 163: 290-298. DOI: 10.1016/J.Snb.2011.12.096 |
0.079 |
|
| 2013 |
Kim S, Saka N, Chun J, Shin S. Modeling and mitigation of pad scratching in chemical–mechanical polishing Cirp Annals. 62: 307-310. DOI: 10.1016/J.CIRP.2013.03.069 |
0.076 |
|
| 2019 |
Schrauth AJ, Chun J. Design of High-Ionic Conductivity Electrodes for Direct Methanol Fuel Cells Ecs Transactions. 41: 1333-1343. DOI: 10.1149/1.3635665 |
0.07 |
|
| 2009 |
Hsiao W, Chun J, Saka N. The Effects of Wetting and Surface Roughness on Liquid Metal Droplet Bouncing Journal of Manufacturing Science and Engineering. 131. DOI: 10.1115/1.3090884 |
0.07 |
|
| 2016 |
Peters S, Chun J, Lanza G. Digitalization of automotive industry – scenarios for future manufacturing Manufacturing Review. 3: 1. DOI: 10.1051/MFREVIEW/2015030 |
0.068 |
|
| 2017 |
Desai PM, Puri V, Brancazio D, Halkude BS, Hartman JE, Wahane AV, Martinez AR, Jensen KD, Harinath E, Braatz RD, Chun JH, Trout BL. Tablet coating by injection molding technology - optimization of coating formulation attributes and coating process parameters. European Journal of Pharmaceutics and Biopharmaceutics : Official Journal of Arbeitsgemeinschaft Fur Pharmazeutische Verfahrenstechnik E.V. PMID 29024728 DOI: 10.1016/J.Ejpb.2017.10.006 |
0.066 |
|
| 2011 |
Saha B, Tor SB, Liu E, Hardt DE, Chun JH. Hot-embossing performance of silicon micromold coated with self-assembled n-octadecyltrichlorosilane Sensors and Actuators, B: Chemical. 160: 207-214. DOI: 10.1016/J.Snb.2011.07.036 |
0.064 |
|
| 1993 |
Chun J, Passow CH, Suh NP. Droplet-Based Manufacturing Cirp Annals. 42: 235-238. DOI: 10.1016/S0007-8506(07)62433-0 |
0.063 |
|
| 2018 |
Rui Z, Cui K, Wang X, Chun J, Li Y, Zhang Z, Lu J, Chen G, Zhou X, Patil S. A comprehensive investigation on performance of oil and gas development in Nigeria: Technical and non-technical analyses Energy. 158: 666-680. DOI: 10.1016/J.Energy.2018.06.027 |
0.062 |
|
| 2017 |
Puri V, Brancazio D, Harinath E, Martinez AR, Desai PM, Jensen KD, Chun JH, Braatz RD, Myerson AS, Trout BL. Demonstration of Pharmaceutical Tablet Coating Process by Injection Molding Technology. International Journal of Pharmaceutics. PMID 29113803 DOI: 10.1016/J.Ijpharm.2017.10.062 |
0.062 |
|
| 2009 |
Saha B, Liu E, Tor SB, Khun NW, Hardt DE, Chun JH. Anti-sticking behavior of DLC-coated silicon micro-molds Journal of Micromechanics and Microengineering. 19. DOI: 10.1088/0960-1317/19/10/105025 |
0.061 |
|
| 2011 |
Saha B, Liu E, Tor SB, Hardt DE, Chun JH. Modification of surface properties of silicon micro-molds by nitrogen and silicon doped diamond-like carbon coatings deposited with magnetron co-sputtering Vacuum. 85: 1105-1107. DOI: 10.1016/J.Vacuum.2010.12.030 |
0.057 |
|
| 1993 |
Nowak T, Chun J. Optical Measurement of Preform Impregnation in Resin Transfer Molding Mrs Proceedings. 305. DOI: 10.1557/PROC-305-241 |
0.056 |
|
| 2011 |
Weiler S, Páez D, Chun JH, Graves SC, Lanza G. Supply chain design for the global expansion of manufacturing capacity in emerging markets Cirp Journal of Manufacturing Science and Technology. 4: 265-280. DOI: 10.1016/j.cirpj.2011.06.012 |
0.055 |
|
| 1985 |
Chun J, Sonin AA. Small-scale simulation of vapor discharges into subcooled liquid pools Nuclear Engineering and Design. 85: 353-362. DOI: 10.1016/0029-5493(85)90234-1 |
0.055 |
|
| 1996 |
Chen C, Acquaviva P, Chun J, Ando T. Effects of droplet thermal state on deposit microstructure in spray forming Scripta Materialia. 34: 689-696. DOI: 10.1016/1359-6462(95)00583-8 |
0.055 |
|
| 2019 |
Eusner T, Saka N, Chun J, Armini S, Moinpour M, Fischer P. Controlling Scratching in Cu Chemical-Mechanical Planarization (CuCMP) Ecs Transactions. 16: 15-27. DOI: 10.1149/1.3114548 |
0.049 |
|
| 2009 |
Eusner T, Saka N, Chun J, Armini S, Moinpour M, Fischer P. Controlling Scratching in Cu Chemical Mechanical Planarization Journal of the Electrochemical Society. 156: H528. DOI: 10.1149/1.3121964 |
0.049 |
|
| 1999 |
Chun J, Hytros MM, Jureidini IM, Saka N, Lanza RC, Suh NP. A Non-Invasive Solidification Sensor for Metal Casting Cirp Annals. 48: 147-150. DOI: 10.1016/S0007-8506(07)63152-7 |
0.045 |
|
| 2010 |
Eusner T, Saka N, Chun JH. Tribological defects in planar nanomanufacturing processes International Journal of Nanomanufacturing. 6: 22. DOI: 10.1504/IJNM.2010.034769 |
0.045 |
|
| 2006 |
Hsiao W, Chun J, Saka N. Effect of Surface Roughness on Droplet Bouncing in Droplet-Based Manufacturing Processes Cirp Annals. 55: 209-212. DOI: 10.1016/S0007-8506(07)60400-4 |
0.044 |
|
| 2010 |
Saka N, Eusner T, Chun J. Scratching by pad asperities in chemical–mechanical polishing Cirp Annals. 59: 329-332. DOI: 10.1016/J.CIRP.2010.03.113 |
0.043 |
|
| 2014 |
Kim S, Saka N, Chun J. The Effect of Pad-asperity Curvature on Material Removal Rate in Chemical-mechanical Polishing Procedia Cirp. 14: 42-47. DOI: 10.1016/J.PROCIR.2014.03.014 |
0.042 |
|
| 2020 |
Susskind L, Chun J, Goldberg S, Gordon JA, Smith G, Zaerpoor Y. Breaking Out of Carbon Lock-In: Malaysia’s Path to Decarbonization Frontiers in Built Environment. 6. DOI: 10.3389/Fbuil.2020.00021 |
0.042 |
|
| 1992 |
Nowak T, Chun J. Three-dimensional measurement of preform impregnation in composites manufacturing Composites Manufacturing. 3: 259-271. DOI: 10.1016/0956-7143(92)90113-9 |
0.037 |
|
| 2015 |
Kim S, Saka N, Chun JH. Scratching of patterned Cu/dielectric surface layers by pad asperities in CMP Ieee Transactions On Semiconductor Manufacturing. 28: 96-105. DOI: 10.1109/TSM.2014.2375672 |
0.036 |
|
| 2013 |
Kim S, Saka N, Chun J. Scratching of Patterned Composite Surfaces by Pad Asperities in Chemical-Mechanical Polishing Ecs Transactions. 50: 35-49. DOI: 10.1149/05039.0035ecst |
0.031 |
|
| 2014 |
Kim S, Saka N, Chun J. The Role of Pad Topography in Chemical-Mechanical Polishing Ieee Transactions On Semiconductor Manufacturing. 27: 431-442. DOI: 10.1109/TSM.2014.2335156 |
0.03 |
|
| 2014 |
Kim S, Saka N, Chun J. Pad Scratching in Chemical-Mechanical Polishing: The Effects of Mechanical and Tribological Properties Ecs Journal of Solid State Science and Technology. 3: P169-P178. DOI: 10.1149/2.027405jss |
0.03 |
|
| 1983 |
Salcudean M, Chun J, Groeneveld D. Effect of flow obstructions on the flow pattern transitions in horizontal two-phase flow International Journal of Multiphase Flow. 9: 87-90. DOI: 10.1016/0301-9322(83)90008-3 |
0.029 |
|
| 2004 |
Noh K, Saka N, Chun J. Effect of Slurry Selectivity on Dielectric Erosion and Copper Dishing in Copper Chemical-Mechanical Polishing Cirp Annals. 53: 463-466. DOI: 10.1016/S0007-8506(07)60740-9 |
0.028 |
|
| 1995 |
Chun J, Lanza RC, Saka N, Hytros MM, Suh NP. Online Monitoring of the Solidification Front in Metal Casting Cirp Annals. 44: 181-184. DOI: 10.1016/S0007-8506(07)62302-6 |
0.028 |
|
| 2019 |
Eusner T, Saka N, Chun J. Breaking-In a Pad for Scratch-Free, Cu Chemical-Mechanical Polishing (CuCMP) Ecs Transactions. 33: 115-136. DOI: 10.1149/1.3489052 |
0.027 |
|
| 2011 |
Eusner T, Saka N, Chun J. Breaking-In a Pad for Scratch-Free, Cu Chemical-Mechanical Polishing Journal of the Electrochemical Society. 158: H379. DOI: 10.1149/1.3545066 |
0.027 |
|
| 2000 |
Kim H, Feng ZC, Chun J. Instability of a liquid jet emerging from a droplet upon collision with a solid surface Physics of Fluids. 12: 531-541. DOI: 10.1063/1.870259 |
0.025 |
|
| 2003 |
Chun J, Hsiao W. Effects of Surface Roughness on Solder Bump Formation by Direct Droplet Deposition Cirp Annals. 52: 161-164. DOI: 10.1016/S0007-8506(07)60555-1 |
0.022 |
|
| 2001 |
Kim H, Chun J. The recoiling of liquid droplets upon collision with solid surfaces Physics of Fluids. 13: 643-659. DOI: 10.1063/1.1344183 |
0.021 |
|
| 2019 |
Kim S, Saka N, Chun J. The Effects of Mechanical and Tribological Properties of Coatings on Scratch Generation in Chemical-Mechanical Polishing Ecs Transactions. 41: 393-404. DOI: 10.1149/1.3633320 |
0.02 |
|
| 1993 |
Passow CH, Chun J, Ando T. Spray deposition of a Sn-40 Wt Pct Pb alloy with uniform droplets Metallurgical Transactions A. 24: 1187-1193. DOI: 10.1007/BF02657250 |
0.015 |
|
| 2004 |
Kim H, Karahalios T, Qiu T, Chun J. Microsensor for impact of molten metal microdrops Sensors and Actuators a: Physical. 116: 417-423. DOI: 10.1016/J.SNA.2004.05.022 |
0.015 |
|
| 1999 |
Hytros MM, Jureidini IM, Chun J, Lanza RC, Saka N. High-energy X-ray computed tomography of the progression of the solidification front in pure aluminum Metallurgical and Materials Transactions A. 30: 1403-1409. DOI: 10.1007/S11661-999-0288-1 |
0.014 |
|
| 2008 |
Saka N, Eusner T, Chun J. Nano-scale scratching in chemical–mechanical polishing Cirp Annals. 57: 341-344. DOI: 10.1016/J.CIRP.2008.03.098 |
0.013 |
|
| 1983 |
Salcudean M, Chun J, Groeneveld D. Effect of flow obstruction on void distribution in horizontal air-water flow International Journal of Multiphase Flow. 9: 91-96. DOI: 10.1016/0301-9322(83)90009-5 |
0.012 |
|
| 2020 |
Knox‐Hayes J, Chandra S, Chun J. The role of values in shaping sustainable development perspectives and outcomes: A case study of Iceland Sustainable Development. 29: 363-377. DOI: 10.1002/sd.2152 |
0.011 |
|
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